News & Updates
In these days of easily-available internet and quarantines, everyone is working remotely. It’s nice being able to spend time with family and regain control over your schedule, but keeping track of projects and revisions while securing user access feels like its own job. With the right set of project and data management tools, you can easily share your data with collaborators without tracking email chains.
When I started using my Altium 365 Workspace for collaboration, I found I could make things run more smoothly when I kept things organized. However, I prevented any issues thanks to all the organization tools built into the Explorer panel within Altium Designer. Let’s take a look at how you can get the most value out of your Altium 365 Workspace in terms of organization and access management.
PCB manufacturing is competitive, and there is plenty of worldwide manufacturing capacity for new boards. If you’re looking for a manufacturer for your next project, it can be difficult to determine who is the best option to produce your board. Different fabricators and assemblers offer different levels of service, different capabilities, and access to different processes and materials. There are a lot of options to consider when selecting a manufacturer for your project.
Ever since I started using Github and Google Docs, I fell in love with revision control. Instead of keeping multiple copies of essential files and time-stamping every revision, revision tracking information gets stored alongside the file. This environment works great for code, spreadsheets, and documents, and Altium brings these same features into PCB design.
With advances in industrial automation, automotive technology, remote sensing, and much more, image processing is taking center stage in many embedded systems. Image processing with older video systems was difficult or impossible due to the low quality of many imaging systems with perpetual uptime. Newer systems provide video with higher frame rates and higher resolution images, but these systems still needed to connect directly to a computer in order to enable any useful image processing applications.
EDA tools have come a long way since the advent of personal computing. Now advanced routing features like auto-routers, interactive routing, length tuning, and pin-swapping are helping designers stay productive, especially as device and trace densities increase. Routing is normally restricted to 45-degree or right-angle turns with typical layout and routing tools, but more advanced PCB design software allows users to route at any angle they like. So which routing style should you use, and what are the advantages of any angle routing?
If you do a search for “Hardware-in-the-Loop” testing, you will frequently find examples of complex, real-time systems. Article from National Instruments, for example, gives a nice explanation and background on what hardware-in-the-loop (HIL) is, and provides an example of testing electronic control units within an automobile. In this article, we will be focusing on a smaller, more bite-sized version of HIL testing concepts.
No one wants to do a board respin because of inaccurate or incomplete manufacturing outputs confusing design intent. This webinar covers the information needed for PCB Manufacturing and Assembly, as well as, a simple way to communicate and collaborate with manufacturing.
If you’re an antenna designer, then you’re likely familiar with all aspects of near-field vs. far-field radiation. Given the litany of radiated EMI problems that cause noise within and outside of an electronic device, one might suddenly realize their new product is acting like a strong antenna. To understand how EMI affects your circuits, it helps to understand exactly how near-field vs. far-field radiation from your PCB affects your ability to pass EMC checks and affects your circuits.
How often have you started down the PCB development process and been bogged down by time-consuming administrative tasks? Once you get ready for production, working through a design review and correcting any DFM problems takes its own share of time. With hastening product development timelines and shorter product life cycles comes the pressure to increase PCB prototype iteration speed without sacrificing cost or quality. So how can PCB design teams keep their development schedules on track without sacrificing quality or risking a failed prototyping run?
A journey of a thousand miles begins with a single step, or so the aphorism goes. I think it’s worth noting that the first step is the most difficult to take. Analysis Paralysis is especially true when dealing with a new software package, including the recent release of Concord Pro. The recent version has brought with it a deluge of interest and enthusiasm in such a phenomenal tool. But I must say, Altium hit this one out of the park.
When you need to pass EMC certification and your new product is being crippled by a mysterious source of EMI, you’ll probably start considering a complete product redesign. Your stackup, trace geometry, and component arrangement are good places to start, but there might be more you can do to suppress specific sources of EMI. There are many different types of EMI filters that you can easily place in your design, and that will help suppress EMI in a variety of frequency ranges.
Previously, I described the PCB fabrication operations relative to inner layer processing, lamination, drilling, and plating. The last step in the process is outer layer processing which is described below. Once the desired plated copper thickness of a PCB has been achieved, it’s necessary to etch away the copper between the features in order to define the outer layer pattern.
There are many factors at play in determining the impact of inductance on high-frequency power distribution systems. Two topic areas, inductance of the decoupling capacitor and inductance of the power planes, were addressed in earlier articles. This article will focus on the inductance of the capacitor footprint and via inductance from the capacitor footprint back to the PCB power planes.
High-speed buses, whether single-ended or differential, can experience any number of signal integrity problems. A primary problem created by propagating signals is crosstalk, where a signal superimposes itself on a nearby trace. The industry-standard PCB design tools in Altium Designer® already include a post-layout simulator for examining crosstalk. Still, you can speed up crosstalk analysis in parallel buses when you use a powerful field solver.
Any time-dependent physical system with feedback and gain has conditions under which the system will reach stable behavior. Amplifier stability extends these concepts to amplifiers, where the system output can grow to an undesired saturated state due to unintended feedback. If you use the right design and simulation tools, you can easily account for potential instability in your circuit models before you create your layout.
The concept of design variants entails taking a single PCB design, and then on the assembly side, modifying specific components used in the design. Either by not installing, not installing, or choosing alternate components as replacements on a specific assembly to ultimately create different end products. In that way, you could support multiple product lines. This article describes the approach to working with variants.
Controlled ESR capacitors are important for power integrity in your design as they can help smooth out the PDN impedance spectrum in your high speed PCB.
Whenever we say something to the effect of “components can’t work without a correctly designed PCB,” we only have to look at component packaging for evidence. It is true that component packages come with parasitics that affect signal integrity, but there is one area that we don’t often look at in terms of component packaging: power integrity.
In this article, we’ll look at all that is required to start creating your own custom microcontroller-based hardware designs. You’ll see that there actually isn’t too much to this, as microcontroller manufacturers over the years have tried to make the learning curve less steep and their devices more, and more accessible. This is both from an electrical point of view but also – equally importantly – from a programming point of view.
If you’ve taken time to learn about PCB material options and layer constructions, you have probably seen the wide range of materials that are available on the market. Materials companies produce laminates with varying Dk values, Tg values, weave styles, CTI values, and mechanical properties to target various applications in the electronics industry.
If you’re waiting for truly connected cars on a grand scale, there is still a massive amount of work to be done, both on the hardware and software sides. Connected cars can only become a widespread reality once the automotive industry and telecom carriers can decide which protocol will work best for vehicle-to-everything (V2X) communication. PCB designers will then need to step in to create these systems and fit them into a vehicular environment.
This one area of PCB design can be contentious among some designers as it is related to copper pour, which it is often stated is not needed in most designs. Regardless of your feelings about copper pour, stitching vias have important uses in PCBs at low frequencies and at high frequencies.
The IPC-2221 standard includes many requirements for printed circuit board design and manufacturability, and there are several online calculators that have been developed based on this standard.
When you’re ready to manufacture a new device at production volume, there are many aspects of the product that must come together. The enclosure, cabling and connectors, embedded software/firmware, and of course the PCBA all have to be considered in totality. There is a quick way to get your product into a usable enclosure, complete with input power and cabling, and with a form factor that fits your PCBA. This overused route to a new product is a box build assembly.
Printed circuit board fabricators have become skilled at manufacturing these technologies and also at understanding the reliability and producibility challenges associated with high-density-interconnect technology. Let’s look at where the PCB industry is at today.
What can the industry do to support PCB designers as they continue taking a more active role in product development? Here at Altium, there has been a progressive shift towards looking at the system level and creating tools that get designers more involved throughout the product development process. As the saying goes, over the wall engineering is over… today’s most successful products are built in a collaborative process.
As the 5G rollout progresses and researchers continue to discuss 6G, many new 5G-capable products operating in sub-GHz and mmWave bands are reaching the marketplace. Devices that will include a 5G-compatible front-end, whether small stations/repeaters or handheld devices, use phased arrays as high-gain antenna systems to provide high data throughput without losing range at higher frequencies.
Via protection is an important part of modern PCB design. It provides additional benefits in PCB manufacturing and assembly, increasing the number of acceptable products.
Power integrity problems can abound in modern PCBs, especially high-speed boards that run with fast edge rates. These systems require precise design of the PDN impedance to ensure stable power is always delivered throughout the system.
A design project doesn’t appear out of nowhere. The design process spreads over time, and project documents change. Schematic documents gradually become more complex, new functional blocks appear, and already finished parts can be modified and updated.
Capacitance is your friend whenever you need stable power integrity, which is why there is so much focus on decoupling capacitors. While these components are important and they can be used to provide targeted power integrity solutions to certain components, there is one specialty material used to supercharge capacitance in your PCB stackup or package substrate.
The problems you can experience with components and libraries are endless. These problems are the most significant source of design issues and the biggest reason behind respins, costing companies untold amounts of lost profit annually.
If you want to have a better understanding of how to use Altium 365 to maintain a strong and centralized library that is free of problems and headaches, you may want to consider attending this lecture.