News & Updates

Sending a board out for fabrication is an exciting and nerve-wracking moment. Why not just give your fabricator your design files and let them figure it out? There are a few reasons for this, but it means the responsibility comes back to you as the designer to produce manufacturing files and documentation for your PCB. It’s actually quite simple if you have the right design tools. We’ll look at how you can do this inside your PCB layout and how this will help you quickly generate data for your manufacturer.

As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

Quite often, a standard assembly drawing is not enough to ensure the quality of a PCB assembly, especially when designing high-density boards. It would also be helpful to include additional detailing for simpler devices. The use of a Draftsman document brings an elegant, yet powerful solution to make these tasks easier.

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

You’ve possibly gone through plenty of engineering design reviews, both on the front-end of a project and the back-end before manufacturing. Engineering design reviews are performed to accomplish multiple objectives, and with many engineering teams taking a systems-based approach to design and production, electronics design teams will need to review much more than just a PCB layout and BOM. Today’s challenges with sourcing, manufacturability, reliability, and mechanical constraints are all areas that must be confronted in real designs

One of the most common points of failure of a device occurs even before you start to layout your circuit board. Mistakes in your schematic design can easily make their way all the way into prototypes or production without a second thought once layout starts. In this article, I’m not going to extol the virtues of a good schematic design. Instead, this article is a simple no frills checklist.

One common question from designers is current-carrying capacity of conductors in a PCB. Trace and via current-carrying capacity are legitimate design points to focus on when designing a new board that will carry high current. The goal is to keep conductor temperatures below some appropriate limit, which then helps keep components on the board cool. Let’s dig into the current state of thermal demands on vias in PCBs and how they compare to internal and external PCB traces.

A combination of good printed circuit board design and good shielding mitigates EMI. Good PCB design for EMI shielding revolves around the layout, the placement of filters, and ground planes. A well-designed PCB minimizes parasitic capacitance and ground loops. Keep reading to learn more about PCB shielding.

Any project can get very complex, and the PCB design team needs to track revisions throughout a project. Why worry about tracking revisions? In the event you ever receive changes to product functional requirements, major changes are made to your product’s architecture, or you’re ready to finalize the design and prepare for fabrication, it’s best to clone a project at its current state and begin working on a new version. Keeping track of all these design changes in a PCB design project takes the type of hardware version control tools you’ll find in Altium 365™.

To pour or not to pour, to stitch or not to stitch… Over many years, some common “rules of thumb” have become very popular and, ultimately, taken a bit out of context. Rules of thumb are not always wrong, but taking PCB design recommendations out of context helps justify bad design practices, and it can even affect the producibility of your board. Like many aspects of a physical PCB layout, via stitching and copper pour can be like acid: quite useful if implemented properly, but also dangerous if used indiscriminately.

Power MOSFETs enable a huge range of electronic systems, specifically in situations where BJTs are not useful or efficient. MOSFETs can be used in high current systems in parallel arrangements, but what about their use in series? Both arrangements of MOSFETs have their pitfalls that designers should consider. Let’s look at MOSFETs in series as they are quite useful in certain systems, but be careful to design your circuits and your PCB for reliability.

I can’t think of a single product I’ve built that doesn’t require capacitors. We often talk a lot about effective series inductance (ESL) in capacitors and its effects on power integrity. What about effective series resistance (ESR)? Is there a technique you can use to determine the appropriate level of resistance, and can you use ESR to your advantage?

If your goal is to hit a target impedance, and you’re worried about how nearby pour might affect impedance, you can get closer than the limits set by the 3W rule. But what are the effects on losses? If the reason for this question isn’t obvious, or if you’re not up-to-date on the finer points of transmission line design, then keep reading to see how nearby ground pour can affect losses in impedance-controlled interconnects.