News & Updates

Harness Design in Altium Designer simplifies managing PCB interconnections, ensuring reliable performance and streamlined manufacturing. With logical connectivity tools, harness layout drawing, and manufacturing-ready documentation, it keeps your designs efficient and organized—all within a unified design environment. Perfect for automotive, aerospace, and industrial applications.

Our new article guides you through enhancing your Raspberry Pi 5's performance by setting up NVMe SSD storage using an expansion HAT. It covers the benefits over traditional MicroSD cards, including improved speed and reliability, and provides step-by-step instructions for installation and configuration.

Human error is a leading cause of cybersecurity breaches—even in electrical engineering. Our article explores how everyday design and collaboration habits can create vulnerabilities, and what engineers can do to build safer, more secure workflows.

Discover how modern wire harness engineering is evolving to meet the growing complexity of electrified systems. This whitepaper explores best practices, intelligent automation, and ECAD-MCAD collaboration to improve efficiency and reduce errors. Download now to stay ahead in an increasingly connected world.

Ultra-HDI technology is transforming RF design by enabling finer line widths, improved signal integrity, and more compact, high-performance boards. Our brand-new article explores its advantages over traditional methods and the benefits of integrating flexible circuits.

Testpoints are essential for efficient PCBA testing and debugging. Our latest whitepaper dives into testpoint optimization, fault detection, and automated testing strategies, along with a full tutorial on using Testpoint Manager in Altium Designer. Discover how to streamline your testpoint assignments and improve measurement accuracy!

Krishna Sundaram explores the hidden challenges of cable harness design, from routing complexity to mechanical constraints and manufacturability. Learn how to design a robust and efficient harness.

Ultra-HDI technology is transforming PCB design, enabling unprecedented miniaturization and performance. In this article, explore what sets Ultra-HDI apart from traditional HDI and how it’s shaping the future of electronics.

This article addresses common misconceptions about cloud security in PCB design. It explains how modern cloud platforms, such as Altium 365, often provide superior security compared to traditional on-premises solutions. Key features like advanced infrastructure, granular access controls, and compliance with stringent regulations ensure the protection of valuable design data.

Last week, Renesas Electronics and Altium proudly announced the introduction of Renesas 365, Powered by Altium—a first-of-its-kind industry solution designed to streamline electronic system development, from silicon selection to system lifecycle management. Renesas 365 will be demonstrated at Embedded World, Booth 5-371, from March 11-13 in Nuremberg, Germany.

Learn how integrating DFM and DFA principles into systems engineering ensures manufacturable, cost-effective PCB designs by optimizing CAD, CAM, and requirements management in our new article by Javier Alcina.

Optimizing multiboard PCB systems demands visibility across logical, physical, and manufacturing domains. This article outlines how Altium’s environment lets engineers establish system‑level schematics, 3D spatial validation, harness documentation, and synchronized outputs to streamline design and production.

If you’ve ever been frustrated by clunky PCB-to-mechanical workflows, you’re not alone. Learn why collaboration between mechanical and electrical engineers is harder than it should be and what’s behind the struggle.

Eliminate costly mismatches and assembly delays. This whitepaper shows you how to apply a unified digital thread across PCB, multi-board, and harness workflows - bridging ECAD/MCAD silos, ensuring connector accuracy, mechanical fit, and real-time collaboration for flawless system design.

This guide walks you through creating an MCP server that turns AI interactions with Arduino into a predictable, automated process handling tasks like board listing, compilation, and serial communication via a fast, menu‑driven interface. Skip the guesswork of prompt nudging and reduce the risk of unintended device issues.

Our brand-new article explains how zero-voltage switching improves performance in DC/DC converters through reduced losses, lower EMI, and smarter gate-drive control.

Take your first steps into mixed-signal design with the Renesas GreenPAK Introduction Kit. Ari Mahpour shows how to design, simulate, and validate a clock divider project, making it easy for beginners to start experimenting with programmable mixed-signal devices.

Targeted at procurement professionals in the automotive industry, the article outlines the evolving pressures of sourcing components for electrified and connected vehicles. It highlights Octopart’s ecosystem as a unified tool that centralizes availability, compliance, pricing, and lifecycle intelligence to optimize sourcing efficiency.

"Stack‑Up to Success" highlights how a carefully planned PCB stack‑up is foundational to preventing warpage, managing impedance, and avoiding manufacturing delays by clearly communicating layer construction, materials, and tolerance requirements to fabricators.

Gain a clear understanding of the fundamental elements within integrated circuits. This guide examines their structure, function, and role in system performance, knowledge that’s vital for anyone involved in sourcing or developing electronic designs.

Misaligned connectors can cause major issues in multi-board assemblies. In this article, David Marrakchi shows how Altium’s 3D tools help detect and fix alignment problems early in the design process.

Dive into the power of Renesas’ RA8D1 MCU using the EK‑RA8D1 evaluation kit. Learn how to train, test, and deploy image‑based detection models seamlessly with Edge Impulse, and kickstart your embedded vision AI projects in minutes.

Originally built for software development, Jira has become a popular tool for agile project management across various industries. Our new article explores how hardware teams can leverage core Jira features and adapt agile principles to suit the unique needs of hardware development.

Discover why top electronics companies are replacing spreadsheets with purpose-built BOM management solutions. This whitepaper outlines the risks of outdated methods, offers a readiness checklist, and explores how BOM Portal helps teams cut costs, reduce risk, and speed up development with smarter, data-driven workflows.

Material and process choices play a key role in high-performance PCB design. This article highlights how stack-up configuration, substrate selection, and lamination strategy impact signal integrity, reliability, and manufacturability.

Designing for inspection is key to reliable manufacturing. This article covers practical PCB layout tips to optimize your board for AOI and X-ray inspection helping you reduce defects, false positives, and production delays.

Read our brand-new article where we explore the key areas of an engineering project and the different stages of electronic product development from a project execution perspective. From initiation and planning to design, development, validation, testing, and certification, we walk you through each phase to help you understand how successful electronic products are brought to life.