Results
As data rates increase, the risks hidden in your layout grow with them. This quick guide highlights the critical SI checkpoints that can save you from late-stage surprises and redesigns. If you design high-speed boards, you’ll want to read this before your next review.
Don’t walk into supplier talks blind. Use market data to benchmark quotes, check lead times and uncover alternate parts. This article shows how visibility can shift the balance and de-risk your BOM.
Designing rigid-flex boards is like solving a 3D puzzle of materials, bends and tight spaces, and via-in-pad might just be the piece you need. Dive into how and when to use via-in-pad in rigid-flex designs, and what to watch out for from fabrication to field reliability.
This whitepaper examines how next-generation wearable electronics are evolving through advancements in flexible and rigid-flex design, smart materials, AI, energy innovations, and connectivity. Discover what’s required to transform early prototypes into scalable, reliable products across healthcare, sports, defense, fashion, and enterprise applications.
Electronic parts may now cycle from launch to end-of-life in just a few years, but many systems are expected to serve for 10–20+ years. Here’s how to build a component selection process that aligns engineering, procurement and design for longevity and stability.
As component lead-times extend and obsolescence becomes a persistent threat, PCB projects demand more than schematic capture and layout tools alone. This article details how ECAD software with embedded supply-chain intelligence can: unify engineering and procurement teams; provide visibility into stock levels, lead times and alternates; and enable proactive risk mitigation within the design loop.
In complex electronic systems, managing data from multiple printed circuit boards can quickly become a logistical challenge. This article outlines a structured workflow for handling both board-level and assembly-level design outputs, ensuring clarity and consistency across fabrication, assembly and product-level documentation.
Learn the six essential topics every electronics team should address in design reviews to improve quality, avoid surprises and bring products to market faster.
The highest performing operational amplifiers often need a split supply with positive and negative voltages connected to the op amps supply rails. In this project, we’re going to be building a positive/negative dual rail power supply for a differential oscilloscope probe I’m designing. I’m making the power supply a separate project, as a dual rail supply is quite useful to have, and I’m sure I’ll find multiple uses for it in the future.
Importing file-based libraries from your local computer or network drive to your Altium 365 workspace can be done using the Library Importer. Altium’s Library Migrator was renamed Library Importer—the feature’s name was changed to conform more closely to the tool’s purpose. Not only is its name new, but our team has also made several user experience improvements. We have updated the documentation to reflect this change.
The PCB materials industry has spent significant amounts of time developing materials that provide lowest possible signal loss for products with RF applications. For high speed and high frequency designs, losses will limit signal propagation distance and distort signals, and it will create an impedance deviation that can be seen in TDR measurements. In this article, we'll look at the balance between copper foil losses and other types of losses in a PCB, as well as some strategies that are commonly used to overcome roughness.
We are happy to announce that the Altium Designer 22.8 update is now available. Altium Designer 22.8 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!
In this article, we’ll look at beamforming implementation in an advanced method combining analog and digital techniques, known as hybrid beamforming. This method blends both digital and analog techniques to create multiple beams and thus reach multiple users with varying intensities. In the case of an RF imaging system or a radar system, hybrid beamforming in a MIMO technique also allows tracking of multiple targets with adjustable resolution.
The problem with every via impedance calculator that I have seen is simple: they are incomplete or totally wrong. The “incomplete” part refers to a lack of context; these calculators can roughly reproduce a well-known estimate from a legend like Howard Johnson in his Digital Design textbooks. However, these calculators never provide insight into what they are actually calculating, or where the calculated via impedance is accurate. Keep reading to see why these calculators get it so wrong, as well as the context surrounding via impedance.
When designing high power circuits (usually very high voltage and/or current), you’ll need to create a regulator from scratch and place it in your PCB layout. It's also the case that you may want to model a real component using discretes in a simulation in order to qualify the system's expected operating regime. As part of buck converter design, you can easily run a buck converter simulation directly in Altium Designer’s schematic editor. Here’s how you can access these features in the newest version of Altium Designer.
Just as you get used to PCIe 5.0, they decide to release another standard! The newest iteration of PCIe is Gen6, or PCIe 6.0. PCIe 6.0 brings a doubling of channel bandwidth through introduction of PAM-4 as the signaling method in high-speed differential channels. This signaling method is a first for PCIe, and it’s an important enabler of the doubled data rate we see in the current standard. In this article, I’ll run over the important points in the standard and what PCB designers can expect when designing these channels.
One of the common implementations of SPI and I2C in a PCB layout is as a protocol for reading and writing to an external Flash memory. Flash chips are a very common component in embedded systems and can offer high capacities of non-volatile memory up to Gb values. When choosing a memory chip, you'll want to match the application requirements and functionality with the bus speed you need for read and write operations in your memory chip. There is also the matter of the type of Flash memory you'll need to access (NOR vs. NAND).
There is no SPI trace impedance requirement? The reality is that SPI lines only start to need impedance control when the length of the interconnect becomes very long. And because there is no specific impedance requirement in the bus, you have some freedom in channel design and termination. So what exactly qualifies as “very long” and when is some termination method needed? We’ll break it down in this article.
During this year's AltiumLive CONNECT event, I recall receiving an interesting question about the skin effect and the distribution of current due to the presence of ground in coplanar transmission lines. In this article, we'll look at the electric field around a transmission line carrying a signal, and how this might be impacted by the skin effect.
When you get your PCBA back from an assembler, you’ll notice the packaging materials used to pack and ship the PCBA. Those materials are specific to electronics, and if you build products on behalf of clients, it’s important to know the packaging materials used for packing and shipping electronics. In this article I’ll show the main set of materials and equipment used to package electronics assemblies.
Once you've got your PCB layout finished and you're ready to start preparing for manufacturing, one of the critical steps is to create PCB Gerber files. When you're ready to create your Gerber files, you need the right set of CAM processor tools that can take data from your PCB layout. In this article, we'll guide you through this process of how to make PCB Gerber files and show some example tasks you might need to perform to generate them.
One of the major factors impacting reliability of a PCBA is the use of teardrops on traces in the PCB. Like many aspects of reliability, the considerations also span into the signal integrity domain, particularly as more high-reliability products require greater data handling capabilities and run at higher speeds. In this article, I’ll break down the issues present in teardrop usage on differential pairs and how these may affect impedance.
High-reliability electronics must go through multiple rounds of testing and qualification to ensure they can withstand their intended operating environment. Designing to performance standards, whether the baseline IPC standards or more stringent industry standards, is the first step in ensuring a reliable circuit board. In this e-book, readers will gain a thorough look into PCB testing and analysis, starting from basic tests performed on bare boards and completed assemblies.
Coupling capacitors find plenty of uses in analog applications and on differential protocols, acting essentially as high pass filters that remove DC bias carried seen on a signal. In the case of PCIe, there are a few reasons to place AC coupling capacitors on differential pairs beyond the fact that AC coupling capacitors are listed in the standard. In this article, we’ll look briefly at where to place coupling capacitors on PCIe links, as well as the reasons these are placed on PCIe links.
