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Capacitive load termination
Blog
How to Impedance Match and Terminate Capacitive Loads

The idea of a purely capacitive load is something of a fallacy. Yes, capacitors exist, but all capacitors are non-ideal, and it is this deviation from a theoretical capacitance that determines how to impedance match a load that exhibits capacitive behavior. Let’s take a look at this important aspect of interconnect design and see what it really means to terminate a capacitive load.

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How to work with Selection
Tools for Easily Selecting Objects in the PCB

Explore more than basic mouse movements by taking a look at the tools that Altium Designer has to offer for making selecting and moving objects in the PCB an easy task. This will increase your productivity and allow you to spend more time designing

Using Altium 365 Over Your Vanilla Version Control System
Blog
Using Altium 365 Over Your Vanilla Version Control System

There are all sorts of version control systems out there that people have been using with their PCB design software. As discussed in Why Use a Version Control System, we looked at different options ranging for local hard drive storage to sophisticated online revisioning systems. In this article we will be reviewing the differences between a standard VCS and Altium 365.

Why Use a Version Control System in PCB Design
Blog
Why Use a Version Control System in PCB Design

Version Control Systems (VCS) have been around for many decades within the software world but can be surprisingly new to some folks in the electronics design industry. This article will cover what a VCS is, what it does, and why you should be using one for your PCB design projects.

IPC 6012 Class 3 Annular Ring
Blog
Meeting Standards: IPC 6012 Class 3 Annular Ring

Designers often conflate leftover annular ring and pad sizes - they need to place a sufficiently large pad size on the surface layer to ensure that the annular ring that is leftover during fabrication will be large enough. As long as the annular ring is sufficiently large, the drill hit will not be considered defective and the board will have passed inspection. In this article, I'll discuss the limits on IPC-6012 Class 3 annular rings as these are a standard fabrication requirement for high-reliability rigid PCBs.

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Working with Polygons
How to Work with The Polygon Manager

It is important to have a high-level view of all polygons on the PCB design. The Polygon Manager lets you rename polygons, set their pour order, perform re-pouring or disable pouring on selected polygons, add/scope the polygon connection style and clearance design rules, and add polygon classes for selected polygons.

PCB fabrication notes
Blog
Decoding PCB Fabrication Notes

Sending a board out for fabrication is an exciting and nerve-wracking moment. Why not just give your fabricator your design files and let them figure it out? There are a few reasons for this, but it means the responsibility comes back to you as the designer to produce manufacturing files and documentation for your PCB. It’s actually quite simple if you have the right design tools. We’ll look at how you can do this inside your PCB layout and how this will help you quickly generate data for your manufacturer.

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How to Work with Differential Pairs
Assigning Impedance Profiles for Differential Pairs

When you assign an impedance profile to a differential pair you open up several options for control over your routes. We'll show you how to do just that, as well as how to fix errors that may pop up and how to create classes for differential pairs based on assigned impedance profiles.

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How-To's
How to Highlight or Select Net Connections in the PCB

We’ll show you how to highlight net selections so you can easily track where connections are made. We’ll show you how to hide and show nets, and how to use the view configuration and PCB panels to view and highlight nets across your design, and how to assign net colors in both the PCB and the schematic.

HDI PCB design and HDI PCB manufacturing process
Blog
Design Basics for HDI and the HDI PCB Manufacturing Process

As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.

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How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

All About PCB Test Points
Blog
Is It Printed or a Component? All About PCB Test Points

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

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How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

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How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
Blog
Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

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On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

Tight versus loose coupling
Blog
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

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NEW
Blog
How Structural Electronics Enables 3D, Flexible, and Wearable Integration

Structural electronics integrates electronic functionality directly into the physical structure of a product, eliminating the need for traditional circuit boards. This article examines how advances in materials, additive manufacturing, and flexible substrates are enabling compact, 3D, and wearable systems with enhanced performance and design freedom.

Blog
Most Common Causes of PCB Assembly Rework and Scrap

Many PCB assemblies fail not because of exotic faults, but due to basic issues like incorrect BOM entries or footprint mismatches that force rework or scrap. This article dives into the most common causes and how to prevent costly defects in your design-to-manufacturing process.

Blog
Behind the Scenes with AI Embedded Development

Forget one-shot AI hacks Ari Mahpour shows the thoughtful, sustainable way to integrate AI into embedded firmware development. Learn the core principles (planning gate, HAL abstraction, observability, timeout design) that can help you push your efficiency 5-10 times in real hardware projects.

Blog
We're heading to PCB West 2025!

Join Altium at PCB West 2025 in Santa Clara, CA, on October 1! Stop by Booth 300 for the official launch of the new Altium platform, built on the foundation of Altium Designer and Altium 365. Be sure to check out our live demos of Altium Develop and Altium Agile.

Blog
Peak Electrical Performance in Multi-Board Designs With Advanced Simulation and Compliance Tools

Moving from single-board to multi-board systems is a leap in complexity. You must manage not just routing, but power, signal integrity, mechanical fit, and regulatory requirements across boards. In this article, you’ll discover how Altium’s advanced simulation and compliance tools help engineering teams overcome these challenges and deliver reliable multi-board solutions.

Blog
Executive Insights Into Electronic Product Development Gaps You Need To Close

Electronics hardware development is falling behind broader product development disciplines due to fragmented workflows, poor collaboration, and limited compliance visibility. This gap introduces risk, delays, and missed opportunities but executives see real business value in modernizing electronics development through better integration, traceability, and lifecycle visibility.

Blog
Sourcing For High-Mix Low-Volume Electronics Manufacturing

High-mix, low-volume (HMLV) electronics manufacturing requires agile sourcing strategies to handle shifting BOMs, erratic lead times, and component volatility. All while controlling costs and ensuring compliance. Cloud-based tools like Altium provide real-time component visibility, BOM collaboration, and supplier integrations to help navigate HMLV complexities.

Blog
One Vision, Three Powerful Solutions: Introducing Altium Discover, Altium Develop, and Altium Agile

We are excited to announce the launch of three new platform-based solutions that will transform the way electronic products are designed, built, and delivered: Altium Discover, Altium Develop, and Altium Agile. These solutions are designed to simplify processes, accelerate innovation, and make collaboration seamless across the entire electronics lifecycle. Together, they realize the purpose of Altium and Renesas: To Make Our Lives Easier.

Blog
The Top 5 Workflow Bottlenecks Slowing Down Mechanical Engineering Teams

Mechanical engineering teams frequently encounter delays from fragmented communication, disconnected toolchains, and inefficient synchronization processes. This article examines five critical workflow bottlenecks and highlights how ECAD-MCAD integration with real-time, bidirectional updates can eliminate rework and accelerate design iterations.

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Embedded thumbnail for Effective use of "Objects for snapping" when creating a Footprint
How to use Snapping
Effective use of "Objects for snapping" when creating a Footprint

Learn how to effectively use snaps that allow you to create a component footprint quickly and conveniently

Embedded thumbnail for How to Control Routing in Altium Designer
How-To's
How to Control Routing in Altium Designer

The routing functionality in Altium Designer is constantly evolving. Check out this video to learn the basics of routing in Altium Designer. 

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Working with Polygons
Polygon Creation

Learn how to create polygon pours to ensure proper copper distribution on your board.

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How to use Snapping
Creating Guide Lines and Snap Points

Explanation of guides and snap points and how to create and use them.

Embedded thumbnail for Polygon Types and Parameters
Working with Polygons
Polygon Types and Parameters

Each board requires different copper geometries. Polygon types make sure you can create the perfect copper geometry for every need.

Embedded thumbnail for How to Define Different Clearance for Internal and External Layers
How-To's
How to Define Different Clearance for Internal and External Layers

If you need to define difference clearance values for your external and internal layers, the answer is with design rules. We’ll walk you through it in this short video. 

Embedded thumbnail for Setting Snap Distance and Axis Snap Range
How to use Snapping
Setting Snap Distance and Axis Snap Range

Learn more about what snap distance and axis snap range are and how to use them.

Embedded thumbnail for Polygon Editing
Working with Polygons
Polygon Editing

Editing existing polygons is crucial for optimizing your design. You can easily select polygons to edit, resize, combine, and more.

Embedded thumbnail for How to Open All Schematic Documents
How-To's
How to Open All Schematic Documents

This video shows how to open all your project's schematic documents at once.

Embedded thumbnail for Calculating Impedance in Altium Designer
Impedance calculation
Calculating Impedance in Altium Designer

This video covers how to calculate impedance in Altium Designer. This is especially important when dealing with high-speed designs. You want to make sure impedance is matched to avoid any reflections and maintain good signal integrity.

Embedded thumbnail for Using 3D Component Body Features for Precise Component Creation
How to Work with 3D Mode
Using 3D Component Body Features for Precise Component Creation

Learn to quickly and accurately place 3D models of components on their footprints

Embedded thumbnail for How to Define an Impedance Profile for an Assymetric Stripeline
Impedance calculation
How to Define an Impedance Profile for an Assymetric Stripeline

This video shows how to define an impedance profile for an asymmetric stripline.

Embedded thumbnail for How I Improved my Collaboration Efficiency with Altium 365 | Altium 365: Power User Insights
How I Improved my Collaboration Efficiency with Altium 365 | Altium 365: Power User Insights

Collaboration with other teams or contractors in the electronics industry is typically a painful and inefficient experience. All too often, communication is left until the last minute when boards are all but ordered. Let's talk about how to collaborate with colleagues with Altium 365 in a different way.

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How to Work with Draftsman
Working with Annotation Tools

Draftsman Documents provide annotation tools to convey physical properties such as tolerances and surface finish

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How to Work with 3D Mode
3D View Control

Learn how to use the 3D display mode of the PCB and learn to control the camera in this mode in this video

Embedded thumbnail for Impedance Calculation Single-Ended Transmission Lines
Impedance calculation
Impedance Calculation Single-Ended Transmission Lines

Transmission lines help preserve signal integrity and reduce EMI in high speed designs. We’ll show you you to define your single ended transmission lines in Altium Designer and automatically calculate impedance on a two layer and multi-layer board.

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