News & Updates
Blog
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2+N+2 PCB Stackup Design for HDI Boards
Like any other advanced PCB, success in HDI design comes from designing the right stackup. One common HDI stackup used to support routing into moderate pin count, high-density BGA components is the 2+N+2 PCB layer stack for HDI boards. We’ll explore this stackup more in this article, as well as how it is related to other advanced stackups used in HDI PCBs.
Blog
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PDF in Altium 365 Web Viewer
Altium 365 Web Viewer now includes a built-in PDF viewer that allows you to view PDF files in releases without an external PDF viewer application. Keep reading to learn about new key features that make your work easier
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Flex and Rigid-Flex PCB Applications
There are two basic reasons for designing a flex circuit into your product: to build a compact and efficiently assembled device, or to make the circuit dynamically integrated with the mechanical function of the product. You may, of course, lean on both of these reasons for justifying the use of flex circuits. On this note, let’s look at some rigid-flex PCB applications and design examples to see the issues that spring to mind when designing flex circuits
On-Demand Webinar
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Preparing your files for Fabrication Release
When you’re done creating a new board, it’s time to send your design data to the manufacturer. Before releasing your designs, you’ll want to make sure that everything is ready and works as intended. In this informative video, we’ll review some of the must-have checks before sending your output data for fabrication.
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Granular Sharing — Role and Group Management
With Altium 365, you can grant permission to teams or users based on the specific needs of a project. We have expanded Altium 365’s file-sharing setting, giving you more granular control over who can download source files and reshare projects with others
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Design Rule Checking in the PCB Design Workflow
Any time you design a PCB, and you want to turn it into a real product, you will have to make sure the design obeys the constraints within the standard PCB manufacturing process. This imposes multiple rules on any design, and ECAD software will enforce design rules as you create the board to ensure you obey these important constraints. Make sure you enforce the right design rules at the beginning of the PCB design workflow
Blog
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Best Practices for High-Frequency PCB Material Selection
High frequency PCB design can seem esoteric, and I've heard many an engineer describe it as "black magic"! The subject is also a bit confusing, especially once someone asks which frequencies could be reasonably considered "high". Before you do anything inside the layout for a high-speed or RF PCB, you will need to pay attention to the materials being used in the board. If you're unsure which high frequency PCB materials you should use, then keep reading to learn more.
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PCB Noise Reduction: Do You Need Isolation, Shielding, or Filters?
Of all the noise and operational challenges designers face in their PCBs, there is one overarching problem that is arguably most popular: electronic noise. It could originate as an SI/PI problem, it could possibly arise from some external source, or it could be good old-fashioned crosstalk! These tend to fall into three categories: adding shielding, doing something to create isolation, or placing filters. Let's look at all of these as they tend to be the default solution set when confronted with many noise problems.
On-Demand Webinar
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CoDesigner and MCAD Component Placement On-Demand Webinar
We design products not just PCBs requiring effective collaboration between MCAD and ECAD engineers. We need to consider how we can reduce the likelihood of errors when placing critical design components. Component placement in the context of enclosures can be easily handled in an MCAD environment while it is more difficult to achieve in the ECAD domain. Learn how to place components from the MCAD side and synchronize them with Altium Designer ECAD models, designators, and sourcing data to simplify your design process.
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What’s New in Altium 365: Version Control for Hardware, Layer Stackup in Web Viewer, and SOC 2 Type 1 Certification
In February, we hit a new record in the number of users on the platform. The Altium 365 user community is now 20,000 strong! You can now migrate from an external version control system to Altium 365 preserving the history of commits. We also received the SOC 2 Type 1 certification from KPMG, made layer stack available in the web viewer, and added the brand new capability to track tasks in the context of your design project. Keep reading to learn more!
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6 Areas Your PCB Design Reviews Should Focus On
Learn the six essential topics every electronics team should address in design reviews to improve quality, avoid surprises and bring products to market faster.
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What Is BOM Management? A Practical Guide to Avoiding Costly Part Mismatches
From design to production, effective Bill of Materials (BOM) management is critical to ensuring smooth collaboration between engineering, procurement, and manufacturing teams. In this practical guide, we break down proven strategies for structuring, maintaining, and synchronizing your BOM to prevent costly mistakes and accelerate time-to-market.
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Requirements Portal Introductory Tutorials
This series of guided demos shows how the Altium Requirements Portal transforms scattered requirement spreadsheets and emails into traceable, version-controlled data that stays aligned with your PCB design efforts.
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Bridging the Gap: When to Use Rigid-Flex Instead of Flex & Connector
Discover when a rigid-flex PCB is a better choice than a separate flex circuit and connector, especially for designs requiring compact packaging, repeated motion or high reliability. The article emphasizes that although rigid-flex needs more upfront planning and fabrication collaboration, it often pays off in simpler assemblies and improved performance.
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Bridging Mechanical and Electrical Teams for Smarter Automotive Design
As vehicles evolve into advanced electronic systems, the separation between electrical and mechanical design teams becomes a critical bottleneck. This article explores how synchronized ECAD–MCAD workflows help automotive projects move faster, reduce rework and maintain design integrity.
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Via Structures: Designing for Reliability, Not Just Density
We all want to pack more into our PCB designs, but the smallest via isn’t always the smartest one. Dive in to learn how picking the right structure can save you headaches down the line.
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How Structural Electronics Enables 3D, Flexible, and Wearable Integration
Structural electronics integrates electronic functionality directly into the physical structure of a product, eliminating the need for traditional circuit boards. This article examines how advances in materials, additive manufacturing, and flexible substrates are enabling compact, 3D, and wearable systems with enhanced performance and design freedom.
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Beyond Traces: Why Soldermask May Be the Critical Factor in Ultra HDI
In ultra-HDI designs, soldermask is no longer a passive coating but a pivotal element that can determine manufacturability. This article explores why mask registration, resolution, and feature tolerances become critical as line spacings shrink below 50 µm.
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How ECAD-MCAD Co-Design Supports Aerospace Reliability and Compliance
When the margin for error is nearly zero, aerospace engineering demands a design process that’s seamless across all domains. Here, we explore how ECAD-MCAD co-design delivers an integrated workflow that supports first-pass success and compliance with strict aerospace standards.
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Most Common Causes of PCB Assembly Rework and Scrap
Many PCB assemblies fail not because of exotic faults, but due to basic issues like incorrect BOM entries or footprint mismatches that force rework or scrap. This article dives into the most common causes and how to prevent costly defects in your design-to-manufacturing process.
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Behind the Scenes with AI Embedded Development
Forget one-shot AI hacks Ari Mahpour shows the thoughtful, sustainable way to integrate AI into embedded firmware development. Learn the core principles (planning gate, HAL abstraction, observability, timeout design) that can help you push your efficiency 5-10 times in real hardware projects.
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We're heading to PCB West 2025!
Join Altium at PCB West 2025 in Santa Clara, CA, on October 1! Stop by Booth 300 for the official launch of the new Altium platform, built on the foundation of Altium Designer and Altium 365. Be sure to check out our live demos of Altium Develop and Altium Agile.
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Peak Electrical Performance in Multi-Board Designs With Advanced Simulation and Compliance Tools
Moving from single-board to multi-board systems is a leap in complexity. You must manage not just routing, but power, signal integrity, mechanical fit, and regulatory requirements across boards. In this article, you’ll discover how Altium’s advanced simulation and compliance tools help engineering teams overcome these challenges and deliver reliable multi-board solutions.
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How to Catch Enclosure and Connector Misalignment Before the First Prototype
As electronics continue to miniaturize and functionality increases, even minor misalignments between enclosures and connectors can derail a project. This article explores how early integration of ECAD and MCAD workflows helps detect and eliminate those costly issues before the first prototype is built.
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Executive Insights Into Electronic Product Development Gaps You Need To Close
Electronics hardware development is falling behind broader product development disciplines due to fragmented workflows, poor collaboration, and limited compliance visibility. This gap introduces risk, delays, and missed opportunities but executives see real business value in modernizing electronics development through better integration, traceability, and lifecycle visibility.
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Sourcing For High-Mix Low-Volume Electronics Manufacturing
High-mix, low-volume (HMLV) electronics manufacturing requires agile sourcing strategies to handle shifting BOMs, erratic lead times, and component volatility. All while controlling costs and ensuring compliance. Cloud-based tools like Altium provide real-time component visibility, BOM collaboration, and supplier integrations to help navigate HMLV complexities.
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