News & Updates

There are plenty of PCB manufacturing services you can find online, and they can all start to blend together. If you’re searching for a new service provider, it can be hard to compare all of them and find the best manufacturer that meets your needs. While experienced designers can spot bogus manufacturers from afar, there is always a temptation to go with the lowest priced, supposedly fastest overseas company you can find. However, there is a lot more that should go into choosing a PCB manufacturing service than just price.

Pi Filters are a type of passive filter that gets its name from the arrangement of the three constituent components in the shape of the Greek letter Pi (π). Pi filters can be designed as either low pass or high pass filters, depending on the components used. The low-pass filter used for power supply filtering is formed from an inductor in series between the input and output with two capacitors, one across the input and the other across the output. Keep reading to learn more about their application in the PCB Design.

The first question that should come up when selecting materials and planning a stackup is: what materials are needed and how many layers should be used? Assuming you’ve determined you need a low-loss laminate and you’ve determined your required layer count, it’s time to consider whether you should use a hybrid stackup. There are a few broad situations where you could consider using a hybrid stackup with low-loss laminates in your PCB

Batteries offer a great power source for electrical devices that need to be mobile or located somewhere where connection to a mains electricity supply or other power source is impossible. The biggest problem with battery power is the expectation of users that the device will operate for significant periods with the need for recharging or replacing the batteries. This demand is placing the onus on the designer to improve efficiency and reduce power demand to meet this need.

A number of us on this blog and in other publications often bring up the concept of target impedance when discussing power integrity in high-speed designs. Some designs will be simple enough that you can take a “set it and forget it” approach to design a functional prototype. For more advanced designs, or if you’re fine-tuning a new board that has existing power integrity problems, target impedance is a real consideration that should be considered in your design.

Dual power supplies are circuits that generate two different output voltages from a single input source. The simplest method of generating dual output voltages is to use a transformer with two taps on the output winding. Bespoke transformers can have any voltage ratio depending on the number of windings in each part of the output side of the transformer.

With digital boards that are nominally running at DC, splitting up a power plane or using multiple power planes is a necessity for routing large currents at standard core/logic levels to digital components. Once you start mixing analog and digital sections into your power layers with multiple nets, it can be difficult to implement clean power in a design if you’re not careful with your layout.

Working between the Electronic and Mechanical design domains brings unique challenges. ECAD and MCAD tools have different design objectives and have evolved down different paths, and so have the way they store and manage their design and project data. To successfully design these products, the designers must fluidly pass design changes back and forth between the ECAD and MCAD domains beyond outdated file exchanges.

High-speed digital PCBs are challenging enough to design, but what about mixed-signal boards? Many modern systems contain elements that operate with both digital and analog signaling, and these systems must be designed to ensure signal integrity in both domains. Altium Designer has the layout and signal integrity tools you need to ensure your mixed-signal PCB design does not experience interference and obeys important design standards.

Just as WiFi 6 and 6E are starting to hit the market and new chipsets become available, WiFi 7 is in the works under the 802.11be standard. While this technology still has not hit the market, I would expect more inquiries for experimental systems, evaluation modules, and surface-mountable modules to come up once the first chipsets become available. Now is the time to start thinking about these systems, especially if you’re developing evaluation products to support WiFi 7.

Rugged electronics need to take a punch mechanically, but there is more that goes into a rugged system than being able to survive a drop on the pavement. This is as much about enclosure design as it is about component selection and manufacturing choices. Mil-aero designers often use the term “harsh environment” to describe a number of scenarios where an electronic device’s reliability and lifetime will be put to the test. If you want to make your next product truly rugged, it helps to adopt some of their strategies in your PCB layout.

A PCB design review is a practice to review the design of a board for possible errors and issues at various stages of product development. It can range from a formal checklist with official sign-offs to a more free-form inspection of schematic drawings and PCB layouts. For this article, we will not delve into what to check during a design review process but rather look at how a review process itself usually unfolds and how to optimize it to get the most out of your time.

As we established in Part 1, the PCB design review and collaboration practices have room for improvement in many organizations. To address this, we developed Altium 365. Let's examine how running a PCB project through Altium 365 compares to other methods.

If you look on the internet, you'll find some interesting grounding recommendations, and sometimes terminology gets thrown around and applied to a PCB without the proper context or understanding of real electrical behavior. DC recommendations get applied to AC, low current gets applied to high current, and vice versa... the list goes on. One of the more interesting grounding techniques you'll see as a recommendation, including on some popular engineering blogs within the industry, is the use of PCB star grounding.

Every PCB has silkscreen on the surface layer, and you’ll see a range of alphanumeric codes, numbers, markings, and logos on PCB silkscreen. What exactly does it all mean, and what specifically should you include in your silkscreen layer? All designs are different, but there are some common pieces of information that will appear in any silkscreen in order to aid assembly, testing, debug, and traceability

Designing high-speed channels on complex boards requires simulations, measurements on test boards, or both to ensure the design operates as you intend. Gibbs ringing is one of these effects that can occur when calculating a channel’s response using band-limited network parameters. Just as is the case in measurements, Gibbs ringing can occur in channel simulations due to the fact that network parameters are typically band-limited.

In electronics, there is the possibility that your PCB can get pretty hot due to power dissipation in certain components. There are many things to consider when dealing with heat in your board, and it starts with determining power dissipation in your design during schematic capture. If you happen to be operating within safe limits in a high power device, you might need an SMD heat sink on certain components. Ultimately, this could save your components, your product, and even the operator.

One thing is certain: power supply designs can get much more complex than simply routing DC power lines to your components. RF power supply designs require special care to ensure they will function without transferring excessive noise between portions of the system, something that is made more difficult due to the high power levels involved. In addition to careful layout, circuitry needs to be designed such that the system provides highly efficient power conversion and delivery to each subsection of the system.

Overvoltage, overcurrent, and heat are the three most likely events that can destroy our expensive silicon-based components or reduce our product’s life expectancy. The effects are often quite instant, but our product might survive several months of chronic overstress before giving up the ghost in some cases. Without adequate protection, our circuit can be vulnerable to damage, so what should we do? Or do we need to do anything?

Today’s PCB designers and layout engineers often need to put on their simulation hat to learn more about the products they build. When you need to perform simulations, you need models for components, and simulation models often need to be shared with other team members at the project level or component level. What’s the best way for Altium Designer users to share this data? Read this article to learn more about sharing your models with other design participants.

When some designers start talking materials, they probably default to FR4 laminates. The reality is there are many FR4 materials, each with relatively similar structure and a range of material property values. Designs on FR4 are quite different from those encountered at the low GHz range and mmWave frequencies. So what exactly changes at high frequencies, and what makes these materials different? To see just what makes a specific laminate useful as an RF PCB material, take a look at our guide below.

In today’s fast-paced world where iterations of electronics are spun at lightning speeds, we often forget one of the most critical aspects of development: testing. Even if we have that fancy test team, are we really able to utilize them for every modification, every small and insignificant change that we make to our prototypes? In this article, we will review a very low cost, yet highly effective and quite exhaustive test system that will get you that bang for your buck that you’ve been looking for.

If you’ve ever looked at the BOM for a reference design or an open-source project, you may have seen a comment in some of the entries in your BOM. This comment is either “DNP” or “DNI”. If you think about it, every component placed in the PCB requires some level of placement and routing effort, which takes time and money if you’re working for a client. This begs the question, why would anyone design a board with components they don’t plan to include in the final assembly?

When it’s time to share your design data with your manufacturer, it’s like taking a leap of faith. Sending off a complete documentation package might seem as easy as placing your fab files in a zip folder, but there are better ways to ensure your manufacturer understands your project and has access to all your design data. For Altium Designer users, there are multiple options for creating and packaging release data into a complete package for your manufacturers.

If you’re designing a circuit board to be powered by anything except a bench-top regulated power supply, you’ll need to select a power regulator to place on your board. Just like any other component, your regulator has stated operating specs you’ll see in a product summary, and it has more detailed specs you’ll find in a datasheet. The fine details in your datasheets are easy to overlook, but they are the major factors that determine how your component will interact with the rest of your system.

It would be nice if the power that came from the wall was truly noise-free. Unfortunately, this is not the case, and although a power system can appear to output a clean sine wave, zooming into an oscilloscope trace or using an FFT will tell you a different story. When you take "dirty" power, put it through rectification, and then pass it through a switching regulator, you introduce additional noise into the system that further degrades power quality. If you’re a power supply or power systems designer, then you know the value of supplying your devices with clean, noise-free power.

If you’re an electronics designer or you’re just beginning your career as an engineer, the PCB stackup is probably one of the last things you’ll think about. Simple items like PCB copper thickness and board thickness can get pushed to the back burner, but you’ll need to think about these two points for many applications as not every board will be fabricated on a standard 1.57 mm two-layer PCB