News & Updates
Designing high-speed channels on complex boards requires simulations, measurements on test boards, or both to ensure the design operates as you intend. Gibbs ringing is one of these effects that can occur when calculating a channel’s response using band-limited network parameters. Just as is the case in measurements, Gibbs ringing can occur in channel simulations due to the fact that network parameters are typically band-limited.
In electronics, there is the possibility that your PCB can get pretty hot due to power dissipation in certain components. There are many things to consider when dealing with heat in your board, and it starts with determining power dissipation in your design during schematic capture. If you happen to be operating within safe limits in a high power device, you might need an SMD heat sink on certain components. Ultimately, this could save your components, your product, and even the operator.
One thing is certain: power supply designs can get much more complex than simply routing DC power lines to your components. RF power supply designs require special care to ensure they will function without transferring excessive noise between portions of the system, something that is made more difficult due to the high power levels involved. In addition to careful layout, circuitry needs to be designed such that the system provides highly efficient power conversion and delivery to each subsection of the system.
Overvoltage, overcurrent, and heat are the three most likely events that can destroy our expensive silicon-based components or reduce our product’s life expectancy. The effects are often quite instant, but our product might survive several months of chronic overstress before giving up the ghost in some cases. Without adequate protection, our circuit can be vulnerable to damage, so what should we do? Or do we need to do anything?
Today’s PCB designers and layout engineers often need to put on their simulation hat to learn more about the products they build. When you need to perform simulations, you need models for components, and simulation models often need to be shared with other team members at the project level or component level. What’s the best way for Altium Designer users to share this data? Read this article to learn more about sharing your models with other design participants.
Kinetic Vision, a Cincinnati-based design, engineering, and development firm, is an innovator’s one-stop shop for transforming even the wildest ideas into real products. The company’s design approach keeps everything in-house, including industrial design, mechanical, and electrical design, as well as, engineering, hardware/software development, machine learning, and sometimes even short-run production. Watch this webinar to learn how Kinetic Vision uses the Altium 365 platform to enable a connected and frictionless PCB design experience, increasing their productivity 5 times even
When some designers start talking materials, they probably default to FR4 laminates. The reality is there are many FR4 materials, each with relatively similar structure and a range of material property values. Designs on FR4 are quite different from those encountered at the low GHz range and mmWave frequencies. So what exactly changes at high frequencies, and what makes these materials different? To see just what makes a specific laminate useful as an RF PCB material, take a look at our guide below.
In today’s fast-paced world where iterations of electronics are spun at lightning speeds, we often forget one of the most critical aspects of development: testing. Even if we have that fancy test team, are we really able to utilize them for every modification, every small and insignificant change that we make to our prototypes? In this article, we will review a very low cost, yet highly effective and quite exhaustive test system that will get you that bang for your buck that you’ve been looking for.
If you’ve ever looked at the BOM for a reference design or an open-source project, you may have seen a comment in some of the entries in your BOM. This comment is either “DNP” or “DNI”. If you think about it, every component placed in the PCB requires some level of placement and routing effort, which takes time and money if you’re working for a client. This begs the question, why would anyone design a board with components they don’t plan to include in the final assembly?
When it’s time to share your design data with your manufacturer, it’s like taking a leap of faith. Sending off a complete documentation package might seem as easy as placing your fab files in a zip folder, but there are better ways to ensure your manufacturer understands your project and has access to all your design data. For Altium Designer users, there are multiple options for creating and packaging release data into a complete package for your manufacturers.
A heavy focus is usually put on managing your design data, but what about managing your design team? A mismanaged design team can lead to a disorganized and inaccurate design library and data. Watch this webinar to see how Altium 365 can help you to organize users into access restricted groups, manage design and designer access rights, avoid design conflicts when multiple members are working on the same design, and standardize your entire project using templates
If you’re designing a circuit board to be powered by anything except a bench-top regulated power supply, you’ll need to select a power regulator to place on your board. Just like any other component, your regulator has stated operating specs you’ll see in a product summary, and it has more detailed specs you’ll find in a datasheet. The fine details in your datasheets are easy to overlook, but they are the major factors that determine how your component will interact with the rest of your system.
It would be nice if the power that came from the wall was truly noise-free. Unfortunately, this is not the case, and although a power system can appear to output a clean sine wave, zooming into an oscilloscope trace or using an FFT will tell you a different story. When you take "dirty" power, put it through rectification, and then pass it through a switching regulator, you introduce additional noise into the system that further degrades power quality. If you’re a power supply or power systems designer, then you know the value of supplying your devices with clean, noise-free power.
If you’re an electronics designer or you’re just beginning your career as an engineer, the PCB stackup is probably one of the last things you’ll think about. Simple items like PCB copper thickness and board thickness can get pushed to the back burner, but you’ll need to think about these two points for many applications as not every board will be fabricated on a standard 1.57 mm two-layer PCB
I often get questions from designers asking about things like signal integrity and power integrity, and this most recent question forced me to think about some basic routing practices near planes and copper pour. "Is it okay to route signal traces on the same layer as power planes? I’ve seen some stackup guidelines that suggest this is fine, but no one provides solid advice." Once again, we have a great example of a long-standing design guideline without enough context.
Don’t walk into supplier talks blind. Use market data to benchmark quotes, check lead times and uncover alternate parts. This article shows how visibility can shift the balance and de-risk your BOM.
Designing rigid-flex boards is like solving a 3D puzzle of materials, bends and tight spaces, and via-in-pad might just be the piece you need. Dive into how and when to use via-in-pad in rigid-flex designs, and what to watch out for from fabrication to field reliability.
This whitepaper examines how next-generation wearable electronics are evolving through advancements in flexible and rigid-flex design, smart materials, AI, energy innovations, and connectivity. Discover what’s required to transform early prototypes into scalable, reliable products across healthcare, sports, defense, fashion, and enterprise applications.
Electronic parts may now cycle from launch to end-of-life in just a few years, but many systems are expected to serve for 10–20+ years. Here’s how to build a component selection process that aligns engineering, procurement and design for longevity and stability.
As component lead-times extend and obsolescence becomes a persistent threat, PCB projects demand more than schematic capture and layout tools alone. This article details how ECAD software with embedded supply-chain intelligence can: unify engineering and procurement teams; provide visibility into stock levels, lead times and alternates; and enable proactive risk mitigation within the design loop.
In complex electronic systems, managing data from multiple printed circuit boards can quickly become a logistical challenge. This article outlines a structured workflow for handling both board-level and assembly-level design outputs, ensuring clarity and consistency across fabrication, assembly and product-level documentation.
Learn the six essential topics every electronics team should address in design reviews to improve quality, avoid surprises and bring products to market faster.
From design to production, effective Bill of Materials (BOM) management is critical to ensuring smooth collaboration between engineering, procurement, and manufacturing teams. In this practical guide, we break down proven strategies for structuring, maintaining, and synchronizing your BOM to prevent costly mistakes and accelerate time-to-market.
This series of guided demos shows how the Altium Requirements Portal transforms scattered requirement spreadsheets and emails into traceable, version-controlled data that stays aligned with your PCB design efforts.
Discover when a rigid-flex PCB is a better choice than a separate flex circuit and connector, especially for designs requiring compact packaging, repeated motion or high reliability. The article emphasizes that although rigid-flex needs more upfront planning and fabrication collaboration, it often pays off in simpler assemblies and improved performance.
As vehicles evolve into advanced electronic systems, the separation between electrical and mechanical design teams becomes a critical bottleneck. This article explores how synchronized ECAD–MCAD workflows help automotive projects move faster, reduce rework and maintain design integrity.
We all want to pack more into our PCB designs, but the smallest via isn’t always the smartest one. Dive in to learn how picking the right structure can save you headaches down the line.
Structural electronics integrates electronic functionality directly into the physical structure of a product, eliminating the need for traditional circuit boards. This article examines how advances in materials, additive manufacturing, and flexible substrates are enabling compact, 3D, and wearable systems with enhanced performance and design freedom.
In ultra-HDI designs, soldermask is no longer a passive coating but a pivotal element that can determine manufacturability. This article explores why mask registration, resolution, and feature tolerances become critical as line spacings shrink below 50 µm.
When the margin for error is nearly zero, aerospace engineering demands a design process that’s seamless across all domains. Here, we explore how ECAD-MCAD co-design delivers an integrated workflow that supports first-pass success and compliance with strict aerospace standards.
Many PCB assemblies fail not because of exotic faults, but due to basic issues like incorrect BOM entries or footprint mismatches that force rework or scrap. This article dives into the most common causes and how to prevent costly defects in your design-to-manufacturing process.