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Embedded thumbnail for Coming Soon: Ansys CoDesigner
How-To's
Coming Soon: Ansys CoDesigner

Ansys CoDesigner (which will be released on the13th of December) simplifies your design process by connecting ECAD and Simulation to eliminate manual export/import steps. With features like design change synchronization and commenting, Altium Designer ECAD engineers and Ansys Electronics Desktop (AEDT) SIM engineers can collaborate seamlessly in one workspace.

Blog
Design Phase – Lid Assembly Mechanics Part 1

It is time to delve deep into the mechanical design of our Open Source Laptop project. In this article we give you an update about the first part of fitting elements into the system. You will learn more about laptop lid, webcam integration, light sensor and microphones which will be used in this project.

Embedded thumbnail for Coming Soon: Automatic Multi-Net Tuning
How-To's
Coming Soon: Automatic Multi-Net Tuning

Automatic Multi-Net Tuning enhances PCB design accuracy and efficiency by automatically adjusting multiple nets simultaneously to meet specific design rules, including length and delay. Learn more about this feature, which will be released on December 13th. Its flexibility enables effective work with differential pairs and traces at any angle. It not only identifies but also rectifies issues related to automatic length tuning, ensuring your designs adhere to key standards without the need for manual adjustments.

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How to Design for Test in Embedded Systems

Whether you're designing a high-speed PCB, or a complex embedded system, it will need some level of testing. In this article, we will show you some simple tricks that can make testing and debugging a prototype much easier. 

Embedded thumbnail for Coming Soon: PCB CoDesign
How-To's
Coming Soon: PCB CoDesign

PCB CoDesign makes it easier for everyone to work together and meet project deadlines. In Altium Designer 24, which is scheduled for release on December 13th, we are introducing a new feature. This feature optimizes your resources through a Git-like approach, allowing multiple team members to work simultaneously and commit changes to a master branch. This expedites the design process and lowers project costs.

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Crosstalk Basics in PCB Design

Crosstalk is one of the most common issues related to electronics. Learn the basics of this phenomenon in PCB design, and gain knowledge on how to avoid it in your projects.

Embedded thumbnail for Coming Soon: MultiBoard Draftsman
How-To's
Coming Soon: MultiBoard Draftsman

MultiBoard Draftsman enhances the efficiency of design reviews and assembly precision by offering a unified platform for detailed viewing and documentation of MultiBoard Designs. Discover more about this feature in our brand-new short video.

Embedded thumbnail for Coming Soon: PCB Layout Replication
How-To's
Coming Soon: PCB Layout Replication

PCB Layout Replication allows quick replication of layouts for repetitive circuitry blocks in a flat PCB design. In this short video we will show you how this new tool (scheduled for release on December 13th) eliminates the need to do repetitive tasks manually or for various workarounds like snippets or multi-channel designs.

Blog
Access to your Training Certificates on My Altium

Introduce an update on the My Altium user page that highlights your certificates and tracks your training progress, with one-click access to the Training Dashboard and Training Catalog pages. Easily view and share your certificates, keep an eye on your learning journey, and explore a variety of training resources.

Blog
Rigid-Flex PCBs: Advantages and Challenges

In this article, we will begin with a basic explanation of how rigid-flex technology differs from rigid board technology. We will then provide an overview of the advantages and conclude with a discussion of the challenges to be aware of.

Design with Confidence: Altium 365 meets SiliconExpert
On-Demand Webinar
Design with Confidence: Altium 365 meets SiliconExpert

Learn how the SiliconExpert integration in Altium 365 can optimize your workflows and elevate your design process. Hear from experts from SiliconExpert and discover insights into data-driven design decisions. Also don't miss the chance to see the integration in action and explore improved risk analysis and alternative component discovery features.

Intrusive Soldering
Blog
When Should You Use Intrusive Soldering?

Through-hole components are frequently employed in power electronics, particularly when dealing with AC power from a wall outlet. In this article, you can delve into the intrusive soldering process and discover when it can be applied in PCB design.

Embedded thumbnail for Coming Soon: Constraint Manager
How-To's
Coming Soon: Constraint Manager

Constraint Manager simplifies PCB design by facilitating collaborative constraint definition from both Schematic and PCB. Learn more about this new feature, which streamlines the process of setting electrical clearances and creating rules while centralizing class management for time-saving convenience.

From PCB to MCAD - Designing a USB Isolator with Altium & SOLIDWORKS
On-Demand Webinar
From PCB to MCAD - Designing a USB Isolator with Altium & SOLIDWORKS

Dive into the world of Altium's MCAD CoDesigner and its compatibility with SOLIDWORKS. Watch the recording to explore a unified approach with a real-life project that will redefine your design process and find out more about how you can optimize your Electronic Lifecycle Management by bringing together all experts involved in product development.

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Simulation in Altium Designer
Debounce Circuit

Learn how to simulate the circuit, identify a common issue, and walk through how to diagnose and correct any errors found in a seemingly well-designed debounce circuit. 

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Blog
An Overview Of PCB Outer Layer Processing

Previously, I described the PCB fabrication operations relative to inner layer processing, lamination, drilling, and plating. The last step in the process is outer layer processing which is described below. Once the desired plated copper thickness of a PCB has been achieved, it’s necessary to etch away the copper between the features in order to define the outer layer pattern.

Blog
How Do Pads and Vias Impact Total Capacitor Parasitic Inductance?

There are many factors at play in determining the impact of inductance on high-frequency power distribution systems. Two topic areas, inductance of the decoupling capacitor and inductance of the power planes, were addressed in earlier articles. This article will focus on the inductance of the capacitor footprint and via inductance from the capacitor footprint back to the PCB power planes.

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Blog
Analyzing Crosstalk on FIFO and DDR4 Parallel Bus Interfaces

High-speed buses, whether single-ended or differential, can experience any number of signal integrity problems. A primary problem created by propagating signals is crosstalk, where a signal superimposes itself on a nearby trace. The industry-standard PCB design tools in Altium Designer® already include a post-layout simulator for examining crosstalk. Still, you can speed up crosstalk analysis in parallel buses when you use a powerful field solver.

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Blog
Amplifier Stability at High Frequencies and Stray Capacitance

Any time-dependent physical system with feedback and gain has conditions under which the system will reach stable behavior. Amplifier stability extends these concepts to amplifiers, where the system output can grow to an undesired saturated state due to unintended feedback. If you use the right design and simulation tools, you can easily account for potential instability in your circuit models before you create your layout.

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Blog
Working with Design Variants

The concept of design variants entails taking a single PCB design, and then on the assembly side, modifying specific components used in the design. Either by not installing, not installing, or choosing alternate components as replacements on a specific assembly to ultimately create different end products. In that way, you could support multiple product lines. This article describes the approach to working with variants. 

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Blog
Setting Up Concord Pro Revisions and Lifecycle

Before anything else, some advice. The revisions and lifecycle are an area that takes some planning. It used to be that Concord Pro was primarily for components, but now it has gone far beyond that. With the ability to store and manage many other items, including your various templates, projects, even PDF documents, not everything will have the same revision scheme. Concord Pro is so powerful that it can handle any revision scheme you’d want to set up.

Blog
How to Successfully Design a BGA

Whether the board will be placed in a high pressure vessel or underwater, your design will need to withstand pressure to avoid failure. On the enclosure side, your vessel should be rated up to a certain pressure and may require frequent cycling to prevent implosion. On the electronics side, component selection and layout (especially at high voltage) become critical to preventing failure and ensuring reliability.

Blog
Altium Designer 20.2 Update 1 is now available

The first update of Altium Designer 20.2 and Altium NEXUS Client 3.2 is now available. You can update through the Altium Designer update system ("Extensions and Updates") or download fresh builds from the Downloads section of the Altium website. Click on "Read More" to see a list of all changes in this update.

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Blog
How Copper Foil Roughness Affects Your Signals and Impedance

The history of engineering, both electrical and mechanical, is littered with approximations that have fallen by the wayside. These approximations worked well for a time and helped advance technology significantly over the decades. However, any model has limits on its applicability, and the typical RLCG transmission line model and frequency-independent impedance equations are no different. Copper foil roughness modeling and related transmission line impedance simulations are just one of many areas in which standard models cannot correctly treat signal behavior.

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Blog
What is Burn-in Testing for Electronics?

Once you’re planning for production of any new board, you’ll likely be planning a battery of tests for your new product. These tests often focus on functionality and, for high speed/high frequency boards, signal/power integrity. However, you may intend for your product to operate for an extreme period of time, and you’ll need some data to reliably place a lower limit on your product’s lifetime. In addition to in-circuit tests, functional tests, and possibly mechanical tests, the components and boards themselves can benefit from burn-in testing.

Blog
PCB Design for Testability to Ensure High Yield and Quality

If you remember your days in school, then you probably remember the feeling of happiness and celebration when you pass a big exam. You’ll feel the same sense of adulation when your board spin passes a barrage of pre and post assembly tests, but a complex design might not reach that stage unless you implement the right design for testability methods. There are some simple steps that can help your manufacturer identify and quickly implement important bare-board and in-circuit testing (ICT), especially on critical circuit blocks.

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Blog
Top Tips from Experienced Flex Designers

This article describes the best hints and tips for designers of rigid-flex circuits. These tips include choosing the most appropriate material, suggestions for coordinating the PCB with the manufacturer, and a set of rules to be followed while PCB design. 

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Blog
How Do Capacitor Mounting Structures And Footprints Impact Total Inductance?

There are a number of factors at play when it comes to the impact of inductance on high-frequency power distribution systems. This article will focus on the inductance of the capacitor footprint along with the inductance of vias from the capacitor footprint to the PCB power planes. Included are the various types and sizes of footprints for ceramic capacitors as well as a footprint for a tantalum capacitor; how changing the footprint impacts inductance and test results obtained for different capacitors.

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Blog
How to Perform Differential Pair Tuning in Altium Designer 20

In order to properly suppress common-mode noise, differential pairs must be routed in parallel, with perfect symmetry, and with matched lengths. In real PCBs, meeting these three objectives isn’t always possible. Instead of eyeing out your different pair lengths, the interactive routing tools in Altium Designer make differential pair length matching easy. You can encode permissible length mismatches as design rules as part of controlled impedance routing, or you can manually perform differential pair tuning using a variety of meandering styles. Here’s how this works in Altium Designer.

Blog
Driving Haptic Vibration and Feedback in Wearables

Augmented reality, virtual surgery, limb replacements, medical devices, and other new technologies need to incorporate haptic vibration motors and feedback to give the wearer a full sense of how they are interacting with their environment. Unless these cutting-edge applications include haptic vibration and feedback, users are forced to rely on their other four senses to understand the real or virtual environment.

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Blog
Back Drilling Example in Altium Designer: One of the Easiest Ways to Improve Signal Integrity

Over the last 20 years, electronic devices have become increasingly sophisticated. Less than two decades ago, just having a mobile phone to make calls was rare; today, our phones power our lives. To meet the growing demand for smartphone technology, technology has become faster, more functional, and intuitive. Improvements to the component base have streamlined processes while reducing manufacturing costs.

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Embedded thumbnail for Remove Unused Via Pads
How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

Embedded thumbnail for Tent Vias under BGA
How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Embedded thumbnail for Automatic Fanout With BGA
How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

Embedded thumbnail for Specifying NSMD and SMD for BGA
How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

Embedded thumbnail for Via Shielding and Stitching
Via Stitching
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

Embedded thumbnail for xSignals for DDR3 and DDR4
How To Work with High-Speed Projects
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

Embedded thumbnail for High-Speed Tuning
How To Work with High-Speed Projects
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

Embedded thumbnail for Using Document Parameters with Draftsman
How to Work with Draftsman
Using Document Parameters with Draftsman

The Draftsman Editor in Altium Designer uses document parameters to allow fine grain control over the draftsman document. We’ll show you how you can use the document parameters in your Draftsman document. 

Embedded thumbnail for High-Speed Features of Creating a Stack
How To Work with High-Speed Projects
High-Speed Features of Creating a Stack

The foundation of any high speed design is the layer stack. We’ll show you some of Altium Designer’s powerful layer stack creation features.

Embedded thumbnail for High-Speed Return Paths
How To Work with High-Speed Projects
High-Speed Return Paths

For high speed designs it is critical to maintain your return path for adequate signal integrity. We’ll show you how, using best practices and error resolutions in Altium Designer.

Embedded thumbnail for Working with Design Variants
How to Work with Draftsman
Working with Design Variants

Altium Designer’s Draftsman Document allows for several different board views and variants that you can work with. We’ll show you how to add new variants and work with their properties to display exactly what you need in your Draftsman Document

Embedded thumbnail for Creating Schematics in High-speed Projects
How To Work with High-Speed Projects
Creating Schematics in High-speed Projects

There are several powerful features in Altium Designer for creating schematics in high speed projects. We’ll show you a few, such as how to utilize nets, net classes, blankets, design rules, and differential pairs.

Embedded thumbnail for Creating Connectivity
How to Work with Multichannel Schematic
Creating Connectivity

Multichannel connectivity can be created in a few different ways. We’ll show you how to create connectivity using ports and net labels efficiently and effectively. 

Embedded thumbnail for Hierarchical Structure for High-Speed Projects
How To Work with High-Speed Projects
Hierarchical Structure for High-Speed Projects

A Hierarchical structure can make your high speed project much easier to navigate and complete. We’ll show you some tips and tricks for creating and maintaining a high speed. Hierarchical design project.

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