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Embedded thumbnail for Remove Unused Via Pads
How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

All About PCB Test Points
Blog
Is It Printed or a Component? All About PCB Test Points

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

Embedded thumbnail for Tent Vias under BGA
How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
Blog
Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

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On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

Tight versus loose coupling
Blog
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

Embedded thumbnail for Automatic Fanout With BGA
How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

Embedded thumbnail for Specifying NSMD and SMD for BGA
How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

Engineering Design Review Guide
Blog
How to Solve Your Engineering Design Review Challenges

You’ve possibly gone through plenty of engineering design reviews, both on the front-end of a project and the back-end before manufacturing. Engineering design reviews are performed to accomplish multiple objectives, and with many engineering teams taking a systems-based approach to design and production, electronics design teams will need to review much more than just a PCB layout and BOM. Today’s challenges with sourcing, manufacturability, reliability, and mechanical constraints are all areas that must be confronted in real designs

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Via Stitching
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

Schematic Review Checklist
Blog
Schematic Review Checklist

One of the most common points of failure of a device occurs even before you start to layout your circuit board. Mistakes in your schematic design can easily make their way all the way into prototypes or production without a second thought once layout starts. In this article, I’m not going to extol the virtues of a good schematic design. Instead, this article is a simple no frills checklist.

Embedded thumbnail for xSignals for DDR3 and DDR4
How To Work with High-Speed Projects
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

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How To Work with High-Speed Projects
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

Via current carrying capacity for PCBs
Blog
PCB Via Current-Carrying Capacity: How Hot is Too Hot?

One common question from designers is current-carrying capacity of conductors in a PCB. Trace and via current-carrying capacity are legitimate design points to focus on when designing a new board that will carry high current. The goal is to keep conductor temperatures below some appropriate limit, which then helps keep components on the board cool. Let’s dig into the current state of thermal demands on vias in PCBs and how they compare to internal and external PCB traces.

Simple Simulation in Altium Designer
On-Demand Webinar
SPICE Simulation Made Simple

SPICE simulation saves you critical time in the prototyping phase. Understanding your simulation interface makes it simple to analyze how your circuits work in different scenarios. Altium Designer provides an intuitive, dedicated interface to support your simulation verification, setup, and analysis directly in your schematic environment. You also benefit from growing support for popular model formats, as well as generic models, simplifying circuit definition and simulation.

PCB Shield
Blog
Phalanx, not Failure: PCB Shielding to Protect Your Design

A combination of good printed circuit board design and good shielding mitigates EMI. Good PCB design for EMI shielding revolves around the layout, the placement of filters, and ground planes. A well-designed PCB minimizes parasitic capacitance and ground loops. Keep reading to learn more about PCB shielding.

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Blog
Mastering Blind and Buried Vias

Check our compilation of essential resources you'll need to use blind and buried vias successfully in an HDI PCB. In our brand new article, we present the main and most valuable information about this technology, which may not be new but is still highly useful in High-Density Interconnect projects.

Blog
Make Sure to Clean Your No-Clean Flux

No-clean flux has become popular due to its convenience. Learn more about why this solution is used, why cleaning might still be necessary, and how to remove no-clean flux residues. We will try to dispel all these doubts in this brand new article.

Blog
How to Design a Thermal Prototype PCB

Thermal problems in PCBs often go unnoticed until prototyping, which can be costly. Design teams can't afford endless iterations, but they can conduct lower-cost thermal prototypes. Learn more about this approach in our new article.

Blog
DC-Aware Return Current in Mixed Signal PCBs

In this article, we will examine specific cases involving these types of components, where a very low-frequency signal or a DC signal needs to be measured, and the return path must be tracked to ensure the current loop is tight.

Blog
PCB Layout Replication: The Perfect Tool for Test Jigs

Replicate your circuits across multiple blocks with just a few clicks using a flawless preview pane, ensuring consistent, perfect results without the need for trial and error. Check out our new article on the PCB Layout Replication feature.

Altium 365 GovCloud Why We Chose AWS GovCloud (US) Cover
Blog
4 Reasons Why We Chose AWS GovCloud (US) for Altium 365 GovCloud

In this blog, we explain the reasons behind our decision to operate Altium 365 GovCloud within AWS GovCloud (US). This partnership is guided by a clear vision: to provide our users with a secure, compliant, and reliable platform for sensitive electronics design data.

Blog
3D MID Design Whitepaper

Dive into a dynamic design experience where you can visualize and edit your circuits in true 3D, offering unparalleled precision. Altium Designer's 3D-MID (Mechatronic Integrated Device) Design tool revolutionizes the design process, providing a fresh perspective. Explore the capabilities and benefits of this feature in our comprehensive guide.

Blog
Types of Wiring Harnesses for Electronics

In today's world, many products utilize multiple PCBs interconnected with each other, often leading to a complex network of cables within an enclosure. The most effective way to manage these wires and cables is by constructing a wiring harness. This article explores the various types of harnesses used in electronics.

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NEW
Embedded thumbnail for Mastering HDI Design Rules in Altium Designer
How-To's
Mastering HDI Design Rules in Altium Designer

In our latest Altium Academy tutorial, we guide you through configuring the essential HDI PCB design rules in Altium's software. You'll learn how to use your manufacturer's fabrication capabilities to create accurate design rules and constraints for your PCB.

NEW
Embedded thumbnail for Search, Filter, and Navigate PCB Designs Faster
New in Altium's Software
Search, Filter, and Navigate PCB Designs Faster

The Web Viewer now features a redesigned search experience for faster access to PCB design data across supported CAD formats. A lightweight, intuitive interface lets you begin with simple search terms and progressively refine results using contextual suggestions.

Embedded thumbnail for Gain Better Control Over Wire Bond Visibility
New in Altium's Software
Gain Better Control Over Wire Bond Visibility

New bond wire visibility controls give you greater flexibility when working with wire-bonded boards and footprints, making it easier to focus on the details that matter most.

Embedded thumbnail for Coming Soon: Selectable Harness Source Within Multi-board Design
New in Altium's Software
Coming Soon: Selectable Harness Source Within Multi-board Design

Selectable Harness Source Within Multi-board Design enables harness projects to drive system connectivity while maintaining bidirectional synchronization between multi-board schematics and harness wiring diagrams for improved accuracy and easier design management.

Embedded thumbnail for Choose the Simbeor Version for Your PCB Calculations
New in Altium's Software
Choose the Simbeor Version for Your PCB Calculations

The PCB Editor now lets you choose the Simbeor version used for delay and impedance calculations, giving you more flexibility and consistency across your design workflows.

Embedded thumbnail for Improve PCB Editor Performance with Via Instancing
New in Altium's Software
Improve PCB Editor Performance with Via Instancing

The PCB Editor now uses via instancing to generate geometry for each via individually, providing greater flexibility and a more advanced approach to managing vias in PCB designs.

Embedded thumbnail for GSSG Stackup Deep Dive: Routing, Impedance, and HDI
How-To's
GSSG Stackup Deep Dive: Routing, Impedance, and HDI

A ground-signal-signal-ground (GSSG) stackup rethinks the traditional four-layer PCB structure by moving the ground planes to the outer layers and routing signals on the two inner layers. In this Altium Academy deep dive, we review a real one-minute design review submission and demonstrate how to configure a GSSG stackup properly using the Layer Stack Manager.

Embedded thumbnail for Generate IPC-7351B Compliant Footprints with More Control
New in Altium's Software
Generate IPC-7351B Compliant Footprints with More Control

The IPC Compliant Footprint Wizard has been updated to improve IPC-7351B compliance across supported package types. Enhancements include footprint calculations, package outlines, silkscreen and courtyard generation, layer mapping, density table behavior, and new pad trimming controls for gullwing packages, with support added to the batch generator Excel template.

Embedded thumbnail for Add Unit-Aware Temperature Coefficient Parameters
New in Altium's Software
Add Unit-Aware Temperature Coefficient Parameters

Component templates in a connected Workspace on the Altium Platform now include support for Temperature Coefficient (ppm/°C) as a unit-aware user parameter type. This makes it possible to define temperature coefficient values directly within the template using the appropriate units.

Embedded thumbnail for When to Add Part Numbers to SMD Passives
How-To's
When to Add Part Numbers to SMD Passives

Check out our new video covering essential electronics fundamentals, with a focus on why including part numbers for SMD passive components, such as SMD resistors, directly on schematics is so important. We also explore whether relying only on the Bill of Materials (BOM) is enough for effective electronic component management.

Embedded thumbnail for Present Large Harness Tables More Clearly
New in Altium's Software
Present Large Harness Tables More Clearly

Harness Draftsman now supports splitting connection tables across multiple pages in *.HarDwf documents. With the new page height limit setting, you can easily control how much of the table appears on each page.

Embedded thumbnail for Innovate Beyond - The Future of Electronics Development in Automotive
How-To's
Innovate Beyond - The Future of Electronics Development in Automotive

Discover how the future of automotive electronics is being shaped by a more connected development approach that unifies teams, data, requirements, design, collaboration, and manufacturing. Recorded at BMW Welt and the BMW Museum during Altium’s "The Future of Electronics Development in Automotive" event, this video explores the key challenges and innovations driving the next generation of automotive design.

Embedded thumbnail for Coming Soon: Design Rule Sets
New in Altium's Software
Coming Soon: Design Rule Sets

Soon, PCB design rules in Altium will be organized into reusable Rule Sets within the PCB Rules and Constraints Editor. These rule sets can be created, duplicated, enabled or disabled, renamed, deleted, imported, and exported, making it easier to manage rules for specific interfaces, manufacturing requirements, or unique design constraints.

Embedded thumbnail for Decoupling Capacitor Routing: When to Use Vias vs Traces
How-To's
Decoupling Capacitor Routing: When to Use Vias vs Traces

Check out this video, a follow-up to the decoupling capacitor placement series, exploring the inductance tradeoffs between trace routing and via connections. Using real component examples from an Ethernet switch design in Altium, the video demonstrates how different routing choices can impact overall performance.

Embedded thumbnail for Coming Soon: Interactive Dynamic Phase Tuning
New in Altium's Software
Coming Soon: Interactive Dynamic Phase Tuning

The Interactive Length Tuning tool allows you to manually tune a single net in a differential pair while maintaining equal pair length and phase alignment across the entire route. This enables more efficient differential signal transmission, greater control during manual tuning, and faster pattern creation within defined phase tolerance limits.

Embedded thumbnail for AI PCB Layout vs. Human Design: The Honest Truth
How-To's
AI PCB Layout vs. Human Design: The Honest Truth

The question is: Can AI really route a PCB as well as an experienced human designer? In this video, we set out to find the answer. Our expert, Zach Peterson, puts it to the test in a side-by-side layout review. The challenge is based on a LinkedIn post where viewers had to guess which board was AI-generated and which was designed by a human.

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