News & Updates
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The Role of Automation & Robotics in Wire Harness Assembly
Our new article highlights how automation and robotics are transforming wire harness assembly, improving efficiency, precision, and cost-effectiveness. Technologies like robotic wire handling and AI-driven testing are paving the way for smarter production. However, challenges like custom designs and high costs still persist.
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Best Practices for Electronics Project Management - Part 1
Check out the first part of "Best Practices for Electronics Project Management" by Rafał Stępień. It offers valuable advice on enhancing team communication and documentation in hardware design projects.
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Wiring for the Final Frontier: A Guide to Space-Grade Harness Design
Wiring harnesses are mission-critical in space systems, requiring strict adherence to ECSS-Q-ST-70-61C and NASA-STD-8739.4A. In "Wiring for the Final Frontier: A Guide to Space-Grade Harness Design", Kamil Jasiński explores key design principles, material selection, and testing to ensure reliability in extreme environments.
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The Future of Wire Harnesses in the Electric Vehicle and Electronics Era
Discover how wire harnesses are evolving to meet the demands of electric vehicles and modern electronics. Our latest article explores key trends like higher voltages, lightweight designs, and smart harnesses, along with challenges such as cost and supply chain issues.
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Mastering EMI Control in PCB Design: Decoupling Strategies for PDN
Dario Fresu explores effective decoupling strategies for power distribution networks (PDNs) to minimize EMI in PCB designs. The article covers techniques like decoupling capacitors and power planes to ensure stable power delivery for integrated circuits.
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Building Your Own Android Device with a Raspberry Pi
Learn how to turn a Raspberry Pi into a custom Android device. This guide covers hardware selection, software setup, and troubleshooting common issues.
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How PCB Design Engineers Can Securely Share Design Files with External Teams
Learn how PCB design engineers can securely share design files with team members, clients, and manufacturers. Marek Orzeł explores best practices and tools to protect your intellectual property while ensuring efficient collaboration.
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OEMs and Harness Manufacturers: Building Strong Collaboration for Success
Strong partnerships between OEMs and harness manufacturers are key to efficient, high-quality product development. In this article, Krishna Sundaram shows how collaboration, clear communication, and the right design tools can streamline the harness manufacturing process and drive success.
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Ideal Rectifier Bridge
Read Marcin Lewandowski's article explaining how MOSFETs are replacing traditional diodes for reverse polarity protection. Step into the future of energy-efficient electronics!
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Master Your Circuit Design: Dive into Worst Case Analysis
Dive into Worst Case Analysis techniques with Kamil Jasiński and ensure the reliability of your circuits. Master sensitivity analysis, Monte Carlo simulations, and more to confidently address real-world challenges.
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Overview of the Gerber X3 File Format
Want to learn how the Gerber X3 file format simplifies data exchange by unifying assembly and fabrication details in a single file? This article explores the format and its role in streamlining PCB manufacturing.
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Analog Solar Tracker Project
In this article you can learn about light sensors while building an analog solar panel tracking system. This open-source project covers multi-channel design, window comparators, driving motors, and photosensors.
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Concept Phase – Initial CAD Design
We are continuing our journey through the open-source laptop project. This article explains an initialization of CAD design process from the early concept and brainstorming phase.
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Expert Tips for Safely Powering Up Your New PCB for the First Time
In this blog we will show you the strategies to minimize the risk of damage to circuit boards during the initial power-up process.
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High-Speed PCB Design Tips
Essential tips for high-speed PCB designs, and when you need to start being concerned about how and where you route your traces.
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MIDs Make a Comeback as Vertical SMD Modules for Your PCB
If you've ever wanted to mount components vertically, but without the expense of a flex section this article is for you. You can use an MID in your PCB.
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Everything You Need to Know about Conformal Coating
Explore the basics of conformal coating with us. Conformal coating is a protective layer applied to electronic circuits to guard against environmental factors such as moisture and dust.
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Introduction to Open Source Laptop Project
We have started a very exciting journey into the creation of an open source laptop project. This project will be an ongoing one, with our community able interactively participate. By utilizing Altium 365 users will be able to view, comment on, and download design files. This will be a great learning experience for new and experienced PCB designers.
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Mechanical and Electrical Design Come Together With Altium’s MCAD CoDesigner
Electronics designers working in small design houses or in large enterprises often encounter a common set of challenges when interfacing with mechanical designers. Continue reading to learn how you can best interface with your mechanical designer to get your projects out the door fast!
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Ebook: Routing High-Density Interconnects with Reliable Microvias
HDI PCBs take a particular approach to routing interconnects through multiple layers to ensure reliability during fabrication, assembly, and operation. The critical structure that enables this is microvias, which are prone to failure if not designed properly. In this e-book, readers will receive an initial look at the reasons microvia reliability has come into the spotlight and why HDI PCB designers put reliability first when routing through microvias.
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IPC-2221 Calculator for PCB Trace Current and Heating
Aside from impedance and annular ring calculations, one of the other major formulas specified in the IPC 2221 standard relates temperature rise, trace width, and trace current. THere is also the IPC-2152 standard, both include this guidance on designing for thermal reliability, but which standard should we use?
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Stripline Impedance Calculator
Striplines provide some advantages over microstrips as they take advantage of natural shielding and coupling from nearby ground plane layers. Although they tend to experience higher losses due to total confinement in the dielectric, they can be thinner due to the high dielectric constant used in internal layers of a PCB. Use our free impedence calculator to help you determine the correct width needed to hit a target impedance.
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Which Types of Opto-Isolators Are Right For Your Signal?
An optoisolator is a cool electronic device that can be used to pass information between a diode without passing an electrical current. There are many great applications for these, but do you know which one is right for you?
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Properties panel document options in SCH editors
The Properties panel provides access to the properties of documents and objects. The contents of the panel change depending on the active document or the selected object. This blog will quickly go over some of need to know options around the properties panel in the schematic document.
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The High-Speed PCB Stackup Design Challenge
Even with all the good guidelines out there for high speed design, there are particular aspects of stackup construction and their relation to building boards that get overlooked. This blog is goes beyond just the typical SI/PI guidelines and looks at these problems from more of an engineering perspective.
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Everything You Need to Know About Stitching Vias
Stitching vias are something you often see spread around the surface layer of a PCB, but what are they? and should you be using them? In this guide, we'll go over some of the standard uses of stitching vias and when they should be used in a PCB.
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PCB Stackup Basics
In comparison to the build-up of a PCB, the stackup is more concerned with the electrical type of each layer, that is are we working with signals, power, or ground. Continue reading to learn how you can optimize your layer stack.
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