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Embedded thumbnail for Tent Vias under BGA
How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
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How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
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Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

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On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

Tight versus loose coupling
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Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

Embedded thumbnail for Automatic Fanout With BGA
How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

Embedded thumbnail for Specifying NSMD and SMD for BGA
How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

Engineering Design Review Guide
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How to Solve Your Engineering Design Review Challenges

You’ve possibly gone through plenty of engineering design reviews, both on the front-end of a project and the back-end before manufacturing. Engineering design reviews are performed to accomplish multiple objectives, and with many engineering teams taking a systems-based approach to design and production, electronics design teams will need to review much more than just a PCB layout and BOM. Today’s challenges with sourcing, manufacturability, reliability, and mechanical constraints are all areas that must be confronted in real designs

Embedded thumbnail for Via Shielding and Stitching
Via Stitching
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

Schematic Review Checklist
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Schematic Review Checklist

One of the most common points of failure of a device occurs even before you start to layout your circuit board. Mistakes in your schematic design can easily make their way all the way into prototypes or production without a second thought once layout starts. In this article, I’m not going to extol the virtues of a good schematic design. Instead, this article is a simple no frills checklist.

Embedded thumbnail for xSignals for DDR3 and DDR4
How To Work with High-Speed Projects
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

Embedded thumbnail for High-Speed Tuning
How To Work with High-Speed Projects
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

Via current carrying capacity for PCBs
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PCB Via Current-Carrying Capacity: How Hot is Too Hot?

One common question from designers is current-carrying capacity of conductors in a PCB. Trace and via current-carrying capacity are legitimate design points to focus on when designing a new board that will carry high current. The goal is to keep conductor temperatures below some appropriate limit, which then helps keep components on the board cool. Let’s dig into the current state of thermal demands on vias in PCBs and how they compare to internal and external PCB traces.

Simple Simulation in Altium Designer
On-Demand Webinar
SPICE Simulation Made Simple

SPICE simulation saves you critical time in the prototyping phase. Understanding your simulation interface makes it simple to analyze how your circuits work in different scenarios. Altium Designer provides an intuitive, dedicated interface to support your simulation verification, setup, and analysis directly in your schematic environment. You also benefit from growing support for popular model formats, as well as generic models, simplifying circuit definition and simulation.

PCB Shield
Blog
Phalanx, not Failure: PCB Shielding to Protect Your Design

A combination of good printed circuit board design and good shielding mitigates EMI. Good PCB design for EMI shielding revolves around the layout, the placement of filters, and ground planes. A well-designed PCB minimizes parasitic capacitance and ground loops. Keep reading to learn more about PCB shielding.

Embedded thumbnail for Using Document Parameters with Draftsman
How to Work with Draftsman
Using Document Parameters with Draftsman

The Draftsman Editor in Altium Designer uses document parameters to allow fine grain control over the draftsman document. We’ll show you how you can use the document parameters in your Draftsman document. 

Embedded thumbnail for High-Speed Features of Creating a Stack
How To Work with High-Speed Projects
High-Speed Features of Creating a Stack

The foundation of any high speed design is the layer stack. We’ll show you some of Altium Designer’s powerful layer stack creation features.

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Blog
How to Design Your PCB Test Coupon and What You Can Test

As the operating speed of components has increased, controlled impedance is becoming more common in digital, analog, and mixed-signal systems. If the controlled impedance value for an interconnect is incorrect, it can be very difficult to identify this problem during an in-circuit test. However, testing is normally performed on a PCB test coupon, which is manufactured on the same panel as the PCB. If you want to get through board spins quickly and aid future designs, you might consider designing a test coupon and keeping it handy for future designs.

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Altium DbLibs and Electronic Components in the Cloud with Altium Designer 20.1

Altium’s DbLib support is one of the oldest and most loved features of Altium Designer for managing electronic components and their data. They’ve been present in the software world since before I could fathom the existence of Ohm’s law. Altium 20.1’s new Component Sync feature allows you to synchronize virtually any database or database Library with Altium 365, taking advantage of both approaches strengths.

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What is a Schematic Netlist for Your PCB?

If you’ve created your next great schematic, there is a lot going on behind the scenes in your design software. A schematic netlist is one of the central pieces of information that will be used in multiple features in your design software to create a real PCB. Your schematic netlist provides both electrical connectivity information, and reflects the functional structure of your design data in a single set of data.

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How to Select an Inductor for a Buck Converter

An SMPS is one of those quiet (yet electrically noisy) devices that makes your favorite electronics run smoothly. Among the numerous DC-DC converter topologies, a buck converter finds plenty of uses for stepping down the input voltage to a lower level while providing high efficiency power conversion. A common question around component selection for these power converters is how to select an inductor for a buck converter. The goal in working with an inductor and other components in a buck converter is to limit power loss to heat and while minimizing current ripple.

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US Department of Transportation Seeking Alternatives to GPS

GPS-capable devices range from your phone to your smartwatch; simply type in your destination and follow the directions. Simple, right? According to the Washington Post, we should all stop using GPS as it’s ruining the navigation centers of our brains. Despite the neurological effects on perception and judgment, the U.S. Department of Transportation (DOT) aims to find alternatives to GPS to provide redundancy.

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Bluetooth 5.1 SoC vs. Module: Which is Best for Your Design?

The list of features available in Bluetooth just got a little longer since the release of Bluetooth 5.1. If you want to incorporate a Bluetooth 5.1 SoC into your new product, you have two primary options for bringing this component into your board. The first is as an SoC that mounts to your board just like any other component. The other option is to bring a module into your new board—directly onto the surface layer. Here’s what you need to know about a Bluetooth 5.1 SoC or module in your next IoT product.

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USB Power Delivery for Your Next Project

Since its introduction in the late 90s, the USB standard has never ceased to grow in popularity. There has been a growing trend toward USB being a power delivery interface with data, rather than a data interface that can supply power, as the 1.0 specification originally intended. To supply the increasing thirst for power over USB, the USB 3.0 Spec with Type-C began implementing the Power Delivery standard, which you should consider using for your next electronics project.

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Circuit Board Design for In-Circuit Testing

There are many types of circuit board tests available in electronics manufacturing today, each having unique goals and characteristics. This article presents guidelines at the design level (schematic and layout) to enable the use of in-circuit testing (ICT) fixtures to verify proper component assembly. These simple test fixtures allow your board to be tested as its assembled, which helps identify and remove failed boards from your production run.

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Planning for the Future with Cirris Systems and Altium

Technological advancements have been a hallmark of the past few decades, from the widespread adoption of internet technology to the smartphones and wireless devices we rely on every day to stay connected. Orlan Thatcher, Board Layout Specialist at Cirris Systems, could never have predicted the demand their services would generate. The company struggled with six different software platforms before switching to Altium Designer.

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An Introduction to NFC

I used to work in a research lab that worked primarily with RFID (Radio Frequency IDentification) and NFC (Near Field Communication) technology, particularly for the agriculture industry and cattle identification. These were very specialized fields; however, the lab also worked on projects which involved retail and various other applications for NFC. It’s an amazing technology that you might be using every day without thinking about it - building access to your mobile phone payments, for instance. 

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Editing Your PCB Geometry with MCAD Tools

You need to define your PCB geometry in the context of your enclosure. If your board cannot physically be assembled into the final product, it doesn't matter how well laid out it is electrically. This webinar focuses on how the MCAD CoDesigner allows you to edit your PCB in the context of a higher-level assembly, allowing you to respect the relevant mechanical constraints.

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The PCB Fabrication Process — what Every Design Engineer Needs To Know, Part 2

In Part 1 of this article, I described the first steps that occur during the PCB fabrication process. They detailed the inner layer processing effort as well as the efforts that take place during the transition from inner layer processing to lamination. This part of the article will provide a detailed description of the lamination, drilling and plating processes.

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The PCB Fabrication Process—What Every Design Engineer Needs To Know, Part 1

There are still a number of designers - perhaps most of them - who have never toured a PCB fabrication facility. They are also unaware of the various steps that occur during the fabrication process. The purpose of this article is to describe those steps and what transpires in each of them. Part 1 of this article focuses on inner layer processing and the steps that are done prior the lamination process.

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Webinar "8 Reasons to Store Your Components in Altium 365"

Working with local libraries seems like a simple solution, but we often don’t take into account the added time spent maintaining libraries and sharing them between team members. This webinar showcases the advantages of component storage in Аltium 365 to resolve the issues of local libraries and component management.

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Bridging the Gap Between Designers and Customers

Every piece of electronic equipment starts with a great idea. Transforming great ideas into real, physical products takes a team of talented individuals and multiple companies coming together to make everything from the internal components to the external hardware. Paul Payen de la Garanderie, Founder and Owner of AW Audio, an engineering services company based in France, understands these challenges very well. With an extensive background in the Audio/Visual industry, Paul has had to work with multiple companies over the years, from small start-ups to celebrated AV firms.

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Embedded thumbnail for Search, Filter, and Navigate PCB Designs Faster
New in Altium's Software
Search, Filter, and Navigate PCB Designs Faster

The Web Viewer now features a redesigned search experience for faster access to PCB design data across supported CAD formats. A lightweight, intuitive interface lets you begin with simple search terms and progressively refine results using contextual suggestions.

Embedded thumbnail for Gain Better Control Over Wire Bond Visibility
New in Altium's Software
Gain Better Control Over Wire Bond Visibility

New bond wire visibility controls give you greater flexibility when working with wire-bonded boards and footprints, making it easier to focus on the details that matter most.

Embedded thumbnail for Coming Soon: Selectable Harness Source Within Multi-board Design
New in Altium's Software
Coming Soon: Selectable Harness Source Within Multi-board Design

Selectable Harness Source Within Multi-board Design enables harness projects to drive system connectivity while maintaining bidirectional synchronization between multi-board schematics and harness wiring diagrams for improved accuracy and easier design management.

Embedded thumbnail for Choose the Simbeor Version for Your PCB Calculations
New in Altium's Software
Choose the Simbeor Version for Your PCB Calculations

The PCB Editor now lets you choose the Simbeor version used for delay and impedance calculations, giving you more flexibility and consistency across your design workflows.

Embedded thumbnail for Improve PCB Editor Performance with Via Instancing
New in Altium's Software
Improve PCB Editor Performance with Via Instancing

The PCB Editor now uses via instancing to generate geometry for each via individually, providing greater flexibility and a more advanced approach to managing vias in PCB designs.

Embedded thumbnail for GSSG Stackup Deep Dive: Routing, Impedance, and HDI
How-To's
GSSG Stackup Deep Dive: Routing, Impedance, and HDI

A ground-signal-signal-ground (GSSG) stackup rethinks the traditional four-layer PCB structure by moving the ground planes to the outer layers and routing signals on the two inner layers. In this Altium Academy deep dive, we review a real one-minute design review submission and demonstrate how to configure a GSSG stackup properly using the Layer Stack Manager.

Embedded thumbnail for Generate IPC-7351B Compliant Footprints with More Control
New in Altium's Software
Generate IPC-7351B Compliant Footprints with More Control

The IPC Compliant Footprint Wizard has been updated to improve IPC-7351B compliance across supported package types. Enhancements include footprint calculations, package outlines, silkscreen and courtyard generation, layer mapping, density table behavior, and new pad trimming controls for gullwing packages, with support added to the batch generator Excel template.

Embedded thumbnail for Add Unit-Aware Temperature Coefficient Parameters
New in Altium's Software
Add Unit-Aware Temperature Coefficient Parameters

Component templates in a connected Workspace on the Altium Platform now include support for Temperature Coefficient (ppm/°C) as a unit-aware user parameter type. This makes it possible to define temperature coefficient values directly within the template using the appropriate units.

Embedded thumbnail for When to Add Part Numbers to SMD Passives
How-To's
When to Add Part Numbers to SMD Passives

Check out our new video covering essential electronics fundamentals, with a focus on why including part numbers for SMD passive components, such as SMD resistors, directly on schematics is so important. We also explore whether relying only on the Bill of Materials (BOM) is enough for effective electronic component management.

Embedded thumbnail for Present Large Harness Tables More Clearly
New in Altium's Software
Present Large Harness Tables More Clearly

Harness Draftsman now supports splitting connection tables across multiple pages in *.HarDwf documents. With the new page height limit setting, you can easily control how much of the table appears on each page.

Embedded thumbnail for Innovate Beyond - The Future of Electronics Development in Automotive
How-To's
Innovate Beyond - The Future of Electronics Development in Automotive

Discover how the future of automotive electronics is being shaped by a more connected development approach that unifies teams, data, requirements, design, collaboration, and manufacturing. Recorded at BMW Welt and the BMW Museum during Altium’s "The Future of Electronics Development in Automotive" event, this video explores the key challenges and innovations driving the next generation of automotive design.

Embedded thumbnail for Coming Soon: Design Rule Sets
New in Altium's Software
Coming Soon: Design Rule Sets

Soon, PCB design rules in Altium will be organized into reusable Rule Sets within the PCB Rules and Constraints Editor. These rule sets can be created, duplicated, enabled or disabled, renamed, deleted, imported, and exported, making it easier to manage rules for specific interfaces, manufacturing requirements, or unique design constraints.

Embedded thumbnail for Decoupling Capacitor Routing: When to Use Vias vs Traces
How-To's
Decoupling Capacitor Routing: When to Use Vias vs Traces

Check out this video, a follow-up to the decoupling capacitor placement series, exploring the inductance tradeoffs between trace routing and via connections. Using real component examples from an Ethernet switch design in Altium, the video demonstrates how different routing choices can impact overall performance.

Embedded thumbnail for Coming Soon: Interactive Dynamic Phase Tuning
New in Altium's Software
Coming Soon: Interactive Dynamic Phase Tuning

The Interactive Length Tuning tool allows you to manually tune a single net in a differential pair while maintaining equal pair length and phase alignment across the entire route. This enables more efficient differential signal transmission, greater control during manual tuning, and faster pattern creation within defined phase tolerance limits.

Embedded thumbnail for AI PCB Layout vs. Human Design: The Honest Truth
How-To's
AI PCB Layout vs. Human Design: The Honest Truth

The question is: Can AI really route a PCB as well as an experienced human designer? In this video, we set out to find the answer. Our expert, Zach Peterson, puts it to the test in a side-by-side layout review. The challenge is based on a LinkedIn post where viewers had to guess which board was AI-generated and which was designed by a human.

Embedded thumbnail for Improve Your 3D Wire Bonding Workflow
New in Altium's Software
Improve Your 3D Wire Bonding Workflow

Check out the video where we showcase enhanced wire bonding features, including precise bond wire shape definition, improved clearance checking, streamlined import and export workflows, and efficient management of wire bonding objects.

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