Results
Learn the six essential topics every electronics team should address in design reviews to improve quality, avoid surprises and bring products to market faster.
From design to production, effective Bill of Materials (BOM) management is critical to ensuring smooth collaboration between engineering, procurement, and manufacturing teams. In this practical guide, we break down proven strategies for structuring, maintaining, and synchronizing your BOM to prevent costly mistakes and accelerate time-to-market.
This series of guided demos shows how the Altium Requirements Portal transforms scattered requirement spreadsheets and emails into traceable, version-controlled data that stays aligned with your PCB design efforts.
Discover when a rigid-flex PCB is a better choice than a separate flex circuit and connector, especially for designs requiring compact packaging, repeated motion or high reliability. The article emphasizes that although rigid-flex needs more upfront planning and fabrication collaboration, it often pays off in simpler assemblies and improved performance.
As vehicles evolve into advanced electronic systems, the separation between electrical and mechanical design teams becomes a critical bottleneck. This article explores how synchronized ECAD–MCAD workflows help automotive projects move faster, reduce rework and maintain design integrity.
We all want to pack more into our PCB designs, but the smallest via isn’t always the smartest one. Dive in to learn how picking the right structure can save you headaches down the line.
Structural electronics integrates electronic functionality directly into the physical structure of a product, eliminating the need for traditional circuit boards. This article examines how advances in materials, additive manufacturing, and flexible substrates are enabling compact, 3D, and wearable systems with enhanced performance and design freedom.
In ultra-HDI designs, soldermask is no longer a passive coating but a pivotal element that can determine manufacturability. This article explores why mask registration, resolution, and feature tolerances become critical as line spacings shrink below 50 µm.
When the margin for error is nearly zero, aerospace engineering demands a design process that’s seamless across all domains. Here, we explore how ECAD-MCAD co-design delivers an integrated workflow that supports first-pass success and compliance with strict aerospace standards.
The latest version of Altium MCAD CoDesigner is here! The 3.5.0 version of Altium MCAD CoDesigner brings several new features and enhancements.
Join us on August 23 at 10 am PDT for a new exciting #webinar! Learn how the SiliconExpert integration in Altium 365 can optimize your workflows and elevate your design process. Hear from experts from SiliconExpert and discover insights into data-driven design decisions. Also don't miss the chance to see the integration in action and explore improved risk analysis and alternative component discovery features.
RF power amplifiers can be found in many wireless products, often integrated into chipsets or modems. However, in certain specialized systems, you might require higher power output at a specific frequency. This necessitates a discrete amplifier circuit to deliver that power. In this article, we present an example project for a power amplifier that you can incorporate into your RF project.
Simulation tools are extremely useful for understanding electromagnetic behavior in a design. Learn more about how to avoid obtaining inaccurate results during your PCB simulation process.
We are grateful to our beta testers for their valuable feedback. Your insights and suggestions have helped us significantly improve the product, and we couldn't have done it without you.
Altium has achieved CMMC Level 1 self-assessment, demonstrating our commitment to security. Users benefit from enhanced data protection, trusted relationships, access to SPRS scores, and CMMC 2.0 compliance. Organizations can leverage Altium 365 GovCloud to satisfy CMMC 2.0 requirements.
We are excited to announce the newest Altium 365 application which will connect design and procurement in the early stages of the hardware development process. You can now begin forecasting risks and costs from the moment the first components are selected. Our new BOM Manager is now in open beta. Request access now.
When designing the power supply for your device, there are lots of different options. In this article, we will take a brief tour of the main choices in DC power supply design.
Learn more about the combination of using both flexible materials and ultra-HDI feature sizes in this article.
Troubleshooting power supply current handling issues is crucial to achieving optimal performance of your electronic devices. In this article, we will explore the common reasons why a power supply fails to handle the defined output current and provide practical solutions to solving these issues.
We're thrilled to announce our new integration of SiliconExpert into Altium365! Streamline your design workflow, mitigate risks, and enhance decision-making with comprehensive, reliable, and accurate component data. Compliance management? Made easier. Component selection? More efficient. Risk analysis? With one click.
Next step in our open-source laptop project is to explain how to design cooling and airflow. In this article, we can show you the first part of this process, such as airflow concept, fan measurement and clearance.
Many modern electronics have multiple boards, and connecting those different boards and systems together are harnesses. Learn more about how Altium Designer can help you create harnesses for your own multi-board designs here.
We invite you to explore the causes of output voltage fluctuation. In this article we provide you insights on how to solve and prevent these issues.
In this article we will show you how to create step by step a digital laser range finder for your own. Everything is based on Raspberry Pi board.
Learn how easy it is to create multi-board projects. This practical project article covers the reasons for breaking larger boards into sub-assemblies and explores the various connection options available between sub-assembly boards.
