News & Updates
Controlling crosstalk is one of the key goals in any PCB design. In most instances, when we talk about crosstalk, it’s in reference to the unwanted interaction of the electromagnetic field traveling on one transmission line with a neighboring transmission line. But crosstalk can also occur in the connector pin out. This article will describe this type of crosstalk, the types of disruptions it causes, wherein the design cycle it needs to be factored in and how it can be successfully controlled.
The design process often requires repetitive work with tedious tasks. Altium Designer 21 represents a better way to design by revitalizing long-standing functionality and improving the user experience, as well as performance and stability, based on the feedback from our users. These improvements streamline existing design tasks and empower you to complete sophisticated rigid and rigid-flex designs with realistic 3D modeling.
When you’re working through a new PCB design project, and you need to keep track of your project revisions, Altium 365™ creates the ideal environment for collaborative PCB design and revision tracking. Once you upload your projects onto the cloud through the Altium 365 platform, Altium 365 creates a Git repository for your project. It allows you to make it available to collaborators through Altium Designer®. This includes a complete project history, which can be easily accessed by collaborators working on a complex project.
The moment you push your Gerbers to a manufacturer for a DFM inspection, it can be a nerve-wracking experience waiting for a response. Before you receive your working boards, there will likely be some back-and-forth communication before your board hits the fabrication line. When manufacturers and designers need to resolve problems in Gerber files before fabrication, it helps to have a Gerber compare utility. The newest version of Altium Designer now offers this feature through the Altium 365 platform, giving everyone visibility into changes to Gerbers before fabrication.
No matter how you might feel about renewable energy and associated environmental issues, electric vehicles are becoming more mainstream and will become the primary mode of transportation in the future. For the engineering community, what’s much more interesting is how our power distribution and management infrastructure can support this shift to massive increases in the use of electricity on the grid. So what’s the rub for PCB designers?
When you’re working through a complex PCB layout, it always helps to know the shortcuts you can use to stay productive. Altium Designer® keyboard shortcuts, and keyboard + mouse shortcuts, can help you easily walk through your PCB layout during design and as part of final checks during a design review. Here are some of my favorite keyboard shortcuts and viewing options that help me stay productive, and I hope they can do the same for you.
Printed Electronics is emerging to become as common as 3D printing. With this fast-emerging technology, new possibilities have come into the manufacturing arena, allowing engineers and designers to develop products in markets never before realized. With the emergence of many contract manufacturers possessing this capability, the cost is competitive. Quick-turn prototypes and volume production are now all possibilities, and with Altium 365® you stay connected directly with your manufacturer throughout the design process.
High speed PCB interconnects have continued to remain an active challenge in modeling and simulation, particularly when dealing with broadband signals. The IEEE P370 standard is a step towards addressing the challenges faced by many designers in determining broadband S-parameters for high speed structures up to 50 GHz. Although this standard has been in the works since 2015, it finally passed board approval and appears as an active draft standard.
Amplifiers can come in all shapes and sizes, depending on their bandwidth, power consumption, and many other factors. A Class-D amplifier design is normally used with high fidelity audio systems, and circuits for a Class-D amplifier are not too difficult to build in a schematic. If you’ve never worked with a Class-D amplifier or you’re looking for a fun audio project, follow along with this PCB layout.
Modern digital systems throw the digital electronics textbooks out the window, and high-speed DDR memories are a perfect example of the paradigm shift that occurs when you jump into IC and PCB design. With DDR5 still being finalized, and DDR6 now being discussed, designers who are already comfortable with DDR4 will need to consider how their design practices should adjust to accommodate the constant doubling of data speeds in these high-speed memory technologies.
In my experience, the somewhat vague information you might find in a typical crystal datasheet doesn’t enable an engineer to be wholly confident that their design expectations can be met. On the other hand, “blindly” adopting what the crystal datasheet says usually results in adequate frequency stability. If you want to get inside and uncover what is going on, you need to start thinking about the crystal as a phase-shifting network.
An OutJob is simply a pre-configured set of outputs. Each output is configured with its own settings and its own output format, for example, output to a file or to a printer. OutJobs are very flexible – they can include as many or as few outputs as required and any number of OutJobs can be included in a project. The best approach is to use one OutJob to configure all outputs required for each specific type of output being generated from the project.
Antipads on vias and landing pads are a point of contention in modern PCB design, and the debate around the use of these elements in a multilayer PCB is framed as a binary choice. Like thermal reliefs, ground plane splits, and orthogonal routing, the debate around antipads on landing pads and vias is framed as an always/never choice. With today’s modern PCBs, it pays to understand the effects of antipads on signal integrity.
RF structures can be complicated to design and layout, particularly because many RF systems lead double lives as digital systems. Getting an analog signal out of a component and into a waveguide for high isolation routing is not so simple as placing a microstrip or stripline coming off your source component. Instead, you need to create a special microstrip to waveguide transition structure to ensure strong coupling into and out of your waveguide.
Layouts for complex electrical systems may need to make extensive use of copper pour to provide ground nets, power nets, shielding, and other copper structures for power and signal integrity. Backplanes, motherboards, RF products, and many other complex layouts will make use of copper pour and polygons that can’t be easily placed as custom components. The rules-driven design engine in Altium Designer® also ensures that any PCB polygon pour you place in your PCB layout will comply with clearance rules and will be checked against other electrical design rules.
Getting your PCB layout design done takes patience and precision. Complex footprint geometries, board shape, and dense component placement require accurate primitive positioning. Each stage of PCB design needs a different snapping configuration. Often your settings can be excellent for one stage and be unfavorable for another. Learn more about different snapping usage patterns and best practices of efficient snappings.
If you need to connect multiple boards into a larger system and provide interconnections between them, you’ll likely use a backplane to arrange these boards. Backplanes are advanced boards that borrow some elements from high speed design, mechanical design, high voltage/high current design, and even RF design. They carry their own set of standards that go beyond the reliability requirements in IPC.
The upcoming Gen6 version of PCIe is pushing the limits of signal integrity for many computer systems designers. As with any high-speed signaling standard, signal integrity is a major design consideration, which requires the right set of design and analysis techniques. Rather than digging deep to find PCIe 5.0 signal integrity requirements from PCI-SIG, we’ve compiled the important points for today’s PCB layout engineers. Layout engineers should pay attention here as these design requirements will become more stringent in later PCIe generations.
An essential aspect of project management is time management, especially when your design team is working remotely. Your time management strategy is team-based and individual, but time can easily get spent on important tasks when working as part of a team. So how can you streamline important collaboration tasks for your design team to increase productivity?
The next stage in the evolution of mobile telephony is here with the roll-out of 5G. The designer looking to incorporate functionality to handle 5G signals into their circuits will face some challenging issues. So, what’s so special about 5G?
The maximum PCB trace length you can place between two components depends on multiple factors, such as signaling protocol, component specification, losses in PCB laminate, and skew. With all this in mind, let’s look at where losses accumulate along the channel.
For low power devices, we generally see two types of power regulators: a low dropout regulator (LDO) or a switching regulator. You can mix and match these at different points along your power bus, but there’s still the matter of choosing whether to use an LDO vs. a switching regulator in your designs. If you’ve ever wondered how these decisions are made and when to use each type of regulator, just know that there is more to this decision than simply looking at the input/output voltage/current.
PCB fabrication is an extremely complex technological topic that deserves recognition as the most fundamental part of PCB engineering. Unless connectors, conductive adhesive, wire-bonding, or zebra-tape are used, in the modern electronics industry it’s always necessary to use some kind of flux during the soldering process to create an electric connection. In this article, we’ll discuss fluxes — what they are, what they are made of (yes, there is going to be a lot of chemistry, don’t be scared), how they should be used, and in what direction the industry is going.
As anyone who designs and builds electronic devices knows, the device will generate heat when it’s switched on. Wherever current flows through an impedance, energy losses will manifest themselves as heat. Integrated circuit packaging is getting smaller to meet the trend for more compact devices but at the cost of poorer thermal properties. This article describes the basic thermal management approaches to consider in your next designs.
We continue to explore the magic of energy conversion in a PWM transducer. Why is it magic? Theoretically, in a PWM transducer this happens without losses, isn't that magic? A PWM transducer, like a tailor with scissors, cuts the “fabric of energy” into pieces, and then, like a sewing machine, stitches the pieces of energy into a dress - DC Magnitude. What is a constant component and how can we get it? Let's explore!
There are different techniques in the world of technology to achieve various goals, both final and intermediate. Some techniques are so successful that they are commonly used with high efficiency. Electronics is no exception. The greatest example is the use of Pulse Width Modulation (PWM) signals (energy), which is applied in any modern electronic device. To apply PWM effectively, it is necessary to understand the engineering difficulties that engineers faced in the past, and the thoughts and ideas that subsequently were combined into effective, complete PWM power solutions.
If you speak with a bunch of design engineers, you might quickly form the opinion that the electrolytic capacitor has a particularly dubious reputation. A faulty electrolyte mix used in these types of capacitors led to premature device failures, and quite often, a “bit of a mess” was made to the PCBs on which they were soldered. However, despite the problem of the capacitor plague, this article is focusing on helping the designer understand how to get many more years of useful life from an electrolytic capacitor.
A schematic drawing will not only tell your PCB design software what needs to connect where, but it also communicates the purpose of a circuit to other people. It’s easy to create a schematic, but it can be harder to make a helpful schematic that can be quickly and easily read and comprehended by the reader. In this guide, based on years of industry experience, we will show you how to improve your schematic layout so that your designs are elegant and readable.
Suppose your job involves rapidly iterating designs or creating a wide variety of products for clients. In that case, there are some essential tools available that can save you a tremendous amount of time, bringing high engineering risk devices to completion successfully. Whether you’re working on internal projects or developing high mix devices for clients as a consulting or freelance firm, these indispensable tools will help you ship a higher quality product in less time.
Even though today’s cloud platforms are immaculately secure and they allow a range of files to be easily shared, there are times where you should limit the data you’re sharing to only the critical files required. For PCB designers, this means either sharing entire design projects or sharing individual files with your manufacturer, customers, contractors, or collaborators. If you want to eliminate liabilities and keep your team’s design data secure, consider these best practices for sharing PCB design data with Altium 365.
Best component companies will release reference designs for their new and legacy products to show designers an example application for a component. If the reference design is good enough and it very nicely illustrates how to quickly engineer around a few main components, I’m likely to use them in the design and the component maker has just earned my business. If you’re a newer designer and you’re wondering whether reference designs are right for your next project, follow these best practices so that you don’t make any mistakes with your reference design.
When we deal with “abstract” aspects of electromagnetic fields and how they function, it can be easy to get lost in the weeds regarding them. The first part of this article will address an important aspect of transmission line fundamentals, namely how electromagnetic fields and waves propagate on a transmission line. This article’s end goal is to create a core understanding of these concepts so that when it comes time to design a PDS, the proper design methodologies are followed and a properly working PDS is achieved appropriately, the first time and every time.
Via stubs are sometimes viewed as an annoyance, especially when you only need to make a transition between adjacent layers. For low speed, less-dense boards with low layer count, via stubs are an afterthought, or they may not receive consideration at all. For faster edge rates/higher frequencies, the conventional wisdom is to remove all via stubs. The question is: what exactly counts as “high frequency,” and how do you figure out the relevant length?
Unlike the clumsy human finger, a thermal camera can detect minute temperature differences across its view. This allows you to rapidly identify any components that are consuming current. Any parts or areas of your board that draw current will also generate heat that can easily be picked up by a thermal camera.
I want to share a little secret with you in this article: Assembling SMT prototypes boards is not only easy, but it requires very little equipment. Using just a stencil, I can easily hand prototype down to 0.3 mm pitch ICs, and 0201 (imperial) sized passive components. If you’re currently hand assembling boards with a soldering station, you need to stop this immediately and start using a stencil instead!