News & Updates
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Improving Supply Chain Success with BOM Management
It’s no secret that component shortages have become more frequent this year. In fact, countries around the world are losing billions in revenue due to supply issues. Having the right components on hand is more crucial than ever as availability, obsolescence, counterfeit products and environmental non-compliance risks continue to grow. Fortunately, many shortages can be avoided by introducing proactive supply chain practices.
On-Demand Webinar
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Rapidly Creating New Designs And Reusing Existing Ones
It's no secret that software developers often use completed code fragments from other projects for quick and predictable results. The same can be done for PCB Design, there is no need to spend time rewiring schematics or laying out components on boards you’ve done before. Join us this webinar where we’ll go over how you can use your existing designs to create reusable design blocks, speeding up the design cycle for your future projects.
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What is the Impedance of Length-Tuning Structures?
Do length-tuning structures create an impedance discontinuity? The answer is an unequivocal “yes”, but it might not matter in your design depending on several factors. Applying a length-tuning structure is equivalent to changing the distance between the traces while meandering. Therefore, you will have a change in the odd-mode impedance of a single trace. The question then becomes: does this deviation in trace impedance in a length tuning structure matter?
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A-SAP™ – What do you need to know?
The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators. To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer counts, multiple levels of stacked micro vias and increased lamination cycles.
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Pin-Package Delay and Via Delay in High Speed Length Tuning
Take a look at the inside of some integrated circuit packages, and you’ll find a number of wires bonded to the semiconductor die and the pads at the edge of the component's package. As a signal traverses makes its way along an interconnect and into a destination circuit, signals need to travel across these bond wires and pads before they are interpreted as a logic state. As you look around the edge of an IC, these bond wires can have different lengths, and they incur different levels of delay and contribute to total jitter.
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6-Layer PCB Design Guidelines
Once you’ve run out of room on your 4-layer PCB, it’s time to graduate to a 6-layer board. The additional layer can give you room for more signals, an additional plane pair, or a mix of conductors. How you use these extra layers is less important than how you arrange them in the PCB stackup, as well as how you route on a 6-layer PCB. If you’ve never used a 6-layer board before, or you’ve had EMI troubles with this stackup that are difficult to solve, keep reading to see some 6-layer PCB design guidelines and best practices.
On-Demand Webinar
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Help Ensure The Best Designs With Component Management
There are many aspects to designing a PCB. One of the larger aspects has to do with managing your components. We all need components for our designs, but are those components in our library and designs up-to-date or even purchasable? These questions need to be answered before we can safely use them. If not, we could just be wasting our time designing with invalid components. Altium Designer® has several tools to help you manage the components in your libraries and designs.
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Altium Designer 22.5 Update
We are happy to announce that the Altium Designer 22.5 update is now available. Altium Designer 22.5 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!
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How Reliable is Your Hybrid PCB Stackup?
PCB stackups often incorporate slightly dissimilar materials that could pose a reliability problem. Hybrid PCBs are one case where the PCB stackup will include different materials, typically a standard FR4 laminate and a PTFE laminate for RF PCBs. Designers who want to take the lead on material selection when designing their hybrid stackups should consider these factors that affect reliability. As with any PCB stackup, make sure you get your fabricator involved in the manufacturing process early to ensure reliability problems do not arise during production.
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Monte Carlo Simulation vs. Sensitivity Analysis: What’s the Difference?
In a previous article about circuit simulation and reliability, I looked at how Monte Carlo analysis is commonly used to evaluate circuits that are subject to random variations in component values. Sensitivity analysis is a bit different and it tells you how the operating characteristics of your circuit change in a specific direction. Compared to a Monte Carlo simulation, sensitivity analysis gives you a convenient way to predict exactly how the operating characteristics will change if you were to deliberately increase or decrease the value of a component.
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Benefits of Using an Integrated Design Environment for PCB Development
Using separate tools often creates inefficiencies and increases the risk of mistakes. This article explains how integrated design environments streamline workflows by keeping design data connected and accessible.
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Enterprise vs. Midsize PCB Design Software: What Actually Changes at Scale
PCB design challenges change significantly as organizations scale. This article explores the key differences between mid-size and enterprise design environments, from collaboration and governance to data management and workflow automation.
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BOM Portal vs BOM Tool: What Changes When You Upgrade
Not all BOM solutions work the same way. This article explains the key differences between BOM tools and BOM portals, and why real-time data and collaboration are becoming essential for modern electronics development.
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Altium vs KiCAD: Built to Scale From First Board to Full Product
Starting with a simple board today doesn't mean your next project will stay simple. Learn how Altium Designer and KiCAD compare when designs become more complex, teams get larger, and products move toward manufacturing.
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Eliminate the Design-to-Production Gap with Agile Teams + Duro
Learn how Agile Teams and Duro connect design and production workflows through a unified system of record. This webinar shows how structured change management and automated data synchronization help teams reduce errors and accelerate product releases.
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Agile Hardware Development: How to Scale Speed Without Losing Control
Agile hardware development isn’t just about working faster, it’s about working together in real time. This article explores how shared environments for ECAD, MCAD, sourcing, and requirements management eliminate handoff delays and improve decision-making across teams.
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How Reusable Parameters in Requirements Reduce Errors and Speed Up Iterations
Verification becomes much easier when requirements and system performance data stay connected automatically. This article explains how reusable parameters and V&V rules help teams detect violations earlier and validate designs with greater confidence.
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Complex Engineering Projects Leverage Multiple ECAD/MCAD Formats
This article explores how modern engineering teams manage complex projects involving multiple ECAD, MCAD, and manufacturing file formats across distributed workflows. It highlights the importance of design authority, disciplined revision control, and bidirectional collaboration to ensure accurate integration between PCBs and mechanical systems.
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Avoid Costly Interconnect Errors: Essential Multiboard PCB Layout Strategies for Reliable Designs
Complex multiboard designs demand more than just connecting boards together. They require every interface to work flawlessly under real-world conditions. Discover how better pin assignments, return paths, and mechanical planning can dramatically improve reliability and reduce rework.
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BOM Cost Optimization During Schematic Capture
Engineering and sourcing teams work best when BOM decisions happen with live market data in view. This article explains how integrated cost and availability insights help teams collaborate earlier and avoid redesigns driven by supply chain issues.
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Why ECAD–MCAD Collaboration Is Essential to Design for Manufacturability (DFM)
Poor ECAD-MCAD coordination often leads to enclosure conflicts, connector misalignment, and costly redesigns. This article shows how integrated collaboration helps teams catch manufacturability issues earlier and keep projects moving smoothly.
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Registration Tolerance Is Now a Design Constraint, Not a Fab Problem
Ultra HDI is changing the rules of PCB design and registration tolerance is now part of the design conversation from day one. Discover how smarter spacing, stackup planning, and collaboration with fabricators can dramatically improve manufacturability and reliability.
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How to Use a Multicad Viewer for Seamless Collaboration
Because ECAD formats are typically incompatible, teams often struggle with versioning, conversions, and fragmented review processes. This article breaks down how multi-CAD viewers provide a unified, read-only environment that supports structured design reviews, comments, and task assignment across disciplines.
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Best Online ECAD File Viewers for Engineers and PCB Designers
Sharing PCB designs doesn’t have to be complicated. Check out the best online ECAD viewers that let anyone view and collaborate on designs right from a browser.
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Rigid-Flex PCBs in Consumer Electronics
Rigid-flex PCBs help modern devices get smaller, lighter, and more compact by eliminating connectors and fitting into tight 3D spaces. This article explains how to design them properly to avoid common reliability issues.
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From Design to First Assembly: Complete Your BOM & Plan Your Build
This webinar walks through the complete post-release workflow, from generating a managed BOM to sourcing components and assembling the first prototype. It demonstrates how integrated tools streamline data enrichment, supplier selection, and guided assembly to reduce delays and errors.
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