News & Updates

With advances in industrial automation, automotive technology, remote sensing, and much more, image processing is taking center stage in many embedded systems. Image processing with older video systems was difficult or impossible due to the low quality of many imaging systems with perpetual uptime. Newer systems provide video with higher frame rates and higher resolution images, but these systems still needed to connect directly to a computer in order to enable any useful image processing applications.

EDA tools have come a long way since the advent of personal computing. Now advanced routing features like auto-routers, interactive routing, length tuning, and pin-swapping are helping designers stay productive, especially as device and trace densities increase. Routing is normally restricted to 45-degree or right-angle turns with typical layout and routing tools, but more advanced PCB design software allows users to route at any angle they like. So which routing style should you use, and what are the advantages of any angle routing?

If you do a search for “Hardware-in-the-Loop” testing, you will frequently find examples of complex, real-time systems. Article from National Instruments, for example, gives a nice explanation and background on what hardware-in-the-loop (HIL) is, and provides an example of testing electronic control units within an automobile. In this article, we will be focusing on a smaller, more bite-sized version of HIL testing concepts.

If you’re an antenna designer, then you’re likely familiar with all aspects of near-field vs. far-field radiation. Given the litany of radiated EMI problems that cause noise within and outside of an electronic device, one might suddenly realize their new product is acting like a strong antenna. To understand how EMI affects your circuits, it helps to understand exactly how near-field vs. far-field radiation from your PCB affects your ability to pass EMC checks and affects your circuits.

How often have you started down the PCB development process and been bogged down by time-consuming administrative tasks? Once you get ready for production, working through a design review and correcting any DFM problems takes its own share of time. With hastening product development timelines and shorter product life cycles comes the pressure to increase PCB prototype iteration speed without sacrificing cost or quality. So how can PCB design teams keep their development schedules on track without sacrificing quality or risking a failed prototyping run?

A journey of a thousand miles begins with a single step, or so the aphorism goes. I think it’s worth noting that the first step is the most difficult to take. Analysis Paralysis is especially true when dealing with a new software package, including the recent release of Concord Pro. The recent version has brought with it a deluge of interest and enthusiasm in such a phenomenal tool. But I must say, Altium hit this one out of the park.

When you need to pass EMC certification and your new product is being crippled by a mysterious source of EMI, you’ll probably start considering a complete product redesign. Your stackup, trace geometry, and component arrangement are good places to start, but there might be more you can do to suppress specific sources of EMI. There are many different types of EMI filters that you can easily place in your design, and that will help suppress EMI in a variety of frequency ranges.

Previously, I described the PCB fabrication operations relative to inner layer processing, lamination, drilling, and plating. The last step in the process is outer layer processing which is described below. Once the desired plated copper thickness of a PCB has been achieved, it’s necessary to etch away the copper between the features in order to define the outer layer pattern.

There are many factors at play in determining the impact of inductance on high-frequency power distribution systems. Two topic areas, inductance of the decoupling capacitor and inductance of the power planes, were addressed in earlier articles. This article will focus on the inductance of the capacitor footprint and via inductance from the capacitor footprint back to the PCB power planes.

High-speed buses, whether single-ended or differential, can experience any number of signal integrity problems. A primary problem created by propagating signals is crosstalk, where a signal superimposes itself on a nearby trace. The industry-standard PCB design tools in Altium Designer® already include a post-layout simulator for examining crosstalk. Still, you can speed up crosstalk analysis in parallel buses when you use a powerful field solver.

Any time-dependent physical system with feedback and gain has conditions under which the system will reach stable behavior. Amplifier stability extends these concepts to amplifiers, where the system output can grow to an undesired saturated state due to unintended feedback. If you use the right design and simulation tools, you can easily account for potential instability in your circuit models before you create your layout.

The concept of design variants entails taking a single PCB design, and then on the assembly side, modifying specific components used in the design. Either by not installing, not installing, or choosing alternate components as replacements on a specific assembly to ultimately create different end products. In that way, you could support multiple product lines. This article describes the approach to working with variants. 

Before anything else, some advice. The revisions and lifecycle are an area that takes some planning. It used to be that Concord Pro was primarily for components, but now it has gone far beyond that. With the ability to store and manage many other items, including your various templates, projects, even PDF documents, not everything will have the same revision scheme. Concord Pro is so powerful that it can handle any revision scheme you’d want to set up.

Whether the board will be placed in a high pressure vessel or underwater, your design will need to withstand pressure to avoid failure. On the enclosure side, your vessel should be rated up to a certain pressure and may require frequent cycling to prevent implosion. On the electronics side, component selection and layout (especially at high voltage) become critical to preventing failure and ensuring reliability.