News & Updates
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Check out our new article explaining how to ensure sufficient pad area for soldering, manage misregistration tolerance, and maintain proper solder dams between components. It also highlights the role of collaboration with fabrication houses and the use of CAD tools in defining land patterns for advanced electronics designs.
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We continue our exploration of the Pi.MX8 open-source computer module project. In this new installment, we focus on routing planning and then cover all the layers' routing with all the details you need to know if you want to prepare a similar project.
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Check our compilation of essential resources you'll need to use blind and buried vias successfully in an HDI PCB. In our brand new article, we present the main and most valuable information about this technology, which may not be new but is still highly useful in High-Density Interconnect projects.
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Discover how Penn Electric Racing builds award-winning, fully electric racecars with Altium 365, pushing the boundaries of technology and design.
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Learn how to make informed decisions and mitigate supply chain risks with Altium 365 BOM Portal. Improve your time to market and proactively manage supply chain risks.
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No-clean flux has become popular due to its convenience. Learn more about why this solution is used, why cleaning might still be necessary, and how to remove no-clean flux residues. We will try to dispel all these doubts in this brand new article.
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Simulation of electronic circuits is a key factor in the success of your design. A SPICE circuit simulator may be used to speed up the design analysis. Learn more about how Altium Designer can help you with automated measurements, saving you time and money during the design process.
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Check out our refreshed feature page about Rigid-Flex PCB Design and see how Altium Designer’s unified environment can help you manage this kind of project with no limitations or additional licensing required.
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Struggling with manual data errors in your electronics projects? Watch the webinar to learn how Altium 365 cloud PLM integration with Duro® minimizes errors and rework, saving you time and money.
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Thermal problems in PCBs often go unnoticed until prototyping, which can be costly. Design teams can't afford endless iterations, but they can conduct lower-cost thermal prototypes. Learn more about this approach in our new article.
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Altium’s VP of marketing Lawrence Romine discusses the multi-board and harness design capabilities coming in Altium Designer 23.
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Controlled ESR capacitors are important for power integrity in your design as they can help smooth out the PDN impedance spectrum in your high speed PCB.
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Whenever we say something to the effect of “components can’t work without a correctly designed PCB,” we only have to look at component packaging for evidence. It is true that component packages come with parasitics that affect signal integrity, but there is one area that we don’t often look at in terms of component packaging: power integrity.
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In this article, we’ll look at all that is required to start creating your own custom microcontroller-based hardware designs. You’ll see that there actually isn’t too much to this, as microcontroller manufacturers over the years have tried to make the learning curve less steep and their devices more, and more accessible. This is both from an electrical point of view but also – equally importantly – from a programming point of view.
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If you’ve taken time to learn about PCB material options and layer constructions, you have probably seen the wide range of materials that are available on the market. Materials companies produce laminates with varying Dk values, Tg values, weave styles, CTI values, and mechanical properties to target various applications in the electronics industry.
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If you’re waiting for truly connected cars on a grand scale, there is still a massive amount of work to be done, both on the hardware and software sides. Connected cars can only become a widespread reality once the automotive industry and telecom carriers can decide which protocol will work best for vehicle-to-everything (V2X) communication. PCB designers will then need to step in to create these systems and fit them into a vehicular environment.
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This one area of PCB design can be contentious among some designers as it is related to copper pour, which it is often stated is not needed in most designs. Regardless of your feelings about copper pour, stitching vias have important uses in PCBs at low frequencies and at high frequencies.
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The IPC-2221 standard includes many requirements for printed circuit board design and manufacturability, and there are several online calculators that have been developed based on this standard.
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When you’re ready to manufacture a new device at production volume, there are many aspects of the product that must come together. The enclosure, cabling and connectors, embedded software/firmware, and of course the PCBA all have to be considered in totality. There is a quick way to get your product into a usable enclosure, complete with input power and cabling, and with a form factor that fits your PCBA. This overused route to a new product is a box build assembly.
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Printed circuit board fabricators have become skilled at manufacturing these technologies and also at understanding the reliability and producibility challenges associated with high-density-interconnect technology. Let’s look at where the PCB industry is at today.
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What can the industry do to support PCB designers as they continue taking a more active role in product development? Here at Altium, there has been a progressive shift towards looking at the system level and creating tools that get designers more involved throughout the product development process. As the saying goes, over the wall engineering is over… today’s most successful products are built in a collaborative process.
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As the 5G rollout progresses and researchers continue to discuss 6G, many new 5G-capable products operating in sub-GHz and mmWave bands are reaching the marketplace. Devices that will include a 5G-compatible front-end, whether small stations/repeaters or handheld devices, use phased arrays as high-gain antenna systems to provide high data throughput without losing range at higher frequencies.
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Via protection is an important part of modern PCB design. It provides additional benefits in PCB manufacturing and assembly, increasing the number of acceptable products.
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Power integrity problems can abound in modern PCBs, especially high-speed boards that run with fast edge rates. These systems require precise design of the PDN impedance to ensure stable power is always delivered throughout the system.
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A design project doesn’t appear out of nowhere. The design process spreads over time, and project documents change. Schematic documents gradually become more complex, new functional blocks appear, and already finished parts can be modified and updated.
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Capacitance is your friend whenever you need stable power integrity, which is why there is so much focus on decoupling capacitors. While these components are important and they can be used to provide targeted power integrity solutions to certain components, there is one specialty material used to supercharge capacitance in your PCB stackup or package substrate.