News & Updates
Blog
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Overview of the PCIe 6.0 Standard
Just as you get used to PCIe 5.0, they decide to release another standard! The newest iteration of PCIe is Gen6, or PCIe 6.0. PCIe 6.0 brings a doubling of channel bandwidth through introduction of PAM-4 as the signaling method in high-speed differential channels. This signaling method is a first for PCIe, and it’s an important enabler of the doubled data rate we see in the current standard. In this article, I’ll run over the important points in the standard and what PCB designers can expect when designing these channels.
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SPI vs. I2C: How to Choose the Best Protocol for Your Memory Chips
One of the common implementations of SPI and I2C in a PCB layout is as a protocol for reading and writing to an external Flash memory. Flash chips are a very common component in embedded systems and can offer high capacities of non-volatile memory up to Gb values. When choosing a memory chip, you'll want to match the application requirements and functionality with the bus speed you need for read and write operations in your memory chip. There is also the matter of the type of Flash memory you'll need to access (NOR vs. NAND).
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Is There an SPI Trace Impedance Requirement?
There is no SPI trace impedance requirement? The reality is that SPI lines only start to need impedance control when the length of the interconnect becomes very long. And because there is no specific impedance requirement in the bus, you have some freedom in channel design and termination. So what exactly qualifies as “very long” and when is some termination method needed? We’ll break it down in this article.
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The Skin Effect, Current Density, and the Electromagnetic Field
During this year's AltiumLive CONNECT event, I recall receiving an interesting question about the skin effect and the distribution of current due to the presence of ground in coplanar transmission lines. In this article, we'll look at the electric field around a transmission line carrying a signal, and how this might be impacted by the skin effect.
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What You Need for PCB Packaging and Shipping
When you get your PCBA back from an assembler, you’ll notice the packaging materials used to pack and ship the PCBA. Those materials are specific to electronics, and if you build products on behalf of clients, it’s important to know the packaging materials used for packing and shipping electronics. In this article I’ll show the main set of materials and equipment used to package electronics assemblies.
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How to Make PCB Gerber Files in Altium Designer Step-by-Step
Once you've got your PCB layout finished and you're ready to start preparing for manufacturing, one of the critical steps is to create PCB Gerber files. When you're ready to create your Gerber files, you need the right set of CAM processor tools that can take data from your PCB layout. In this article, we'll guide you through this process of how to make PCB Gerber files and show some example tasks you might need to perform to generate them.
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Should You Place Teardrops on Differential Pairs?
One of the major factors impacting reliability of a PCBA is the use of teardrops on traces in the PCB. Like many aspects of reliability, the considerations also span into the signal integrity domain, particularly as more high-reliability products require greater data handling capabilities and run at higher speeds. In this article, I’ll break down the issues present in teardrop usage on differential pairs and how these may affect impedance.
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The High-Reliability PCBA Design and Test Challenge
High-reliability electronics must go through multiple rounds of testing and qualification to ensure they can withstand their intended operating environment. Designing to performance standards, whether the baseline IPC standards or more stringent industry standards, is the first step in ensuring a reliable circuit board. In this e-book, readers will gain a thorough look into PCB testing and analysis, starting from basic tests performed on bare boards and completed assemblies.
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AC Coupling Capacitors in PCIe Routing
Coupling capacitors find plenty of uses in analog applications and on differential protocols, acting essentially as high pass filters that remove DC bias carried seen on a signal. In the case of PCIe, there are a few reasons to place AC coupling capacitors on differential pairs beyond the fact that AC coupling capacitors are listed in the standard. In this article, we’ll look briefly at where to place coupling capacitors on PCIe links, as well as the reasons these are placed on PCIe links.
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Wearable Electronics: Innovations, Challenges & Future Trends
This whitepaper examines how next-generation wearable electronics are evolving through advancements in flexible and rigid-flex design, smart materials, AI, energy innovations, and connectivity. Discover what’s required to transform early prototypes into scalable, reliable products across healthcare, sports, defense, fashion, and enterprise applications.
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Streamlining Component Selection for Long Product Lifecycles
Electronic parts may now cycle from launch to end-of-life in just a few years, but many systems are expected to serve for 10–20+ years. Here’s how to build a component selection process that aligns engineering, procurement and design for longevity and stability.
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Using ECAD Software to Track Part Availability During PCB Design
As component lead-times extend and obsolescence becomes a persistent threat, PCB projects demand more than schematic capture and layout tools alone. This article details how ECAD software with embedded supply-chain intelligence can: unify engineering and procurement teams; provide visibility into stock levels, lead times and alternates; and enable proactive risk mitigation within the design loop.
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PCB Design Data Management Tips for Multi-Board Projects
In complex electronic systems, managing data from multiple printed circuit boards can quickly become a logistical challenge. This article outlines a structured workflow for handling both board-level and assembly-level design outputs, ensuring clarity and consistency across fabrication, assembly and product-level documentation.
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6 Areas Your PCB Design Reviews Should Focus On
Learn the six essential topics every electronics team should address in design reviews to improve quality, avoid surprises and bring products to market faster.
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What Is BOM Management? A Practical Guide to Avoiding Costly Part Mismatches
From design to production, effective Bill of Materials (BOM) management is critical to ensuring smooth collaboration between engineering, procurement, and manufacturing teams. In this practical guide, we break down proven strategies for structuring, maintaining, and synchronizing your BOM to prevent costly mistakes and accelerate time-to-market.
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Requirements Portal Introductory Tutorials
This series of guided demos shows how the Altium Requirements Portal transforms scattered requirement spreadsheets and emails into traceable, version-controlled data that stays aligned with your PCB design efforts.
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Bridging the Gap: When to Use Rigid-Flex Instead of Flex & Connector
Discover when a rigid-flex PCB is a better choice than a separate flex circuit and connector, especially for designs requiring compact packaging, repeated motion or high reliability. The article emphasizes that although rigid-flex needs more upfront planning and fabrication collaboration, it often pays off in simpler assemblies and improved performance.
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Bridging Mechanical and Electrical Teams for Smarter Automotive Design
As vehicles evolve into advanced electronic systems, the separation between electrical and mechanical design teams becomes a critical bottleneck. This article explores how synchronized ECAD–MCAD workflows help automotive projects move faster, reduce rework and maintain design integrity.
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Via Structures: Designing for Reliability, Not Just Density
We all want to pack more into our PCB designs, but the smallest via isn’t always the smartest one. Dive in to learn how picking the right structure can save you headaches down the line.
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How Structural Electronics Enables 3D, Flexible, and Wearable Integration
Structural electronics integrates electronic functionality directly into the physical structure of a product, eliminating the need for traditional circuit boards. This article examines how advances in materials, additive manufacturing, and flexible substrates are enabling compact, 3D, and wearable systems with enhanced performance and design freedom.
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Beyond Traces: Why Soldermask May Be the Critical Factor in Ultra HDI
In ultra-HDI designs, soldermask is no longer a passive coating but a pivotal element that can determine manufacturability. This article explores why mask registration, resolution, and feature tolerances become critical as line spacings shrink below 50 µm.
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How ECAD-MCAD Co-Design Supports Aerospace Reliability and Compliance
When the margin for error is nearly zero, aerospace engineering demands a design process that’s seamless across all domains. Here, we explore how ECAD-MCAD co-design delivers an integrated workflow that supports first-pass success and compliance with strict aerospace standards.
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Most Common Causes of PCB Assembly Rework and Scrap
Many PCB assemblies fail not because of exotic faults, but due to basic issues like incorrect BOM entries or footprint mismatches that force rework or scrap. This article dives into the most common causes and how to prevent costly defects in your design-to-manufacturing process.
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Behind the Scenes with AI Embedded Development
Forget one-shot AI hacks Ari Mahpour shows the thoughtful, sustainable way to integrate AI into embedded firmware development. Learn the core principles (planning gate, HAL abstraction, observability, timeout design) that can help you push your efficiency 5-10 times in real hardware projects.
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We're heading to PCB West 2025!
Join Altium at PCB West 2025 in Santa Clara, CA, on October 1! Stop by Booth 300 for the official launch of the new Altium platform, built on the foundation of Altium Designer and Altium 365. Be sure to check out our live demos of Altium Develop and Altium Agile.
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