News & Updates

Discover our latest video and learn how RF designers use a deeper ground plane to minimize skin-effect resistance, improve signal integrity over long high-frequency routes, and optimize impedance matching for oversized SMT pads in antenna launches and coaxial connectors.

ODB++ Intellectual Property Protection lets you control exactly what design data is included in the ODB++ output, ensuring each manufacturing partner receives only the information needed for their specific fabrication or assembly tasks.

See the highlights from Altium's executive event in Hamburg, where Security and Aerospace leaders explored AI-driven development, digital engineering, supply chain resilience, and the future of mission-critical electronics.

Setting up clearance rules is now more intuitive in the Constraint Manager. Choose the Simple view for faster configuration with grouped object types, or the Advanced view when you need detailed, matrix-based clearance control.

In our latest Altium Academy tutorial, we guide you through configuring the essential HDI PCB design rules in Altium's software. You'll learn how to use your manufacturer's fabrication capabilities to create accurate design rules and constraints for your PCB.

The Web Viewer now features a redesigned search experience for faster access to PCB design data across supported CAD formats. A lightweight, intuitive interface lets you begin with simple search terms and progressively refine results using contextual suggestions.

New bond wire visibility controls give you greater flexibility when working with wire-bonded boards and footprints, making it easier to focus on the details that matter most.

Selectable Harness Source Within Multi-board Design enables harness projects to drive system connectivity while maintaining bidirectional synchronization between multi-board schematics and harness wiring diagrams for improved accuracy and easier design management.

The PCB Editor now lets you choose the Simbeor version used for delay and impedance calculations, giving you more flexibility and consistency across your design workflows.

The PCB Editor now uses via instancing to generate geometry for each via individually, providing greater flexibility and a more advanced approach to managing vias in PCB designs.

A ground-signal-signal-ground (GSSG) stackup rethinks the traditional four-layer PCB structure by moving the ground planes to the outer layers and routing signals on the two inner layers. In this Altium Academy deep dive, we review a real one-minute design review submission and demonstrate how to configure a GSSG stackup properly using the Layer Stack Manager.

The IPC Compliant Footprint Wizard has been updated to improve IPC-7351B compliance across supported package types. Enhancements include footprint calculations, package outlines, silkscreen and courtyard generation, layer mapping, density table behavior, and new pad trimming controls for gullwing packages, with support added to the batch generator Excel template.

Component templates in a connected Workspace on the Altium Platform now include support for Temperature Coefficient (ppm/°C) as a unit-aware user parameter type. This makes it possible to define temperature coefficient values directly within the template using the appropriate units.

Check out our new video covering essential electronics fundamentals, with a focus on why including part numbers for SMD passive components, such as SMD resistors, directly on schematics is so important. We also explore whether relying only on the Bill of Materials (BOM) is enough for effective electronic component management.

Harness Draftsman now supports splitting connection tables across multiple pages in *.HarDwf documents. With the new page height limit setting, you can easily control how much of the table appears on each page.

Discover how the future of automotive electronics is being shaped by a more connected development approach that unifies teams, data, requirements, design, collaboration, and manufacturing. Recorded at BMW Welt and the BMW Museum during Altium’s "The Future of Electronics Development in Automotive" event, this video explores the key challenges and innovations driving the next generation of automotive design.