News & Updates
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What’s New in Altium 365: Version Control for Hardware, Layer Stackup in Web Viewer, and SOC 2 Type 1 Certification
In February, we hit a new record in the number of users on the platform. The Altium 365 user community is now 20,000 strong! You can now migrate from an external version control system to Altium 365 preserving the history of commits. We also received the SOC 2 Type 1 certification from KPMG, made layer stack available in the web viewer, and added the brand new capability to track tasks in the context of your design project. Keep reading to learn more!
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Introducing Spectra's Electronic Design to Delivery Index
Get a cohesive view of supply chain market conditions, stay on top of trends, and avoid disruption with this free, monthly report from Spectra.
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Support for Rigid-Flex in Altium Designer
Rigid-flex in Altium Designer starts with designing a manufacturable PCB layer stack complete with via transitions and any calculated impedance requirements. Flex sections also need to be placed in the layer stack before moving into the PCB layout. Once inside the PCB editor, bending lines can be clearly defined in the PCB layout, and these can be visualized in Altium Designer's 3D PCB design tools. Keep reading to see how Altium Designer supports your flex and rigid-flex designs.
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Communicating PCB Layer Stackup Needs to Manufacturers
In the business of PCB design, communicating needs to manufacturers and vendors is a top priority. The context of our requests is sometimes lost either by not providing the correct information, not listing enough information, or not giving any information. Although the experienced PCB designer can take steps to specify everything they want to see in their PCB stackup, eventaully the manufacturer will handle that decision in an effort to balance available materials with processing capabilities and yield.
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Risk Vs. Reward
During the recent IPC APEX expo, there was a lot of discussion about SAP, or semi-additive PCB processes. As with any new technology adoption there were people that are excited to jump right in and start designing with much finer feature sizes and work through the inevitable changes to the traditional thought process. Others are in a "let’s wait and see" mode and of course there are a few skeptics there as well, so keep reading to learn more.
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Parasitic Extraction with an Electromagnetic Solver in PCB Routing
Parasitic extraction: the integrated circuit design community must grapple with this task on a daily basis, especially once gate features are reduced below ~350 nm and chips run at high switching speeds. The PCB community also has to deal with this idea in order to better design power delivery networks, interconnects with precise impedance, and properly quantify crosstalk and coupling mechanisms.
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Ebook: PDN Simulation and Analysis Guide
Most designers don’t realize they need to worry about power integrity until they have a power integrity problem. Other designers might build boards that can’t handle the demands of modern digital and high frequency components, and they may not realize the problems that lurk in their power delivery network (PDN). Although the basic concepts involved in designing for power integrity are well-known, myths about power integrity abound, and designers need tools to help them evaluate and qualify power integrity in a PDN.
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Ferrite Beads and Transfer Impedance in a PDN Simulation
The use of ferrites in a PDN is one design recommendation that is fraught with unclear guidance and over-generalized recommendations. If you see an application note or a reference design that recommends placing a ferrite in a PDN, should you follow this in your specific design, or should you ignore this and focus on adding capacitance?
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Overview of PCB Design Output Files
Before your board can be put into production and prepared for assembly, you have to generate a set of files that assist your manufacturer. These are your PCB design output files, also known as manufacturing files, fabrication data, assembly files, and a host of other names. Before you send your design file off to a manufacturer in an email, make sure to get a list of their required fabrication and assembly files first. If you’re a new designer, take some time to read over the basic PCB manufacturing file extensions below.
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Via-in-Pad in Rigid-Flex Designs: When Space Is Tight, Details Matter
Designing rigid-flex boards is like solving a 3D puzzle of materials, bends and tight spaces, and via-in-pad might just be the piece you need. Dive into how and when to use via-in-pad in rigid-flex designs, and what to watch out for from fabrication to field reliability.
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Wearable Electronics: Innovations, Challenges & Future Trends
This whitepaper examines how next-generation wearable electronics are evolving through advancements in flexible and rigid-flex design, smart materials, AI, energy innovations, and connectivity. Discover what’s required to transform early prototypes into scalable, reliable products across healthcare, sports, defense, fashion, and enterprise applications.
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Streamlining Component Selection for Long Product Lifecycles
Electronic parts may now cycle from launch to end-of-life in just a few years, but many systems are expected to serve for 10–20+ years. Here’s how to build a component selection process that aligns engineering, procurement and design for longevity and stability.
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Using ECAD Software to Track Part Availability During PCB Design
As component lead-times extend and obsolescence becomes a persistent threat, PCB projects demand more than schematic capture and layout tools alone. This article details how ECAD software with embedded supply-chain intelligence can: unify engineering and procurement teams; provide visibility into stock levels, lead times and alternates; and enable proactive risk mitigation within the design loop.
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PCB Design Data Management Tips for Multi-Board Projects
In complex electronic systems, managing data from multiple printed circuit boards can quickly become a logistical challenge. This article outlines a structured workflow for handling both board-level and assembly-level design outputs, ensuring clarity and consistency across fabrication, assembly and product-level documentation.
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6 Areas Your PCB Design Reviews Should Focus On
Learn the six essential topics every electronics team should address in design reviews to improve quality, avoid surprises and bring products to market faster.
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What Is BOM Management? A Practical Guide to Avoiding Costly Part Mismatches
From design to production, effective Bill of Materials (BOM) management is critical to ensuring smooth collaboration between engineering, procurement, and manufacturing teams. In this practical guide, we break down proven strategies for structuring, maintaining, and synchronizing your BOM to prevent costly mistakes and accelerate time-to-market.
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Requirements Portal Introductory Tutorials
This series of guided demos shows how the Altium Requirements Portal transforms scattered requirement spreadsheets and emails into traceable, version-controlled data that stays aligned with your PCB design efforts.
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Bridging the Gap: When to Use Rigid-Flex Instead of Flex & Connector
Discover when a rigid-flex PCB is a better choice than a separate flex circuit and connector, especially for designs requiring compact packaging, repeated motion or high reliability. The article emphasizes that although rigid-flex needs more upfront planning and fabrication collaboration, it often pays off in simpler assemblies and improved performance.
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Bridging Mechanical and Electrical Teams for Smarter Automotive Design
As vehicles evolve into advanced electronic systems, the separation between electrical and mechanical design teams becomes a critical bottleneck. This article explores how synchronized ECAD–MCAD workflows help automotive projects move faster, reduce rework and maintain design integrity.
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Via Structures: Designing for Reliability, Not Just Density
We all want to pack more into our PCB designs, but the smallest via isn’t always the smartest one. Dive in to learn how picking the right structure can save you headaches down the line.
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How Structural Electronics Enables 3D, Flexible, and Wearable Integration
Structural electronics integrates electronic functionality directly into the physical structure of a product, eliminating the need for traditional circuit boards. This article examines how advances in materials, additive manufacturing, and flexible substrates are enabling compact, 3D, and wearable systems with enhanced performance and design freedom.
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Beyond Traces: Why Soldermask May Be the Critical Factor in Ultra HDI
In ultra-HDI designs, soldermask is no longer a passive coating but a pivotal element that can determine manufacturability. This article explores why mask registration, resolution, and feature tolerances become critical as line spacings shrink below 50 µm.
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How ECAD-MCAD Co-Design Supports Aerospace Reliability and Compliance
When the margin for error is nearly zero, aerospace engineering demands a design process that’s seamless across all domains. Here, we explore how ECAD-MCAD co-design delivers an integrated workflow that supports first-pass success and compliance with strict aerospace standards.
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Most Common Causes of PCB Assembly Rework and Scrap
Many PCB assemblies fail not because of exotic faults, but due to basic issues like incorrect BOM entries or footprint mismatches that force rework or scrap. This article dives into the most common causes and how to prevent costly defects in your design-to-manufacturing process.
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Behind the Scenes with AI Embedded Development
Forget one-shot AI hacks Ari Mahpour shows the thoughtful, sustainable way to integrate AI into embedded firmware development. Learn the core principles (planning gate, HAL abstraction, observability, timeout design) that can help you push your efficiency 5-10 times in real hardware projects.
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