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Embedded thumbnail for Tent Vias under BGA
How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
Blog
Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

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On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

Tight versus loose coupling
Blog
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

Embedded thumbnail for Automatic Fanout With BGA
How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

Embedded thumbnail for Specifying NSMD and SMD for BGA
How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

Engineering Design Review Guide
Blog
How to Solve Your Engineering Design Review Challenges

You’ve possibly gone through plenty of engineering design reviews, both on the front-end of a project and the back-end before manufacturing. Engineering design reviews are performed to accomplish multiple objectives, and with many engineering teams taking a systems-based approach to design and production, electronics design teams will need to review much more than just a PCB layout and BOM. Today’s challenges with sourcing, manufacturability, reliability, and mechanical constraints are all areas that must be confronted in real designs

Embedded thumbnail for Via Shielding and Stitching
Via Stitching
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

Schematic Review Checklist
Blog
Schematic Review Checklist

One of the most common points of failure of a device occurs even before you start to layout your circuit board. Mistakes in your schematic design can easily make their way all the way into prototypes or production without a second thought once layout starts. In this article, I’m not going to extol the virtues of a good schematic design. Instead, this article is a simple no frills checklist.

Embedded thumbnail for xSignals for DDR3 and DDR4
How To Work with High-Speed Projects
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

Embedded thumbnail for High-Speed Tuning
How To Work with High-Speed Projects
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

Via current carrying capacity for PCBs
Blog
PCB Via Current-Carrying Capacity: How Hot is Too Hot?

One common question from designers is current-carrying capacity of conductors in a PCB. Trace and via current-carrying capacity are legitimate design points to focus on when designing a new board that will carry high current. The goal is to keep conductor temperatures below some appropriate limit, which then helps keep components on the board cool. Let’s dig into the current state of thermal demands on vias in PCBs and how they compare to internal and external PCB traces.

Simple Simulation in Altium Designer
On-Demand Webinar
SPICE Simulation Made Simple

SPICE simulation saves you critical time in the prototyping phase. Understanding your simulation interface makes it simple to analyze how your circuits work in different scenarios. Altium Designer provides an intuitive, dedicated interface to support your simulation verification, setup, and analysis directly in your schematic environment. You also benefit from growing support for popular model formats, as well as generic models, simplifying circuit definition and simulation.

PCB Shield
Blog
Phalanx, not Failure: PCB Shielding to Protect Your Design

A combination of good printed circuit board design and good shielding mitigates EMI. Good PCB design for EMI shielding revolves around the layout, the placement of filters, and ground planes. A well-designed PCB minimizes parasitic capacitance and ground loops. Keep reading to learn more about PCB shielding.

Embedded thumbnail for Using Document Parameters with Draftsman
How to Work with Draftsman
Using Document Parameters with Draftsman

The Draftsman Editor in Altium Designer uses document parameters to allow fine grain control over the draftsman document. We’ll show you how you can use the document parameters in your Draftsman document. 

Embedded thumbnail for High-Speed Features of Creating a Stack
How To Work with High-Speed Projects
High-Speed Features of Creating a Stack

The foundation of any high speed design is the layer stack. We’ll show you some of Altium Designer’s powerful layer stack creation features.

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Blog
How to Design a Thermal Prototype PCB

Thermal problems in PCBs often go unnoticed until prototyping, which can be costly. Design teams can't afford endless iterations, but they can conduct lower-cost thermal prototypes. Learn more about this approach in our new article.

Blog
DC-Aware Return Current in Mixed Signal PCBs

In this article, we will examine specific cases involving these types of components, where a very low-frequency signal or a DC signal needs to be measured, and the return path must be tracked to ensure the current loop is tight.

Blog
PCB Layout Replication: The Perfect Tool for Test Jigs

Replicate your circuits across multiple blocks with just a few clicks using a flawless preview pane, ensuring consistent, perfect results without the need for trial and error. Check out our new article on the PCB Layout Replication feature.

Altium 365 GovCloud Why We Chose AWS GovCloud (US) Cover
Blog
4 Reasons Why We Chose AWS GovCloud (US) for Altium 365 GovCloud

In this blog, we explain the reasons behind our decision to operate Altium 365 GovCloud within AWS GovCloud (US). This partnership is guided by a clear vision: to provide our users with a secure, compliant, and reliable platform for sensitive electronics design data.

Blog
3D MID Design Whitepaper

Dive into a dynamic design experience where you can visualize and edit your circuits in true 3D, offering unparalleled precision. Altium Designer's 3D-MID (Mechatronic Integrated Device) Design tool revolutionizes the design process, providing a fresh perspective. Explore the capabilities and benefits of this feature in our comprehensive guide.

Blog
Types of Wiring Harnesses for Electronics

In today's world, many products utilize multiple PCBs interconnected with each other, often leading to a complex network of cables within an enclosure. The most effective way to manage these wires and cables is by constructing a wiring harness. This article explores the various types of harnesses used in electronics.

Blog
Start Altium Designer 24 Training for Free

Level up your design skills with Altium Designer 24 training! Whether you're looking to brush up on the basics or delve into advanced techniques, our instructor-led or on-demand videos will help you master the latest features.

Blog
PCB Layout Replication Whitepaper

Experience seamless acceleration in your design workflow with Altium Designer® 24's PCB Layout Replication feature. Effortlessly duplicate layouts for recurring circuit blocks and component groups, amplifying efficiency and reducing expenses.

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Embedded thumbnail for Creating a PCB Footprint Courtyard
How to create a PCB Footprint
Creating a PCB Footprint Courtyard

The courtyard is an essential piece when you want to create a PCB Footprint in Altium Designer. We’ll talk about what a courtyard is, how to create a courtyard, and how to format a courtyard correctly for your PCB footprint.

Embedded thumbnail for How to Edit Existing Tracks in Altium Designer
How-To's
How to Edit Existing Tracks in Altium Designer

This new design rule flags a violation when the creepage distance across non-conductive surface and edge regions of the board, between the targeted signals, is equal to or less than the specified Creepage distance.

Embedded thumbnail for Creating a PCB Footprint Silkscreen Overlay
How to create a PCB Footprint
Creating a PCB Footprint Silkscreen Overlay

When creating a PCB footprint in Altium Designer creating a silkscreen overlay is an important requirement. We’ll go over the standards for creating a silkscreen overlay for a footprint and the steps to creating one, such as constructing lines and measuring distance of objects and primitives.

Tuning
What's New in 22.7
Ability to Change Tuning Object Layer Properties

Design of high-speed PCBs becomes easier with this latest release. Now, when you need to quickly move tuning elements to a different layer, you can do so from the Properties panel with a single click.

Tuning
What's New in 22.7
更改调节对象层属性功能

本次发布后,即可更加轻松地进行高速PCB设计。现在,当您需要将调节元件快速移动到其他层时,仅需单击一次即可从Properties面板中执行此操作。

Simulation models
What's New in 22.7
Auto-assign Simulation Models for Components without Models

This latest version of Altium Designer makes schematic simulation even easier. System intelligence automatically recognizes SPICE models and assigns them to components from available sources.

Simulation models
What's New in 22.7
自动分配不含模型的元件仿真模型

最新版Altium Designer将确保您能够更加轻松地进行原理图仿真。系统智能自动识别 SPICE 模型并将其分配给可用来源的元件。

Paste
What's New in 22.7
Control of Paste Mask Output for Variants

Output data needs to be as accurate as possible. For multi-variant designs you can now ensure that the paste mask is only displayed where it is really needed.

Paste
What's New in 22.7
变量助焊层输出控件

输出数据需要尽量准确。对于多变量设计,您现在可以确保将助焊层仅显示在真正需要的位置。

Embedded thumbnail for Adding Designators for Assembly Drawings
How-To's
Adding Designators for Assembly Drawings

Designators for assembly drawings are added on the assembly layer. This video shows how to add the designators.

Embedded thumbnail for Stackup Material Library
How to work with Layer Stack Manager
Stackup Material Library

In this video we will learn more about the Altium designers Layer Stack Mangers built-in materials library, and how to add new material and use it in our board stack. We will also look at how we can save the user materials to an xml format.

Embedded thumbnail for Placing Footprint Pads
How to create a PCB Footprint
Placing Footprint Pads

Every footprints needs proper pad placement to ensure trace connectivity. Placing pads is the first step towards footprint creation.

Embedded thumbnail for Setting the Transparency for Layers and Primitives
How-To's
Setting the Transparency for Layers and Primitives

Customize your workspace by setting the transparency of layers and primitives in the PCB.

Embedded thumbnail for Create New Via Types Using the Layer Stack Manager
How to work with Layer Stack Manager
Create New Via Types Using the Layer Stack Manager

In this video, we will learn how to create new via types using the Layer Stack Manager, and how to create new Routing Via design rules using the PCB Rules and Constraints Editor. We will also explore how to use the different types of Via during interactive routing.

Embedded thumbnail for How to Create a Copper Board Report
How-To's
How to Create a Copper Board Report

This video will show how to create a copper board report in your PCB which can be useful for copper balance in DFM process

Embedded thumbnail for Stackup Creation and editing
How to work with Layer Stack Manager
Stackup Creation and editing

This video shows how to view and edit the PCB Layer Stack, select materials and add new layers

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