News & Updates
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Getting Through a PCB DFM Check
In this article, we’ll discuss the key design features to implement, and steps to take prior to fabrication that will help prevent some common DFM problems. I’ll also provide examples of where I commonly see these PCB DFM problems in signal integrity circuits.
Blog
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What is Spreading Inductance?
If you’re working with a high-speed digital component, there are some simple power integrity rules that should be followed. However, there is one quantity that is sometimes ignored when building a PDN impedance simulation: the spreading inductance of your plane pair. Here are some points designers should know about the spreading inductance of a plane pair.
Blog
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PCB Design Basics for New Designers
In this article, I’ll present some design basics that every new designer should follow to help ensure their design process is successful. Some of these points may challenge the conventional view of how circuit boards are constructed, but they are intended to help balance low noise signaling, manufacturability, and ease of solving a layout.
On-Demand Webinar
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Efficient PCB Routing Using Gloss and Retrace Tools
The primary goal of your traces is to carry signals throughout your board without losses. To do this properly, you must familiarize yourself with the requirements for signals on the printed circuit board and how to optimize the topology of the board in terms of signal integrity. We will analyze the most popular routing cases applicable for using the Gloss and Retrace tools in Altium Designer to optimize your signal integrity.
Blog
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Selecting Materials for High Voltage PCB Design and Layout
High voltage PCBs are subject to certain safety and reliability concerns that you won’t find in most other boards. If your fabrication house specializes in high voltage PCBs and keeps materials in stock, they can likely recommend a material set, as well as a standard stackup you might use for certain voltage ranges and frequencies. If you need to choose your own materials, follow the tips below to help you narrow down to the right material set.
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When to Use Tented Vias in Your PCB Layout
There are some guidelines I see many designers implement as a standard practice, often without thinking about it. Some of these practices are misunderstood or implemented without best practices. Others are implemented without thinking about the potential problems. One of these is the use of tented vias, which is sometimes implemented in a PCB layout by default. Is this always the right practice?
Blog
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How to Impedance Match and Terminate Capacitive Loads
The idea of a purely capacitive load is something of a fallacy. Yes, capacitors exist, but all capacitors are non-ideal, and it is this deviation from a theoretical capacitance that determines how to impedance match a load that exhibits capacitive behavior. Let’s take a look at this important aspect of interconnect design and see what it really means to terminate a capacitive load.
Blog
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Using Altium 365 Over Your Vanilla Version Control System
There are all sorts of version control systems out there that people have been using with their PCB design software. As discussed in Why Use a Version Control System, we looked at different options ranging for local hard drive storage to sophisticated online revisioning systems. In this article we will be reviewing the differences between a standard VCS and Altium 365.
Blog
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Why Use a Version Control System in PCB Design
Version Control Systems (VCS) have been around for many decades within the software world but can be surprisingly new to some folks in the electronics design industry. This article will cover what a VCS is, what it does, and why you should be using one for your PCB design projects.
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Meeting Standards: IPC 6012 Class 3 Annular Ring
Designers often conflate leftover annular ring and pad sizes - they need to place a sufficiently large pad size on the surface layer to ensure that the annular ring that is leftover during fabrication will be large enough. As long as the annular ring is sufficiently large, the drill hit will not be considered defective and the board will have passed inspection. In this article, I'll discuss the limits on IPC-6012 Class 3 annular rings as these are a standard fabrication requirement for high-reliability rigid PCBs.
NEW
Blog
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Digital Thread for Electronics: Synchronizing PCB, Multi-Board, and Harness Design
Eliminate costly mismatches and assembly delays. This whitepaper shows you how to apply a unified digital thread across PCB, multi-board, and harness workflows - bridging ECAD/MCAD silos, ensuring connector accuracy, mechanical fit, and real-time collaboration for flawless system design.
NEW
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Building a Model Context Protocol Server for Arduinos
This guide walks you through creating an MCP server that turns AI interactions with Arduino into a predictable, automated process handling tasks like board listing, compilation, and serial communication via a fast, menu‑driven interface. Skip the guesswork of prompt nudging and reduce the risk of unintended device issues.
Blog
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Zero Voltage Switching in DC/DC Converters
Our brand-new article explains how zero-voltage switching improves performance in DC/DC converters through reduced losses, lower EMI, and smarter gate-drive control.
Blog
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Getting Started with the GreenPAK Introduction Kit
Take your first steps into mixed-signal design with the Renesas GreenPAK Introduction Kit. Ari Mahpour shows how to design, simulate, and validate a clock divider project, making it easy for beginners to start experimenting with programmable mixed-signal devices.
Blog
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Smarter Electronic Part Sourcing for Automotive Purchasing Professionals
Targeted at procurement professionals in the automotive industry, the article outlines the evolving pressures of sourcing components for electrified and connected vehicles. It highlights Octopart’s ecosystem as a unified tool that centralizes availability, compliance, pricing, and lifecycle intelligence to optimize sourcing efficiency.
Blog
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Stack-Up to Success: Avoid the Pitfalls
"Stack‑Up to Success" highlights how a carefully planned PCB stack‑up is foundational to preventing warpage, managing impedance, and avoiding manufacturing delays by clearly communicating layer construction, materials, and tolerance requirements to fabricators.
Blog
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IC Components Explained: A Comprehensive Guide to Integrated Circuits
Gain a clear understanding of the fundamental elements within integrated circuits. This guide examines their structure, function, and role in system performance, knowledge that’s vital for anyone involved in sourcing or developing electronic designs.
Blog
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Ensuring Precise Connector Alignment in Multi‑Board Manufacturing
Misaligned connectors can cause major issues in multi-board assemblies. In this article, David Marrakchi shows how Altium’s 3D tools help detect and fix alignment problems early in the design process.
Blog
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Getting Started with the Renesas RA8D1 Evaluation Kit and Edge AI
Dive into the power of Renesas’ RA8D1 MCU using the EK‑RA8D1 evaluation kit. Learn how to train, test, and deploy image‑based detection models seamlessly with Edge Impulse, and kickstart your embedded vision AI projects in minutes.
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How to Effectively Use Jira for Hardware Development Projects
Originally built for software development, Jira has become a popular tool for agile project management across various industries. Our new article explores how hardware teams can leverage core Jira features and adapt agile principles to suit the unique needs of hardware development.
Blog
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Building Supply Chain Resilience: Transforming BOM Management for Modern Electronics
Discover why top electronics companies are replacing spreadsheets with purpose-built BOM management solutions. This whitepaper outlines the risks of outdated methods, offers a readiness checklist, and explores how BOM Portal helps teams cut costs, reduce risk, and speed up development with smarter, data-driven workflows.
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Material and Process Considerations That Influence Performance
Material and process choices play a key role in high-performance PCB design. This article highlights how stack-up configuration, substrate selection, and lamination strategy impact signal integrity, reliability, and manufacturability.
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How to Make Your PCB Layout AOI and X-Ray Friendly
Designing for inspection is key to reliable manufacturing. This article covers practical PCB layout tips to optimize your board for AOI and X-ray inspection helping you reduce defects, false positives, and production delays.
Blog
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Understanding Systems Engineering
Read our brand-new article where we explore the key areas of an engineering project and the different stages of electronic product development from a project execution perspective. From initiation and planning to design, development, validation, testing, and certification, we walk you through each phase to help you understand how successful electronic products are brought to life.
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PCB First-Pass Yield: Small Decisions That Make a Big Difference
This article highlights how seemingly minor layout choices like trace spacing, component footprints, or stack-up details can dramatically impact whether a board passes fabrication and assembly the first time.
Blog
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Implementing Design for Supply Chain Principles in Electronic Product Development
Designing with supply chain principles in mind helps you avoid delays, reduce costs, and ensure manufacturability. This article outlines practical strategies for component selection, sourcing, and lifecycle management to make your designs more resilient and production-ready.
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