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Capacitive load termination
Blog
How to Impedance Match and Terminate Capacitive Loads

The idea of a purely capacitive load is something of a fallacy. Yes, capacitors exist, but all capacitors are non-ideal, and it is this deviation from a theoretical capacitance that determines how to impedance match a load that exhibits capacitive behavior. Let’s take a look at this important aspect of interconnect design and see what it really means to terminate a capacitive load.

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How to work with Selection
Tools for Easily Selecting Objects in the PCB

Explore more than basic mouse movements by taking a look at the tools that Altium Designer has to offer for making selecting and moving objects in the PCB an easy task. This will increase your productivity and allow you to spend more time designing

Using Altium 365 Over Your Vanilla Version Control System
Blog
Using Altium 365 Over Your Vanilla Version Control System

There are all sorts of version control systems out there that people have been using with their PCB design software. As discussed in Why Use a Version Control System, we looked at different options ranging for local hard drive storage to sophisticated online revisioning systems. In this article we will be reviewing the differences between a standard VCS and Altium 365.

Why Use a Version Control System in PCB Design
Blog
Why Use a Version Control System in PCB Design

Version Control Systems (VCS) have been around for many decades within the software world but can be surprisingly new to some folks in the electronics design industry. This article will cover what a VCS is, what it does, and why you should be using one for your PCB design projects.

IPC 6012 Class 3 Annular Ring
Blog
Meeting Standards: IPC 6012 Class 3 Annular Ring

Designers often conflate leftover annular ring and pad sizes - they need to place a sufficiently large pad size on the surface layer to ensure that the annular ring that is leftover during fabrication will be large enough. As long as the annular ring is sufficiently large, the drill hit will not be considered defective and the board will have passed inspection. In this article, I'll discuss the limits on IPC-6012 Class 3 annular rings as these are a standard fabrication requirement for high-reliability rigid PCBs.

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Working with Polygons
How to Work with The Polygon Manager

It is important to have a high-level view of all polygons on the PCB design. The Polygon Manager lets you rename polygons, set their pour order, perform re-pouring or disable pouring on selected polygons, add/scope the polygon connection style and clearance design rules, and add polygon classes for selected polygons.

PCB fabrication notes
Blog
Decoding PCB Fabrication Notes

Sending a board out for fabrication is an exciting and nerve-wracking moment. Why not just give your fabricator your design files and let them figure it out? There are a few reasons for this, but it means the responsibility comes back to you as the designer to produce manufacturing files and documentation for your PCB. It’s actually quite simple if you have the right design tools. We’ll look at how you can do this inside your PCB layout and how this will help you quickly generate data for your manufacturer.

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How to Work with Differential Pairs
Assigning Impedance Profiles for Differential Pairs

When you assign an impedance profile to a differential pair you open up several options for control over your routes. We'll show you how to do just that, as well as how to fix errors that may pop up and how to create classes for differential pairs based on assigned impedance profiles.

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How-To's
How to Highlight or Select Net Connections in the PCB

We’ll show you how to highlight net selections so you can easily track where connections are made. We’ll show you how to hide and show nets, and how to use the view configuration and PCB panels to view and highlight nets across your design, and how to assign net colors in both the PCB and the schematic.

HDI PCB design and HDI PCB manufacturing process
Blog
Design Basics for HDI and the HDI PCB Manufacturing Process

As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.

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How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

All About PCB Test Points
Blog
Is It Printed or a Component? All About PCB Test Points

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

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How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

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How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

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How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
Blog
Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

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On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

Tight versus loose coupling
Blog
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

Tag
Blog
Getting Through PCB DFM

In this article, we’ll discuss the key design features to implement, and steps to take prior to fabrication that will help prevent some DFM process pain.

Altium Designer Getting Started User Guide
Blog
Level Up Your Design Skills - Altium Designer Getting Started User Guide Update
We are happy to announce the new update of our Altium Designer Getting Started User Guide. Whether you are new to Altium Designer or you want to brush up on some topics, the Altium Designer Getting Started User Guide will take you from a beginner to a master in PCB design.  This is only the beginning! This guide will be updated with new information based on user feedback. Let’s first go over the contents of the guide.
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Blog
Modeling Copper Foil Roughness in Altium Designer's Impedance Profiler

With the new layer stack manager in Altium Designer®, you can now include copper foil roughness factors directly in your impedance calculator. This is quite easy to do in the layer stack manager, but it begs the question: what exactly is the copper roughness factor? Which value should be used for your interconnects?

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Blog
High-Speed Signal Routing: The 5 Important Constraints

After you capture your schematic as an initial layout and create an initial component arrangement, it’s time to define your routing constraints. Doing this early will allow your DRC engine to spot rules violations before you finish your layout. Likewise, you’ll be able to modify the default rule set to meet your layout requirements. Here are the important routing constraints you’ll need to check before you start routing your board.

Blog
How to Create a PCB Manufacturing Cost Estimation

Some manufacturers have very convenient PCB manufacturing cost estimation calculators you can use, but the real costs depend on a number of factors. If you’re an entrepreneur and you’re producing your own boards, or you are managing manufacturing, testing, and delivery for a new project, it’s your job to help clients understand the primary cost drivers for new boards. Here’s how you can get an estimate of your fabrication costs, both for local and overseas manufacturers.

Blog
PCB Mountable Connectors: SMD vs. Through-hole

Selecting a connector is as much an art as it is a science. The artistic side is all about aesthetics and satisfying clearances, while the scientific side is all about signal integrity. For PCB mountable connectors, you’ll need to choose between surface-mounted or through-hole connectors, and you’ll need to consider how each type affects signal integrity in your application. Here’s what you need to think about beyond the standard connector specifications.

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Blog
PCB Via Current-Carrying Capacity: How Hot is Too Hot?

Trace and via current-carrying capacity are legitimate design points to focus on when designing a new board that will carry high current. The goal is to keep conductor temperatures below some appropriate limit, which then helps keep components on the board cool.

Blog
How to Maximize Copper in Your PCB Design: The Pros and Cons of Copper Pouring Versus Placing

There is a saying in copper pour PCB design, “Copper is free.” It means a PCB editor designer must think in reverse. A board starts off as solid copper, and the copper you don’t want is removed. It is faster to build, less consumptive, and less expensive to make a board that is mostly copper as compared to the same size board that is mostly bare. Picking the correct technique will make the difference between an effortless or frustrating experience.

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Blog May 14, 2020
How to Highlight Nets in Altium Designer to Simplify Schematic and PCB Designs

Highlighting nets will help you simplify your schematic and PCB design. In Altium , there are multiple options that enable you to leverage this capability to simplify the verification of connections and circuit paths and make sure that the design you send to your manufacturer accurately reflects the printed circuit board you need built.

Routed tracks
Blog May 5, 2020
Helpful Tips for Interactive Routing in Altium Designer

Before you jump into the software, you should know the types of things you’re going to want to look out for. Traces, connection lines, differential pair routing, and route paths can all affect the routing process of your board. Make sure that you’re equipped knowing, ultimately, what you want your board design to accomplish and furthermore, where you anticipate potential problem areas to be.

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NEW
Embedded thumbnail for Choose the Simbeor Version for Your PCB Calculations
New in Altium's Software
Choose the Simbeor Version for Your PCB Calculations

The PCB Editor now lets you choose the Simbeor version used for delay and impedance calculations, giving you more flexibility and consistency across your design workflows.

Embedded thumbnail for Improve PCB Editor Performance with Via Instancing
New in Altium's Software
Improve PCB Editor Performance with Via Instancing

The PCB Editor now uses via instancing to generate geometry for each via individually, providing greater flexibility and a more advanced approach to managing vias in PCB designs.

Embedded thumbnail for GSSG Stackup Deep Dive: Routing, Impedance, and HDI
How-To's
GSSG Stackup Deep Dive: Routing, Impedance, and HDI

A ground-signal-signal-ground (GSSG) stackup rethinks the traditional four-layer PCB structure by moving the ground planes to the outer layers and routing signals on the two inner layers. In this Altium Academy deep dive, we review a real one-minute design review submission and demonstrate how to configure a GSSG stackup properly using the Layer Stack Manager.

Embedded thumbnail for Generate IPC-7351B Compliant Footprints with More Control
New in Altium's Software
Generate IPC-7351B Compliant Footprints with More Control

The IPC Compliant Footprint Wizard has been updated to improve IPC-7351B compliance across supported package types. Enhancements include footprint calculations, package outlines, silkscreen and courtyard generation, layer mapping, density table behavior, and new pad trimming controls for gullwing packages, with support added to the batch generator Excel template.

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New in Altium's Software
Add Unit-Aware Temperature Coefficient Parameters

Component templates in a connected Workspace on the Altium Platform now include support for Temperature Coefficient (ppm/°C) as a unit-aware user parameter type. This makes it possible to define temperature coefficient values directly within the template using the appropriate units.

Embedded thumbnail for When to Add Part Numbers to SMD Passives
How-To's
When to Add Part Numbers to SMD Passives

Check out our new video covering essential electronics fundamentals, with a focus on why including part numbers for SMD passive components, such as SMD resistors, directly on schematics is so important. We also explore whether relying only on the Bill of Materials (BOM) is enough for effective electronic component management.

Embedded thumbnail for Present Large Harness Tables More Clearly
New in Altium's Software
Present Large Harness Tables More Clearly

Harness Draftsman now supports splitting connection tables across multiple pages in *.HarDwf documents. With the new page height limit setting, you can easily control how much of the table appears on each page.

Embedded thumbnail for Innovate Beyond - The Future of Electronics Development in Automotive
How-To's
Innovate Beyond - The Future of Electronics Development in Automotive

Discover how the future of automotive electronics is being shaped by a more connected development approach that unifies teams, data, requirements, design, collaboration, and manufacturing. Recorded at BMW Welt and the BMW Museum during Altium’s "The Future of Electronics Development in Automotive" event, this video explores the key challenges and innovations driving the next generation of automotive design.

Embedded thumbnail for Coming Soon: Design Rule Sets
New in Altium's Software
Coming Soon: Design Rule Sets

Soon, PCB design rules in Altium will be organized into reusable Rule Sets within the PCB Rules and Constraints Editor. These rule sets can be created, duplicated, enabled or disabled, renamed, deleted, imported, and exported, making it easier to manage rules for specific interfaces, manufacturing requirements, or unique design constraints.

Embedded thumbnail for Decoupling Capacitor Routing: When to Use Vias vs Traces
How-To's
Decoupling Capacitor Routing: When to Use Vias vs Traces

Check out this video, a follow-up to the decoupling capacitor placement series, exploring the inductance tradeoffs between trace routing and via connections. Using real component examples from an Ethernet switch design in Altium, the video demonstrates how different routing choices can impact overall performance.

Embedded thumbnail for Coming Soon: Interactive Dynamic Phase Tuning
New in Altium's Software
Coming Soon: Interactive Dynamic Phase Tuning

The Interactive Length Tuning tool allows you to manually tune a single net in a differential pair while maintaining equal pair length and phase alignment across the entire route. This enables more efficient differential signal transmission, greater control during manual tuning, and faster pattern creation within defined phase tolerance limits.

Embedded thumbnail for AI PCB Layout vs. Human Design: The Honest Truth
How-To's
AI PCB Layout vs. Human Design: The Honest Truth

The question is: Can AI really route a PCB as well as an experienced human designer? In this video, we set out to find the answer. Our expert, Zach Peterson, puts it to the test in a side-by-side layout review. The challenge is based on a LinkedIn post where viewers had to guess which board was AI-generated and which was designed by a human.

Embedded thumbnail for Improve Your 3D Wire Bonding Workflow
New in Altium's Software
Improve Your 3D Wire Bonding Workflow

Check out the video where we showcase enhanced wire bonding features, including precise bond wire shape definition, improved clearance checking, streamlined import and export workflows, and efficient management of wire bonding objects.

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New in Altium's Software
Customize Your ODB++ Output for Each Partner

You can now precisely control what design data is included in your ODB++ outputs for different manufacturing recipients. Choose which signal layers to export, decide how the netlist is handled (included, disabled, or neutralized), and control whether component data is removed or shared without properties.

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Altium Stories
Proper Voltage Built a Universal Battery Platform with Altium

Watch our latest customer success story to see how Proper Voltage partnered with Altium to accelerate high-power battery development for next-generation robotics. With our software, they streamlined collaboration, sped up design reviews, improved sourcing visibility, and reduced risk.

Embedded thumbnail for Improve Readability with Custom Pin Spacing
New in Altium's Software
Improve Readability with Custom Pin Spacing

You can now control the vertical spacing of a pin’s designator and name with a custom margin. This setting can be applied globally via Schematic Preferences or adjusted individually in the Pin properties.

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