Results
As data rates increase, the risks hidden in your layout grow with them. This quick guide highlights the critical SI checkpoints that can save you from late-stage surprises and redesigns. If you design high-speed boards, you’ll want to read this before your next review.
Don’t walk into supplier talks blind. Use market data to benchmark quotes, check lead times and uncover alternate parts. This article shows how visibility can shift the balance and de-risk your BOM.
Designing rigid-flex boards is like solving a 3D puzzle of materials, bends and tight spaces, and via-in-pad might just be the piece you need. Dive into how and when to use via-in-pad in rigid-flex designs, and what to watch out for from fabrication to field reliability.
This whitepaper examines how next-generation wearable electronics are evolving through advancements in flexible and rigid-flex design, smart materials, AI, energy innovations, and connectivity. Discover what’s required to transform early prototypes into scalable, reliable products across healthcare, sports, defense, fashion, and enterprise applications.
Electronic parts may now cycle from launch to end-of-life in just a few years, but many systems are expected to serve for 10–20+ years. Here’s how to build a component selection process that aligns engineering, procurement and design for longevity and stability.
As component lead-times extend and obsolescence becomes a persistent threat, PCB projects demand more than schematic capture and layout tools alone. This article details how ECAD software with embedded supply-chain intelligence can: unify engineering and procurement teams; provide visibility into stock levels, lead times and alternates; and enable proactive risk mitigation within the design loop.
In complex electronic systems, managing data from multiple printed circuit boards can quickly become a logistical challenge. This article outlines a structured workflow for handling both board-level and assembly-level design outputs, ensuring clarity and consistency across fabrication, assembly and product-level documentation.
Learn the six essential topics every electronics team should address in design reviews to improve quality, avoid surprises and bring products to market faster.
HDI PCBs take a particular approach to routing interconnects through multiple layers to ensure reliability during fabrication, assembly, and operation. The critical structure that enables this is microvias, which are prone to failure if not designed properly. In this e-book, readers will receive an initial look at the reasons microvia reliability has come into the spotlight and why HDI PCB designers put reliability first when routing through microvias.
Introducing Altium 365 GovCloud - a dedicated region of the Altium 365 cloud platform designed for regulated companies and organizations handling sensitive data.
The newest release of MCAD CoDesigner 3.4.0 is finally here, and it comes packed with amazing features and improvements that will change how you work.
We're proud to announce the PCB Design Review Challenge winners by Altium. ? Thank you to all the participants of this competition, and congratulations to the lucky winners!
Aside from impedance and annular ring calculations, one of the other major formulas specified in the IPC 2221 standard relates temperature rise, trace width, and trace current. THere is also the IPC-2152 standard, both include this guidance on designing for thermal reliability, but which standard should we use?
We are delighted to announce the release of a new feature that allows you to view multiple PCB documents in your project, including panel PCBs. This feature streamlines your design process, enabling you to access and collaborate on your entire PCB design in one central location.
Altium 365 has enhanced its compare capabilities by adding PCB Compare operations between different commits/releases of managed projects. This latest feature, which complements Altium 365's existing compare capabilities for schematic, BOM, and Gerber files, provides users with comprehensive tools for reviewing and analyzing design changes.
Striplines provide some advantages over microstrips as they take advantage of natural shielding and coupling from nearby ground plane layers. Although they tend to experience higher losses due to total confinement in the dielectric, they can be thinner due to the high dielectric constant used in internal layers of a PCB. Use our free impedence calculator to help you determine the correct width needed to hit a target impedance.
Altium Designer now offers the added capability to share project history reports with third-party entities in PDF format, while enabling users to save them as release artifacts for backup and internal auditing purposes.
An optoisolator is a cool electronic device that can be used to pass information between a diode without passing an electrical current. There are many great applications for these, but do you know which one is right for you?
The Properties panel provides access to the properties of documents and objects. The contents of the panel change depending on the active document or the selected object. This blog will quickly go over some of need to know options around the properties panel in the schematic document.
The revision-controlled part choice enforces special control over parts. Each set of modifications is captured in a snapshot of the item record called a revision. Each revision represents the state of that item at a particular instance in time. When a new revision is created, the previous revision of the item is permanently locked and cannot be changed.
