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Embedded thumbnail for Adding Project Modules to a Multi-board Schematic
How to work with Multiboard
Adding Project Modules to a Multi-board Schematic

If you’re using multiple PCBs in your Multi-board design, Altium Designer allows you to add existing projects directly to your schematic with modules. We’ll show you how to quickly and efficiently add these projects to your Multi-board design.

PCIe 6.0 Overview
Blog
Overview of the PCIe 6.0 Standard

Just as you get used to PCIe 5.0, they decide to release another standard! The newest iteration of PCIe is Gen6, or PCIe 6.0. PCIe 6.0 brings a doubling of channel bandwidth through introduction of PAM-4 as the signaling method in high-speed differential channels. This signaling method is a first for PCIe, and it’s an important enabler of the doubled data rate we see in the current standard. In this article, I’ll run over the important points in the standard and what PCB designers can expect when designing these channels.

Embedded thumbnail for Checking for Creepage in High Voltage Designs
How-To's
Checking for Creepage in High Voltage Designs

High voltage devices have leakage currents that propage over the surface of the board. In such devices, it's important to consider not only the standard gap between the two topological elements, but also the shortest possible path between them, taking into account cut-outs and holes. With Altium Designer 20, you can check for creepage using the new creepage distance rule.

Embedded thumbnail for Creating BGA Footprints with the Footprint Wizard
How to create a PCB Footprint
Creating BGA Footprints with the Footprint Wizard

Altium Designer makes it easy to create a BGA footprint using our IPC compliant footprint wizard. We'll show you how easily you can create and modify a BGA footprint using the footprint wizard.

SPI vs. I2C For Memory Access
Blog
SPI vs. I2C: How to Choose the Best Protocol for Your Memory Chips

One of the common implementations of SPI and I2C in a PCB layout is as a protocol for reading and writing to an external Flash memory. Flash chips are a very common component in embedded systems and can offer high capacities of non-volatile memory up to Gb values. When choosing a memory chip, you'll want to match the application requirements and functionality with the bus speed you need for read and write operations in your memory chip. There is also the matter of the type of Flash memory you'll need to access (NOR vs. NAND).

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Is There an SPI Trace Impedance Requirement?

There is no SPI trace impedance requirement? The reality is that SPI lines only start to need impedance control when the length of the interconnect becomes very long. And because there is no specific impedance requirement in the bus, you have some freedom in channel design and termination. So what exactly qualifies as “very long” and when is some termination method needed? We’ll break it down in this article.

Embedded thumbnail for How to Remove Unused Pad Shapes
How-To's
How to Remove Unused Pad Shapes

Unused pad shapes can cause distortion among other problems so it is best to exclude them from your designs. This video shows how to remove unused pad shapes.

Embedded thumbnail for Stackup Presets and Templates
How to work with Layer Stack Manager
Stackup Presets and Templates

In this video, we will learn how to apply predefined layer stacks to the board, as well as how to save the layer stack file as a template.

The Skin Effect and EM Fields
Blog
The Skin Effect, Current Density, and the Electromagnetic Field

During this year's AltiumLive CONNECT event, I recall receiving an interesting question about the skin effect and the distribution of current due to the presence of ground in coplanar transmission lines. In this article, we'll look at the electric field around a transmission line carrying a signal, and how this might be impacted by the skin effect.

Embedded thumbnail for Creating a PCB Footprint Assembly Drawing
How to create a PCB Footprint
Creating a PCB Footprint Assembly Drawing

If you need to create an assembly drawing of your PCB Footprint for your outjob files we can show you how in Altium Designer. We’ll walk through all the different options for your assembly drawing in your Draftsman document, how to create your assembly drawing and assign it designators.

Packaging for your PCBAs
Blog
What You Need for PCB Packaging and Shipping

When you get your PCBA back from an assembler, you’ll notice the packaging materials used to pack and ship the PCBA. Those materials are specific to electronics, and if you build products on behalf of clients, it’s important to know the packaging materials used for packing and shipping electronics. In this article I’ll show the main set of materials and equipment used to package electronics assemblies.

Embedded thumbnail for Using the ActiveBOM
How-To's
Using the ActiveBOM

Using the ActiveBOM: The Bill of Materials (BOM) contains a list of all the components with their designators, part numbers, values, and other parameters. An ActiveBOM manages the mapping from the design component (part) to the part that is purchased. This video describes how to use the ActiveBOM document to create an up-to-date list of components needed for your project.

Embedded thumbnail for Using Back Drills in your Stackup
How to work with Layer Stack Manager
Using Back Drills in your Stackup

In this video, we will learn about Back Drilling technology, how to set up back drilling using the layer stack manager, and how to set up the Stub Length sizes for back drilling by specifying applicable nets using the Design Rules Editor.

PCB Output files
Blog
How to Make PCB Gerber Files in Altium Designer Step-by-Step

Once you've got your PCB layout finished and you're ready to start preparing for manufacturing, one of the critical steps is to create PCB Gerber files. When you're ready to create your Gerber files, you need the right set of CAM processor tools that can take data from your PCB layout. In this article, we'll guide you through this process of how to make PCB Gerber files and show some example tasks you might need to perform to generate them.

Teardrops on Differential Pairs?
Blog
Should You Place Teardrops on Differential Pairs?

One of the major factors impacting reliability of a PCBA is the use of teardrops on traces in the PCB. Like many aspects of reliability, the considerations also span into the signal integrity domain, particularly as more high-reliability products require greater data handling capabilities and run at higher speeds. In this article, I’ll break down the issues present in teardrop usage on differential pairs and how these may affect impedance.

Embedded thumbnail for How to Customize The Properties Panel
How-To's
How to Customize The Properties Panel

How to Customize The Properties Panel: This video will go over how to customize the look and feel of the properties panel in Altium Designer. By being able to personalize your workspace you can greatly improve your efficiency

Embedded thumbnail for How to Create and Use Impedance Profiles
How to work with Layer Stack Manager
How to Create and Use Impedance Profiles

Using the Altium Designer Layer Stack Manager, we will show how to create impedance profiles for transmission lines and how to apply them to the circuit board using the PCB Rules and Constraints Editor.

Broken PCB
Blog
The High-Reliability PCBA Design and Test Challenge

High-reliability electronics must go through multiple rounds of testing and qualification to ensure they can withstand their intended operating environment. Designing to performance standards, whether the baseline IPC standards or more stringent industry standards, is the first step in ensuring a reliable circuit board. In this e-book, readers will gain a thorough look into PCB testing and analysis, starting from basic tests performed on bare boards and completed assemblies.

Embedded thumbnail for Creating a PCB Footprint Courtyard
How to create a PCB Footprint
Creating a PCB Footprint Courtyard

The courtyard is an essential piece when you want to create a PCB Footprint in Altium Designer. We’ll talk about what a courtyard is, how to create a courtyard, and how to format a courtyard correctly for your PCB footprint.

Where to place AC Caps on PCIe Lanes
Blog
AC Coupling Capacitors in PCIe Routing

Coupling capacitors find plenty of uses in analog applications and on differential protocols, acting essentially as high pass filters that remove DC bias carried seen on a signal. In the case of PCIe, there are a few reasons to place AC coupling capacitors on differential pairs beyond the fact that AC coupling capacitors are listed in the standard. In this article, we’ll look briefly at where to place coupling capacitors on PCIe links, as well as the reasons these are placed on PCIe links.

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Blog
Peak Electrical Performance in Multi-Board Designs With Advanced Simulation and Compliance Tools

Moving from single-board to multi-board systems is a leap in complexity. You must manage not just routing, but power, signal integrity, mechanical fit, and regulatory requirements across boards. In this article, you’ll discover how Altium’s advanced simulation and compliance tools help engineering teams overcome these challenges and deliver reliable multi-board solutions.

Blog
Executive Insights Into Electronic Product Development Gaps You Need To Close

Electronics hardware development is falling behind broader product development disciplines due to fragmented workflows, poor collaboration, and limited compliance visibility. This gap introduces risk, delays, and missed opportunities but executives see real business value in modernizing electronics development through better integration, traceability, and lifecycle visibility.

Blog
Sourcing For High-Mix Low-Volume Electronics Manufacturing

High-mix, low-volume (HMLV) electronics manufacturing requires agile sourcing strategies to handle shifting BOMs, erratic lead times, and component volatility. All while controlling costs and ensuring compliance. Cloud-based tools like Altium provide real-time component visibility, BOM collaboration, and supplier integrations to help navigate HMLV complexities.

Blog
One Vision, Three Powerful Solutions: Introducing Octopart Discover, Altium Develop, and Altium Agile

We are excited to announce the launch of three new platform-based solutions that will transform the way electronic products are designed, built, and delivered: Octopart Discover, Altium Develop, and Altium Agile. These solutions are designed to simplify processes, accelerate innovation, and make collaboration seamless across the entire electronics lifecycle. Together, they realize the purpose of Altium and Renesas: To Make Our Lives Easier.

Blog
The Top 5 Workflow Bottlenecks Slowing Down Mechanical Engineering Teams

Mechanical engineering teams frequently encounter delays from fragmented communication, disconnected toolchains, and inefficient synchronization processes. This article examines five critical workflow bottlenecks and highlights how ECAD-MCAD integration with real-time, bidirectional updates can eliminate rework and accelerate design iterations.

Blog
Building a Model Context Protocol Server for Arduinos

This guide walks you through creating an MCP server that turns AI interactions with Arduino into a predictable, automated process handling tasks like board listing, compilation, and serial communication via a fast, menu‑driven interface. Skip the guesswork of prompt nudging and reduce the risk of unintended device issues.

Blog
Getting Started with the GreenPAK Introduction Kit

Take your first steps into mixed-signal design with the Renesas GreenPAK Introduction Kit. Ari Mahpour shows how to design, simulate, and validate a clock divider project, making it easy for beginners to start experimenting with programmable mixed-signal devices.

Blog
Smarter Electronic Part Sourcing for Automotive Purchasing Professionals

Targeted at procurement professionals in the automotive industry, the article outlines the evolving pressures of sourcing components for electrified and connected vehicles. It highlights Octopart’s ecosystem as a unified tool that centralizes availability, compliance, pricing, and lifecycle intelligence to optimize sourcing efficiency.

Blog
Stack-Up to Success: Avoid the Pitfalls

"Stack‑Up to Success" highlights how a carefully planned PCB stack‑up is foundational to preventing warpage, managing impedance, and avoiding manufacturing delays by clearly communicating layer construction, materials, and tolerance requirements to fabricators.

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Embedded thumbnail for  HDI PCB Stackup Breakdown - Etching Weight Via Spacing, & More
How-To's
HDI PCB Stackup Breakdown - Etching Weight Via Spacing, & More

HDI PCB design depends on getting the stackup and manufacturing constraints right. In this deep dive, we examine a real HDI audio-interface board and explore common pitfalls, from how copper weight and etching affect minimum clearances to why solder mask slivers below 1 mil can cause manufacturing issues. You’ll also learn how proper board-edge clearance and copper pullback help protect SMD pads during routing.

Embedded thumbnail for  How do you review a robot design when your team is never in the same room?
Collaborative Engineering with Team Ribbot
How do you review a robot design when your team is never in the same room?

Team Ribbot’s engineers are spread across five states and juggle full-time jobs while building a 250-pound combat robot in their spare time. Discover how Altium Designer and Altium 365 keep the team connected, letting engineers open the live design from a laptop or phone, inspect the board in 3D, and leave comments directly on the design.

Embedded thumbnail for  Improve Visual Accuracy with True Arcs
New in Altium's Software
Improve Visual Accuracy with True Arcs

Discover how True Arc Rendering improves arc visualization in the PCB Editor and PCB Library Editor by displaying true arcs across 2D, 3D, and Board Planning modes. This provides a more accurate representation of board geometry and helps you work with curved features with greater precision throughout the design process.

Embedded thumbnail for Two engineers, one board, nobody's work gets wiped out
Collaborative Engineering with Team Ribbot
Two engineers, one board, nobody's work gets wiped out

When Team Ribbot’s electrical and mechanical engineers work on the same combat-robot design, unwanted changes can mean hours of lost work. See how Altium Designer and MCAD CoDesign let the team review and selectively accept changes, enabling seamless parallel collaboration across different locations and schedules.

Embedded thumbnail for Visualize and Refine Your Harness Designs
New in Altium's Software
Visualize and Refine Your Harness Designs

Create detailed views of bundle contents, control wire and cable paths, and rotate physical models to accurately represent the final harness assembly. These capabilities give you greater control over harness design and help ensure your digital model reflects the physical result.

Embedded thumbnail for Introducing Agentic Requirements Engineering
New in Altium's Software
Introducing Agentic Requirements Engineering

Discover a new way to work with Requirements Portal through Agentic Requirements Engineering. AI agents analyze your project data and surface proposals for your approval, reducing friction in requirements management and helping align your team's shared model with your design intent.

Embedded thumbnail for Simplify Rule Set Updates and Replacement
New in Altium's Software
Simplify Rule Set Updates and Replacement

Learn how to import rule sets with greater flexibility in Altium. When importing rules, you can add new rules to your existing set, replace only rules that match, or completely replace the current rule set giving you full control over how design rules are updated.

Embedded thumbnail for  How Team Ribbot fits 40 kW of power into a 250-pound combat robot
Collaborative Engineering with Team Ribbot
How Team Ribbot fits 40 kW of power into a 250-pound combat robot

What do you get when you pack the power of a small electric car into a combat robot with virtually no room to spare? In the first episode of our collaboration with Team Ribbot and Altium, explore how seamless ECAD-MCAD collaboration helps the team tackle complex design challenges, optimize high-performance designs, reduce errors, and bring products to life faster.

Embedded thumbnail for Just Released: Supplier Data Merging
New in Altium's Software
Just Released: Supplier Data Merging

Discover how the Supplier Data Merging feature brings together supplier information from your custom parts database and the Altium Parts Provider into a single, unified view. Access consolidated supplier data wherever supplier part numbers appear, including in ActiveBOM and during component selection.

Embedded thumbnail for How Altium’s Layer Stack Manager Actually Works
How-To's
How Altium’s Layer Stack Manager Actually Works

Take a look inside Altium's Layer Stack Manager and discover how its impedance calculator determines the ideal trace width for your target impedance. In this video, we break down the "black box" behind the calculation and show how the Simbeor-based field solver provides accurate results while eliminating the need for advanced field solver expertise.

Embedded thumbnail for Connect Requirements Directly to Your PCB Design
New in Altium's Software
Connect Requirements Directly to Your PCB Design

See how the Requirements Portal integration in Altium Designer simplifies requirements management by bringing system requirements directly into your PCB design workflow. Connect requirements to design documents, assign tasks, track verification in real time, and keep your entire team aligned with seamless synchronization in Altium 365.

Embedded thumbnail for SFP Connector Routing: High-Speed Differential Pair Design Tips
How-To's
SFP Connector Routing: High-Speed Differential Pair Design Tips

Discover practical SFP and SFP+ routing tips in our latest video, inspired by a real question from the Altium subreddit. We cover how aggressive serpentine length tuning can be, how to reduce impedance discontinuities in tight meanders, and how meandering influences mode conversion at 10G and higher data rates.

Embedded thumbnail for Handle High-Density PCB Layouts with Ease
New in Altium's Software
Handle High-Density PCB Layouts with Ease

Push the limits of PCB design with support for up to 128 signal layers, empowering the development of even the most complex, high-density boards.

Embedded thumbnail for Skip Layer Routing for RF: Control Impedance & Cut Insertion Loss
How-To's
Skip Layer Routing for RF: Control Impedance & Cut Insertion Loss

Discover our latest video and learn how RF designers use a deeper ground plane to minimize skin-effect resistance, improve signal integrity over long high-frequency routes, and optimize impedance matching for oversized SMT pads in antenna launches and coaxial connectors.

Embedded thumbnail for Just Released: ODB++ Intellectual Property Protection
New in Altium's Software
Just Released: ODB++ Intellectual Property Protection

ODB++ Intellectual Property Protection lets you control exactly what design data is included in the ODB++ output, ensuring each manufacturing partner receives only the information needed for their specific fabrication or assembly tasks.

Embedded thumbnail for Future of Electronics Development in Security and Aerospace
How-To's
Future of Electronics Development in Security and Aerospace

See the highlights from Altium's executive event in Hamburg, where Security and Aerospace leaders explored AI-driven development, digital engineering, supply chain resilience, and the future of mission-critical electronics.

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