Results
Targeted at procurement professionals in the automotive industry, the article outlines the evolving pressures of sourcing components for electrified and connected vehicles. It highlights Octopart’s ecosystem as a unified tool that centralizes availability, compliance, pricing, and lifecycle intelligence to optimize sourcing efficiency.
"Stack‑Up to Success" highlights how a carefully planned PCB stack‑up is foundational to preventing warpage, managing impedance, and avoiding manufacturing delays by clearly communicating layer construction, materials, and tolerance requirements to fabricators.
Gain a clear understanding of the fundamental elements within integrated circuits. This guide examines their structure, function, and role in system performance, knowledge that’s vital for anyone involved in sourcing or developing electronic designs.
Misaligned connectors can cause major issues in multi-board assemblies. In this article, David Marrakchi shows how Altium’s 3D tools help detect and fix alignment problems early in the design process.
Dive into the power of Renesas’ RA8D1 MCU using the EK‑RA8D1 evaluation kit. Learn how to train, test, and deploy image‑based detection models seamlessly with Edge Impulse, and kickstart your embedded vision AI projects in minutes.
Originally built for software development, Jira has become a popular tool for agile project management across various industries. Our new article explores how hardware teams can leverage core Jira features and adapt agile principles to suit the unique needs of hardware development.
Discover why top electronics companies are replacing spreadsheets with purpose-built BOM management solutions. This whitepaper outlines the risks of outdated methods, offers a readiness checklist, and explores how BOM Portal helps teams cut costs, reduce risk, and speed up development with smarter, data-driven workflows.
Material and process choices play a key role in high-performance PCB design. This article highlights how stack-up configuration, substrate selection, and lamination strategy impact signal integrity, reliability, and manufacturability.
Even with all the good guidelines out there for high speed design, there are particular aspects of stackup construction and their relation to building boards that get overlooked. This blog is goes beyond just the typical SI/PI guidelines and looks at these problems from more of an engineering perspective.
With the latest update to task assignment notifications, project-level and workspace-level tasks will send notifications when events are assigned, or a user is mentioned in a task’s comment. The notifications ensure that people are notified and fully engaged even when they are not actively working on a given project.
Stitching vias are something you often see spread around the surface layer of a PCB, but what are they? and should you be using them? In this guide, we'll go over some of the standard uses of stitching vias and when they should be used in a PCB.
This feature allows you to upload and attach any simulation file to an Altium 365 project. A strict association with the project makes the files easily accessible and traceable for any project collaborators or audit purposes.
In comparison to the build-up of a PCB, the stackup is more concerned with the electrical type of each layer, that is are we working with signals, power, or ground. Continue reading to learn how you can optimize your layer stack.
Transformers used for 50/60 Hz power conversion must be physically larger than those used in wall-warts. Read this article and you will understand why.
Altium’s VP of marketing Lawrence Romine discusses the multi-board and harness design capabilities coming in Altium Designer 23.
Controlled ESR capacitors are important for power integrity in your design as they can help smooth out the PDN impedance spectrum in your high speed PCB.
Due to the great success of the first Altium 365 PCB Competition—in terms of submissions and feedback we received—we partnered with Phil’s Lab for a second edition. This time, we designed a real board that includes some common mistakes. If you find at least one mistake in this PCB design, you can enter a draw to win a $200 gift card!
Whenever we say something to the effect of “components can’t work without a correctly designed PCB,” we only have to look at component packaging for evidence. It is true that component packages come with parasitics that affect signal integrity, but there is one area that we don’t often look at in terms of component packaging: power integrity.
The Assembly App helps reduce the time and increase the accuracy of the manual assembly of printed-circuit boards (prototypes or short runs). Engineers no longer need to flip through paper printouts or navigate CAD software while working on board assembly.
In this article, we’ll look at all that is required to start creating your own custom microcontroller-based hardware designs. You’ll see that there actually isn’t too much to this, as microcontroller manufacturers over the years have tried to make the learning curve less steep and their devices more, and more accessible. This is both from an electrical point of view but also – equally importantly – from a programming point of view.
