Results
Forget one-shot AI hacks Ari Mahpour shows the thoughtful, sustainable way to integrate AI into embedded firmware development. Learn the core principles (planning gate, HAL abstraction, observability, timeout design) that can help you push your efficiency 5-10 times in real hardware projects.
Join Altium at PCB West 2025 in Santa Clara, CA, on October 1! Stop by Booth 300 for the official launch of the new Altium platform, built on the foundation of Altium Designer and Altium 365. Be sure to check out our live demos of Altium Develop and Altium Agile.
Moving from single-board to multi-board systems is a leap in complexity. You must manage not just routing, but power, signal integrity, mechanical fit, and regulatory requirements across boards. In this article, you’ll discover how Altium’s advanced simulation and compliance tools help engineering teams overcome these challenges and deliver reliable multi-board solutions.
As electronics continue to miniaturize and functionality increases, even minor misalignments between enclosures and connectors can derail a project. This article explores how early integration of ECAD and MCAD workflows helps detect and eliminate those costly issues before the first prototype is built.
Electronics hardware development is falling behind broader product development disciplines due to fragmented workflows, poor collaboration, and limited compliance visibility. This gap introduces risk, delays, and missed opportunities but executives see real business value in modernizing electronics development through better integration, traceability, and lifecycle visibility.
High-mix, low-volume (HMLV) electronics manufacturing requires agile sourcing strategies to handle shifting BOMs, erratic lead times, and component volatility. All while controlling costs and ensuring compliance. Cloud-based tools like Altium provide real-time component visibility, BOM collaboration, and supplier integrations to help navigate HMLV complexities.
As robotics systems become increasingly miniaturized and intricate, ensuring perfect fit, form, and function across electrical and mechanical domains is critical to avoid design setbacks. Real-time ECAD-MCAD integration with two-way sync empowers teams to streamline workflows, reduce PCB rework, and deliver more reliable designs faster.
We are excited to announce the launch of three new platform-based solutions that will transform the way electronic products are designed, built, and delivered: Altium Discover, Altium Develop, and Altium Agile. These solutions are designed to simplify processes, accelerate innovation, and make collaboration seamless across the entire electronics lifecycle. Together, they realize the purpose of Altium and Renesas: To Make Our Lives Easier.
Discover how short-sighted ordering practices fuel volatility in the semiconductor market and why smarter, data-driven approaches are key to building resilience and sustainability.
Even with all the good guidelines out there for high speed design, there are particular aspects of stackup construction and their relation to building boards that get overlooked. This blog is goes beyond just the typical SI/PI guidelines and looks at these problems from more of an engineering perspective.
With the latest update to task assignment notifications, project-level and workspace-level tasks will send notifications when events are assigned, or a user is mentioned in a task’s comment. The notifications ensure that people are notified and fully engaged even when they are not actively working on a given project.
Stitching vias are something you often see spread around the surface layer of a PCB, but what are they? and should you be using them? In this guide, we'll go over some of the standard uses of stitching vias and when they should be used in a PCB.
This feature allows you to upload and attach any simulation file to an Altium 365 project. A strict association with the project makes the files easily accessible and traceable for any project collaborators or audit purposes.
In comparison to the build-up of a PCB, the stackup is more concerned with the electrical type of each layer, that is are we working with signals, power, or ground. Continue reading to learn how you can optimize your layer stack.
Transformers used for 50/60 Hz power conversion must be physically larger than those used in wall-warts. Read this article and you will understand why.
Altium’s VP of marketing Lawrence Romine discusses the multi-board and harness design capabilities coming in Altium Designer 23.
Controlled ESR capacitors are important for power integrity in your design as they can help smooth out the PDN impedance spectrum in your high speed PCB.
Due to the great success of the first Altium 365 PCB Competition—in terms of submissions and feedback we received—we partnered with Phil’s Lab for a second edition. This time, we designed a real board that includes some common mistakes. If you find at least one mistake in this PCB design, you can enter a draw to win a $200 gift card!
Whenever we say something to the effect of “components can’t work without a correctly designed PCB,” we only have to look at component packaging for evidence. It is true that component packages come with parasitics that affect signal integrity, but there is one area that we don’t often look at in terms of component packaging: power integrity.
The Assembly App helps reduce the time and increase the accuracy of the manual assembly of printed-circuit boards (prototypes or short runs). Engineers no longer need to flip through paper printouts or navigate CAD software while working on board assembly.
In this article, we’ll look at all that is required to start creating your own custom microcontroller-based hardware designs. You’ll see that there actually isn’t too much to this, as microcontroller manufacturers over the years have tried to make the learning curve less steep and their devices more, and more accessible. This is both from an electrical point of view but also – equally importantly – from a programming point of view.
If you’ve taken time to learn about PCB material options and layer constructions, you have probably seen the wide range of materials that are available on the market. Materials companies produce laminates with varying Dk values, Tg values, weave styles, CTI values, and mechanical properties to target various applications in the electronics industry.
