News & Updates
Controlling crosstalk is one of the key goals in any PCB design. In most instances, when we talk about crosstalk, it’s in reference to the unwanted interaction of the electromagnetic field traveling on one transmission line with a neighboring transmission line. But crosstalk can also occur in the connector pin out. This article will describe this type of crosstalk, the types of disruptions it causes, wherein the design cycle it needs to be factored in and how it can be successfully controlled.
The design process often requires repetitive work with tedious tasks. Altium Designer 21 represents a better way to design by revitalizing long-standing functionality and improving the user experience, as well as performance and stability, based on the feedback from our users. These improvements streamline existing design tasks and empower you to complete sophisticated rigid and rigid-flex designs with realistic 3D modeling.
When you’re working through a new PCB design project, and you need to keep track of your project revisions, Altium 365™ creates the ideal environment for collaborative PCB design and revision tracking. Once you upload your projects onto the cloud through the Altium 365 platform, Altium 365 creates a Git repository for your project. It allows you to make it available to collaborators through Altium Designer®. This includes a complete project history, which can be easily accessed by collaborators working on a complex project.
The moment you push your Gerbers to a manufacturer for a DFM inspection, it can be a nerve-wracking experience waiting for a response. Before you receive your working boards, there will likely be some back-and-forth communication before your board hits the fabrication line. When manufacturers and designers need to resolve problems in Gerber files before fabrication, it helps to have a Gerber compare utility. The newest version of Altium Designer now offers this feature through the Altium 365 platform, giving everyone visibility into changes to Gerbers before fabrication.
No matter how you might feel about renewable energy and associated environmental issues, electric vehicles are becoming more mainstream and will become the primary mode of transportation in the future. For the engineering community, what’s much more interesting is how our power distribution and management infrastructure can support this shift to massive increases in the use of electricity on the grid. So what’s the rub for PCB designers?
When you’re working through a complex PCB layout, it always helps to know the shortcuts you can use to stay productive. Altium Designer® keyboard shortcuts, and keyboard + mouse shortcuts, can help you easily walk through your PCB layout during design and as part of final checks during a design review. Here are some of my favorite keyboard shortcuts and viewing options that help me stay productive, and I hope they can do the same for you.
Printed Electronics is emerging to become as common as 3D printing. With this fast-emerging technology, new possibilities have come into the manufacturing arena, allowing engineers and designers to develop products in markets never before realized. With the emergence of many contract manufacturers possessing this capability, the cost is competitive. Quick-turn prototypes and volume production are now all possibilities, and with Altium 365® you stay connected directly with your manufacturer throughout the design process.
High speed PCB interconnects have continued to remain an active challenge in modeling and simulation, particularly when dealing with broadband signals. The IEEE P370 standard is a step towards addressing the challenges faced by many designers in determining broadband S-parameters for high speed structures up to 50 GHz. Although this standard has been in the works since 2015, it finally passed board approval and appears as an active draft standard.
Amplifiers can come in all shapes and sizes, depending on their bandwidth, power consumption, and many other factors. A Class-D amplifier design is normally used with high fidelity audio systems, and circuits for a Class-D amplifier are not too difficult to build in a schematic. If you’ve never worked with a Class-D amplifier or you’re looking for a fun audio project, follow along with this PCB layout.
Modern digital systems throw the digital electronics textbooks out the window, and high-speed DDR memories are a perfect example of the paradigm shift that occurs when you jump into IC and PCB design. With DDR5 still being finalized, and DDR6 now being discussed, designers who are already comfortable with DDR4 will need to consider how their design practices should adjust to accommodate the constant doubling of data speeds in these high-speed memory technologies.
In my experience, the somewhat vague information you might find in a typical crystal datasheet doesn’t enable an engineer to be wholly confident that their design expectations can be met. On the other hand, “blindly” adopting what the crystal datasheet says usually results in adequate frequency stability. If you want to get inside and uncover what is going on, you need to start thinking about the crystal as a phase-shifting network.
An OutJob is simply a pre-configured set of outputs. Each output is configured with its own settings and its own output format, for example, output to a file or to a printer. OutJobs are very flexible – they can include as many or as few outputs as required and any number of OutJobs can be included in a project. The best approach is to use one OutJob to configure all outputs required for each specific type of output being generated from the project.
Antipads on vias and landing pads are a point of contention in modern PCB design, and the debate around the use of these elements in a multilayer PCB is framed as a binary choice. Like thermal reliefs, ground plane splits, and orthogonal routing, the debate around antipads on landing pads and vias is framed as an always/never choice. With today’s modern PCBs, it pays to understand the effects of antipads on signal integrity.
RF structures can be complicated to design and layout, particularly because many RF systems lead double lives as digital systems. Getting an analog signal out of a component and into a waveguide for high isolation routing is not so simple as placing a microstrip or stripline coming off your source component. Instead, you need to create a special microstrip to waveguide transition structure to ensure strong coupling into and out of your waveguide.
Layouts for complex electrical systems may need to make extensive use of copper pour to provide ground nets, power nets, shielding, and other copper structures for power and signal integrity. Backplanes, motherboards, RF products, and many other complex layouts will make use of copper pour and polygons that can’t be easily placed as custom components. The rules-driven design engine in Altium Designer® also ensures that any PCB polygon pour you place in your PCB layout will comply with clearance rules and will be checked against other electrical design rules.
Getting your PCB layout design done takes patience and precision. Complex footprint geometries, board shape, and dense component placement require accurate primitive positioning. Each stage of PCB design needs a different snapping configuration. Often your settings can be excellent for one stage and be unfavorable for another. Learn more about different snapping usage patterns and best practices of efficient snappings.
If you need to connect multiple boards into a larger system and provide interconnections between them, you’ll likely use a backplane to arrange these boards. Backplanes are advanced boards that borrow some elements from high speed design, mechanical design, high voltage/high current design, and even RF design. They carry their own set of standards that go beyond the reliability requirements in IPC.
The upcoming Gen6 version of PCIe is pushing the limits of signal integrity for many computer systems designers. As with any high-speed signaling standard, signal integrity is a major design consideration, which requires the right set of design and analysis techniques. Rather than digging deep to find PCIe 5.0 signal integrity requirements from PCI-SIG, we’ve compiled the important points for today’s PCB layout engineers. Layout engineers should pay attention here as these design requirements will become more stringent in later PCIe generations.
An essential aspect of project management is time management, especially when your design team is working remotely. Your time management strategy is team-based and individual, but time can easily get spent on important tasks when working as part of a team. So how can you streamline important collaboration tasks for your design team to increase productivity?
Controlled ESR capacitors are important for power integrity in your design as they can help smooth out the PDN impedance spectrum in your high speed PCB.
Whenever we say something to the effect of “components can’t work without a correctly designed PCB,” we only have to look at component packaging for evidence. It is true that component packages come with parasitics that affect signal integrity, but there is one area that we don’t often look at in terms of component packaging: power integrity.
In this article, we’ll look at all that is required to start creating your own custom microcontroller-based hardware designs. You’ll see that there actually isn’t too much to this, as microcontroller manufacturers over the years have tried to make the learning curve less steep and their devices more, and more accessible. This is both from an electrical point of view but also – equally importantly – from a programming point of view.
If you’ve taken time to learn about PCB material options and layer constructions, you have probably seen the wide range of materials that are available on the market. Materials companies produce laminates with varying Dk values, Tg values, weave styles, CTI values, and mechanical properties to target various applications in the electronics industry.
If you’re waiting for truly connected cars on a grand scale, there is still a massive amount of work to be done, both on the hardware and software sides. Connected cars can only become a widespread reality once the automotive industry and telecom carriers can decide which protocol will work best for vehicle-to-everything (V2X) communication. PCB designers will then need to step in to create these systems and fit them into a vehicular environment.
This one area of PCB design can be contentious among some designers as it is related to copper pour, which it is often stated is not needed in most designs. Regardless of your feelings about copper pour, stitching vias have important uses in PCBs at low frequencies and at high frequencies.
The IPC-2221 standard includes many requirements for printed circuit board design and manufacturability, and there are several online calculators that have been developed based on this standard.
When you’re ready to manufacture a new device at production volume, there are many aspects of the product that must come together. The enclosure, cabling and connectors, embedded software/firmware, and of course the PCBA all have to be considered in totality. There is a quick way to get your product into a usable enclosure, complete with input power and cabling, and with a form factor that fits your PCBA. This overused route to a new product is a box build assembly.
Printed circuit board fabricators have become skilled at manufacturing these technologies and also at understanding the reliability and producibility challenges associated with high-density-interconnect technology. Let’s look at where the PCB industry is at today.
What can the industry do to support PCB designers as they continue taking a more active role in product development? Here at Altium, there has been a progressive shift towards looking at the system level and creating tools that get designers more involved throughout the product development process. As the saying goes, over the wall engineering is over… today’s most successful products are built in a collaborative process.
As the 5G rollout progresses and researchers continue to discuss 6G, many new 5G-capable products operating in sub-GHz and mmWave bands are reaching the marketplace. Devices that will include a 5G-compatible front-end, whether small stations/repeaters or handheld devices, use phased arrays as high-gain antenna systems to provide high data throughput without losing range at higher frequencies.
Via protection is an important part of modern PCB design. It provides additional benefits in PCB manufacturing and assembly, increasing the number of acceptable products.
Power integrity problems can abound in modern PCBs, especially high-speed boards that run with fast edge rates. These systems require precise design of the PDN impedance to ensure stable power is always delivered throughout the system.
A design project doesn’t appear out of nowhere. The design process spreads over time, and project documents change. Schematic documents gradually become more complex, new functional blocks appear, and already finished parts can be modified and updated.
Capacitance is your friend whenever you need stable power integrity, which is why there is so much focus on decoupling capacitors. While these components are important and they can be used to provide targeted power integrity solutions to certain components, there is one specialty material used to supercharge capacitance in your PCB stackup or package substrate.
The problems you can experience with components and libraries are endless. These problems are the most significant source of design issues and the biggest reason behind respins, costing companies untold amounts of lost profit annually.
If you want to have a better understanding of how to use Altium 365 to maintain a strong and centralized library that is free of problems and headaches, you may want to consider attending this lecture.