News & Updates
Anyone who has taken apart an old cell phone or designs IoT devices knows multiple communication capabilities are present in these designs, each requiring different antennas. The RF designer should already take precautions for interconnect isolation, but antenna isolation is just as important when modeling and designing wireless systems.
High voltage/high current designs carry safety requirements which need to be met by designers. Similarly, high speed designs need to have suppressed crosstalk in order to ensure signal integrity. The key design aspects that relate to both areas are your PCB trace clearance and pad clearance values. These design choices are critical for balancing safety, noise suppression, and manufacturability.
In this article, we’ll discuss the key design features to implement, and steps to take prior to fabrication that will help prevent some DFM process pain.
With the new layer stack manager in Altium Designer®, you can now include copper foil roughness factors directly in your impedance calculator. This is quite easy to do in the layer stack manager, but it begs the question: what exactly is the copper roughness factor? Which value should be used for your interconnects?
After you capture your schematic as an initial layout and create an initial component arrangement, it’s time to define your routing constraints. Doing this early will allow your DRC engine to spot rules violations before you finish your layout. Likewise, you’ll be able to modify the default rule set to meet your layout requirements. Here are the important routing constraints you’ll need to check before you start routing your board.
Learn how to place components from the MCAD side and synchronize them with Altium Designer ECAD models, designators, and sourcing data to simplify your design process.
Some manufacturers have very convenient PCB manufacturing cost estimation calculators you can use, but the real costs depend on a number of factors. If you’re an entrepreneur and you’re producing your own boards, or you are managing manufacturing, testing, and delivery for a new project, it’s your job to help clients understand the primary cost drivers for new boards. Here’s how you can get an estimate of your fabrication costs, both for local and overseas manufacturers.
Selecting a connector is as much an art as it is a science. The artistic side is all about aesthetics and satisfying clearances, while the scientific side is all about signal integrity. For PCB mountable connectors, you’ll need to choose between surface-mounted or through-hole connectors, and you’ll need to consider how each type affects signal integrity in your application. Here’s what you need to think about beyond the standard connector specifications.
Trace and via current-carrying capacity are legitimate design points to focus on when designing a new board that will carry high current. The goal is to keep conductor temperatures below some appropriate limit, which then helps keep components on the board cool.
There is a saying in copper pour PCB design, “Copper is free.” It means a PCB editor designer must think in reverse. A board starts off as solid copper, and the copper you don’t want is removed. It is faster to build, less consumptive, and less expensive to make a board that is mostly copper as compared to the same size board that is mostly bare. Picking the correct technique will make the difference between an effortless or frustrating experience.
What’s the key to designing a board that’s realistic on paper and in physical form? Let’s explore the top 5 design guidelines that you need to know to design your next manufacturable, functional and reliable PCB.
Highlighting nets will help you simplify your schematic and PCB design. In Altium , there are multiple options that enable you to leverage this capability to simplify the verification of connections and circuit paths and make sure that the design you send to your manufacturer accurately reflects the printed circuit board you need built.
The grid system in a printed circuit board design CAD system really is your friend, and if you haven’t taken the time to get properly introduced yet let me help you with that.
Whether you have a slew of PCBs to mass produce for your customers or a handful of project boards you wish to prototype all in one simple swoop, panelization is an effective way to bring high amounts of efficiency to your production.
We are continuing our journey through the open-source laptop project. This article explains an initialization of CAD design process from the early concept and brainstorming phase.
In this blog we will show you the strategies to minimize the risk of damage to circuit boards during the initial power-up process.
Essential tips for high-speed PCB designs, and when you need to start being concerned about how and where you route your traces.
If you've ever wanted to mount components vertically, but without the expense of a flex section this article is for you. You can use an MID in your PCB.
Explore the basics of conformal coating with us. Conformal coating is a protective layer applied to electronic circuits to guard against environmental factors such as moisture and dust.
We have started a very exciting journey into the creation of an open source laptop project. This project will be an ongoing one, with our community able interactively participate. By utilizing Altium 365 users will be able to view, comment on, and download design files. This will be a great learning experience for new and experienced PCB designers.
Electronics designers working in small design houses or in large enterprises often encounter a common set of challenges when interfacing with mechanical designers. Continue reading to learn how you can best interface with your mechanical designer to get your projects out the door fast!
HDI PCBs take a particular approach to routing interconnects through multiple layers to ensure reliability during fabrication, assembly, and operation. The critical structure that enables this is microvias, which are prone to failure if not designed properly. In this e-book, readers will receive an initial look at the reasons microvia reliability has come into the spotlight and why HDI PCB designers put reliability first when routing through microvias.
Aside from impedance and annular ring calculations, one of the other major formulas specified in the IPC 2221 standard relates temperature rise, trace width, and trace current. THere is also the IPC-2152 standard, both include this guidance on designing for thermal reliability, but which standard should we use?
Striplines provide some advantages over microstrips as they take advantage of natural shielding and coupling from nearby ground plane layers. Although they tend to experience higher losses due to total confinement in the dielectric, they can be thinner due to the high dielectric constant used in internal layers of a PCB. Use our free impedence calculator to help you determine the correct width needed to hit a target impedance.
An optoisolator is a cool electronic device that can be used to pass information between a diode without passing an electrical current. There are many great applications for these, but do you know which one is right for you?
The Properties panel provides access to the properties of documents and objects. The contents of the panel change depending on the active document or the selected object. This blog will quickly go over some of need to know options around the properties panel in the schematic document.
Even with all the good guidelines out there for high speed design, there are particular aspects of stackup construction and their relation to building boards that get overlooked. This blog is goes beyond just the typical SI/PI guidelines and looks at these problems from more of an engineering perspective.
Stitching vias are something you often see spread around the surface layer of a PCB, but what are they? and should you be using them? In this guide, we'll go over some of the standard uses of stitching vias and when they should be used in a PCB.
In comparison to the build-up of a PCB, the stackup is more concerned with the electrical type of each layer, that is are we working with signals, power, or ground. Continue reading to learn how you can optimize your layer stack.
Altium’s VP of marketing Lawrence Romine discusses the multi-board and harness design capabilities coming in Altium Designer 23.