Results
Read our brand-new article where we explore the key areas of an engineering project and the different stages of electronic product development from a project execution perspective. From initiation and planning to design, development, validation, testing, and certification, we walk you through each phase to help you understand how successful electronic products are brought to life.
This article highlights how seemingly minor layout choices like trace spacing, component footprints, or stack-up details can dramatically impact whether a board passes fabrication and assembly the first time.
Designing with supply chain principles in mind helps you avoid delays, reduce costs, and ensure manufacturability. This article outlines practical strategies for component selection, sourcing, and lifecycle management to make your designs more resilient and production-ready.
Learn how proactive component selection helps you avoid supply chain risks, reduce costs, and design more reliably. Our new article outlines key strategies and shows how tools like Altium 365 support smarter part decisions.
Power problems can be hard to spot until it’s too late. See how easy it is to analyze your power nets, check voltage drops, and improve reliability with Power Analyzer by Keysight - all without leaving your design environment.
Signal issues can sneak in early and cost you later. Read our whitepaper to see how Signal Analyzer by Keysight (inside Altium Designer) helps you catch problems fast and design with confidence.
Learn how to enhance part selection by using real-time supply chain data. This article shows how integrating insights like availability and lifecycle status helps you make smarter, risk-aware design choices.
See how the Signal Analyzer by Keysight in Altium Designer lets you run signal integrity checks directly within your design environment. Read our article to learn how to effectively manage impedance, return paths, stackups, and more.
Ensure power and signal integrity with the Keysight Bundle in Altium Designer. Catch issues early, reduce rework, and optimize your PCBs - all within one integrated environment featuring Signal & Power Analyzer.
If you’ve taken time to learn about PCB material options and layer constructions, you have probably seen the wide range of materials that are available on the market. Materials companies produce laminates with varying Dk values, Tg values, weave styles, CTI values, and mechanical properties to target various applications in the electronics industry.
If you’re waiting for truly connected cars on a grand scale, there is still a massive amount of work to be done, both on the hardware and software sides. Connected cars can only become a widespread reality once the automotive industry and telecom carriers can decide which protocol will work best for vehicle-to-everything (V2X) communication. PCB designers will then need to step in to create these systems and fit them into a vehicular environment.
This one area of PCB design can be contentious among some designers as it is related to copper pour, which it is often stated is not needed in most designs. Regardless of your feelings about copper pour, stitching vias have important uses in PCBs at low frequencies and at high frequencies.
The IPC-2221 standard includes many requirements for printed circuit board design and manufacturability, and there are several online calculators that have been developed based on this standard.
When you’re ready to manufacture a new device at production volume, there are many aspects of the product that must come together. The enclosure, cabling and connectors, embedded software/firmware, and of course the PCBA all have to be considered in totality. There is a quick way to get your product into a usable enclosure, complete with input power and cabling, and with a form factor that fits your PCBA. This overused route to a new product is a box build assembly.
Printed circuit board fabricators have become skilled at manufacturing these technologies and also at understanding the reliability and producibility challenges associated with high-density-interconnect technology. Let’s look at where the PCB industry is at today.
What can the industry do to support PCB designers as they continue taking a more active role in product development? Here at Altium, there has been a progressive shift towards looking at the system level and creating tools that get designers more involved throughout the product development process. As the saying goes, over the wall engineering is over… today’s most successful products are built in a collaborative process.
As the 5G rollout progresses and researchers continue to discuss 6G, many new 5G-capable products operating in sub-GHz and mmWave bands are reaching the marketplace. Devices that will include a 5G-compatible front-end, whether small stations/repeaters or handheld devices, use phased arrays as high-gain antenna systems to provide high data throughput without losing range at higher frequencies.
Via protection is an important part of modern PCB design. It provides additional benefits in PCB manufacturing and assembly, increasing the number of acceptable products.
Power integrity problems can abound in modern PCBs, especially high-speed boards that run with fast edge rates. These systems require precise design of the PDN impedance to ensure stable power is always delivered throughout the system.
A design project doesn’t appear out of nowhere. The design process spreads over time, and project documents change. Schematic documents gradually become more complex, new functional blocks appear, and already finished parts can be modified and updated.
We are happy to announce that the Altium Designer 22.11 update is now available. Altium Designer 22.11 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!
Capacitance is your friend whenever you need stable power integrity, which is why there is so much focus on decoupling capacitors. While these components are important and they can be used to provide targeted power integrity solutions to certain components, there is one specialty material used to supercharge capacitance in your PCB stackup or package substrate.
The problems you can experience with components and libraries are endless. These problems are the most significant source of design issues and the biggest reason behind respins, costing companies untold amounts of lost profit annually.
If you want to have a better understanding of how to use Altium 365 to maintain a strong and centralized library that is free of problems and headaches, you may want to consider attending this lecture.
As much as we would like to build every high speed PCB perfectly, with ideal SI/PI/EMI characteristics, it isn’t always possible due to many practical constraints. Sometimes a stackup can be “good enough,” even for a high-speed PCB. This always comes from the need to balance engineering constraints, functional requirements, and the need to ensure signal and power integrity in a high-speed design, and finally to ensure compliance with EMC requirements.
Involving the whole team that will bring a product to completion early on in the development cycle is vital to efficient development. Design reviews with all the relevant parties are critical at each step of the design process, starting with high-level component selection, then through the schematic capture and PCB layout stages.
