News & Updates
Watch the webinar to learn how the SiliconExpert Integration in Altium 365 can optimize your workflows and elevate your design process. Make data-driven design decisions!
Watch the webinar and learn from Altium's Director of Security, Bruno Blasigh, and Renata Lang, Altium 365 Product Marketing Manager, about designing PCBs that meet US government requirements using Altium 365's GovCloud.
Whether you're designing a high-speed PCB, or a complex embedded system, it will need some level of testing. In this article, we will show you some simple tricks that can make testing and debugging a prototype much easier.
Crosstalk is one of the most common issues related to electronics. Learn the basics of this phenomenon in PCB design, and gain knowledge on how to avoid it in your projects.
Preparing complex PCB designs can often keep you awake at night. Learn more about some of the most common issues encountered in multi-board electrical connections.
Introduce an update on the My Altium user page that highlights your certificates and tracks your training progress, with one-click access to the Training Dashboard and Training Catalog pages. Easily view and share your certificates, keep an eye on your learning journey, and explore a variety of training resources.
In this article, we will begin with a basic explanation of how rigid-flex technology differs from rigid board technology. We will then provide an overview of the advantages and conclude with a discussion of the challenges to be aware of.
Learn how the SiliconExpert integration in Altium 365 can optimize your workflows and elevate your design process. Hear from experts from SiliconExpert and discover insights into data-driven design decisions. Also don't miss the chance to see the integration in action and explore improved risk analysis and alternative component discovery features.
Through-hole components are frequently employed in power electronics, particularly when dealing with AC power from a wall outlet. In this article, you can delve into the intrusive soldering process and discover when it can be applied in PCB design.
Dive into the world of Altium's MCAD CoDesigner and its compatibility with SOLIDWORKS. Watch the recording to explore a unified approach with a real-life project that will redefine your design process and find out more about how you can optimize your Electronic Lifecycle Management by bringing together all experts involved in product development.
Multi-board designs are the key to meeting evolving demands, requiring robust PCB Harness Design for seamless interconnection and success. Join us as we explore the importance of PCB Harness Design capabilities and how they are crucial for the success of multi-board designs.
Looking for a way to reduce time and increase the accuracy of the manual assembly of PCBs? Watch this webinar recording for a transformative session and learn how XVP Photonics achieved these goals with Assembly Assistant!
Whether you purchase products off-the-shelf or online, they all come housed within an enclosure. In some cases, these enclosures are intentionally ruggedized to withstand harsh environments or mechanical shocks. You can learn more about enclosures in this new and interesting article.
Once you’ve finished your new project and you’re ready to push it to your manufacturer, you’ll normally be stuck in an endless email chain with an engineer, or you’ll have to share cloud links with each other. The cloud sharing and design release tools in Altium Designer and Altium Concord Pro are a huge help in this area. In this post, I’m going to take an existing project I’ve worked with in a number of recent blogs, create some fabrication and assembly documentation, and finally push this data to a manufacturer using Altium Concord Pro.
To this day, I still see many PCB layout “rules of thumb” that first became common nearly 20 years ago. Do these rules still universally apply? The answer is a firm “maybe.” The discussion around PCB layout rules of thumb is not that these rules are correct or incorrect. The problem is that the discussion around these rules often lacks context, leading to the always/never type of discussion seen in some popular forums. My goal in this article is to communicate the context behind the common PCB design rules.
As the operating speed of components has increased, controlled impedance is becoming more common in digital, analog, and mixed-signal systems. If the controlled impedance value for an interconnect is incorrect, it can be very difficult to identify this problem during an in-circuit test. However, testing is normally performed on a PCB test coupon, which is manufactured on the same panel as the PCB. If you want to get through board spins quickly and aid future designs, you might consider designing a test coupon and keeping it handy for future designs.
Altium’s DbLib support is one of the oldest and most loved features of Altium Designer for managing electronic components and their data. They’ve been present in the software world since before I could fathom the existence of Ohm’s law. Altium 20.1’s new Component Sync feature allows you to synchronize virtually any database or database Library with Altium 365, taking advantage of both approaches strengths.
If you’ve created your next great schematic, there is a lot going on behind the scenes in your design software. A schematic netlist is one of the central pieces of information that will be used in multiple features in your design software to create a real PCB. Your schematic netlist provides both electrical connectivity information, and reflects the functional structure of your design data in a single set of data.
An SMPS is one of those quiet (yet electrically noisy) devices that makes your favorite electronics run smoothly. Among the numerous DC-DC converter topologies, a buck converter finds plenty of uses for stepping down the input voltage to a lower level while providing high efficiency power conversion. A common question around component selection for these power converters is how to select an inductor for a buck converter. The goal in working with an inductor and other components in a buck converter is to limit power loss to heat and while minimizing current ripple.
GPS-capable devices range from your phone to your smartwatch; simply type in your destination and follow the directions. Simple, right? According to the Washington Post, we should all stop using GPS as it’s ruining the navigation centers of our brains. Despite the neurological effects on perception and judgment, the U.S. Department of Transportation (DOT) aims to find alternatives to GPS to provide redundancy.
The list of features available in Bluetooth just got a little longer since the release of Bluetooth 5.1. If you want to incorporate a Bluetooth 5.1 SoC into your new product, you have two primary options for bringing this component into your board. The first is as an SoC that mounts to your board just like any other component. The other option is to bring a module into your new board—directly onto the surface layer. Here’s what you need to know about a Bluetooth 5.1 SoC or module in your next IoT product.
Get Started with Altium 365 with a step-by-step guide and videos to experience the most connected experience for PCB design and realization: https://my.altium.com/altium-365/getting-started/
Since its introduction in the late 90s, the USB standard has never ceased to grow in popularity. There has been a growing trend toward USB being a power delivery interface with data, rather than a data interface that can supply power, as the 1.0 specification originally intended. To supply the increasing thirst for power over USB, the USB 3.0 Spec with Type-C began implementing the Power Delivery standard, which you should consider using for your next electronics project.
There are many types of circuit board tests available in electronics manufacturing today, each having unique goals and characteristics. This article presents guidelines at the design level (schematic and layout) to enable the use of in-circuit testing (ICT) fixtures to verify proper component assembly. These simple test fixtures allow your board to be tested as its assembled, which helps identify and remove failed boards from your production run.
Technological advancements have been a hallmark of the past few decades, from the widespread adoption of internet technology to the smartphones and wireless devices we rely on every day to stay connected. Orlan Thatcher, Board Layout Specialist at Cirris Systems, could never have predicted the demand their services would generate. The company struggled with six different software platforms before switching to Altium Designer.
I used to work in a research lab that worked primarily with RFID (Radio Frequency IDentification) and NFC (Near Field Communication) technology, particularly for the agriculture industry and cattle identification. These were very specialized fields; however, the lab also worked on projects which involved retail and various other applications for NFC. It’s an amazing technology that you might be using every day without thinking about it - building access to your mobile phone payments, for instance.
You need to define your PCB geometry in the context of your enclosure. If your board cannot physically be assembled into the final product, it doesn't matter how well laid out it is electrically. This webinar focuses on how the MCAD CoDesigner allows you to edit your PCB in the context of a higher-level assembly, allowing you to respect the relevant mechanical constraints.
In Part 1 of this article, I described the first steps that occur during the PCB fabrication process. They detailed the inner layer processing effort as well as the efforts that take place during the transition from inner layer processing to lamination. This part of the article will provide a detailed description of the lamination, drilling and plating processes.
There are still a number of designers - perhaps most of them - who have never toured a PCB fabrication facility. They are also unaware of the various steps that occur during the fabrication process. The purpose of this article is to describe those steps and what transpires in each of them. Part 1 of this article focuses on inner layer processing and the steps that are done prior the lamination process.