News & Updates
It’s no secret that component shortages have become more frequent this year. In fact, countries around the world are losing billions in revenue due to supply issues. Having the right components on hand is more crucial than ever as availability, obsolescence, counterfeit products and environmental non-compliance risks continue to grow. Fortunately, many shortages can be avoided by introducing proactive supply chain practices.
It's no secret that software developers often use completed code fragments from other projects for quick and predictable results. The same can be done for PCB Design, there is no need to spend time rewiring schematics or laying out components on boards you’ve done before. Join us this webinar where we’ll go over how you can use your existing designs to create reusable design blocks, speeding up the design cycle for your future projects.
Do length-tuning structures create an impedance discontinuity? The answer is an unequivocal “yes”, but it might not matter in your design depending on several factors. Applying a length-tuning structure is equivalent to changing the distance between the traces while meandering. Therefore, you will have a change in the odd-mode impedance of a single trace. The question then becomes: does this deviation in trace impedance in a length tuning structure matter?
The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators. To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer counts, multiple levels of stacked micro vias and increased lamination cycles.
Take a look at the inside of some integrated circuit packages, and you’ll find a number of wires bonded to the semiconductor die and the pads at the edge of the component's package. As a signal traverses makes its way along an interconnect and into a destination circuit, signals need to travel across these bond wires and pads before they are interpreted as a logic state. As you look around the edge of an IC, these bond wires can have different lengths, and they incur different levels of delay and contribute to total jitter.
Once you’ve run out of room on your 4-layer PCB, it’s time to graduate to a 6-layer board. The additional layer can give you room for more signals, an additional plane pair, or a mix of conductors. How you use these extra layers is less important than how you arrange them in the PCB stackup, as well as how you route on a 6-layer PCB. If you’ve never used a 6-layer board before, or you’ve had EMI troubles with this stackup that are difficult to solve, keep reading to see some 6-layer PCB design guidelines and best practices.
There are many aspects to designing a PCB. One of the larger aspects has to do with managing your components. We all need components for our designs, but are those components in our library and designs up-to-date or even purchasable? These questions need to be answered before we can safely use them. If not, we could just be wasting our time designing with invalid components. Altium Designer® has several tools to help you manage the components in your libraries and designs.
We are happy to announce that the Altium Designer 22.5 update is now available. Altium Designer 22.5 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!
PCB stackups often incorporate slightly dissimilar materials that could pose a reliability problem. Hybrid PCBs are one case where the PCB stackup will include different materials, typically a standard FR4 laminate and a PTFE laminate for RF PCBs. Designers who want to take the lead on material selection when designing their hybrid stackups should consider these factors that affect reliability. As with any PCB stackup, make sure you get your fabricator involved in the manufacturing process early to ensure reliability problems do not arise during production.
In a previous article about circuit simulation and reliability, I looked at how Monte Carlo analysis is commonly used to evaluate circuits that are subject to random variations in component values. Sensitivity analysis is a bit different and it tells you how the operating characteristics of your circuit change in a specific direction. Compared to a Monte Carlo simulation, sensitivity analysis gives you a convenient way to predict exactly how the operating characteristics will change if you were to deliberately increase or decrease the value of a component.
Collaborative engineering is all about breaking down silos so electrical, mechanical, and sourcing teams can work as one with shared data and real-time updates. This article shows how that approach helps you spot issues early, reduce rework, and get products out the door with fewer surprises.
Focused on durability under repeated mechanical stress, this piece details how routing strategy, copper thickness, adhesive systems, and bend radius selection determine flex lifespan. Engineers will find actionable recommendations for reducing strain concentration and improving long-term performance in high-cycle applications.
Dive into how a modern EDA workflow transforms PCB design by linking electrical, mechanical, and manufacturing requirements from idea to final release. With constraint‑driven integration, you can cut down on respins and bring better boards to market faster.
Explore our collection of MCAD Collaboration walkthroughs, where you’ll discover how to synchronize mechanical constraints and keepouts, maintain traceability with advanced history and revision control, and streamline electromechanical connectivity through harness synchronization. These topics and many more are covered in this article.
The article highlights that productivity issues often stem from tool limitations rather than engineer effort, especially as project complexity grows. ECAD tools that offer clear version control, cross-discipline integration, and workflow awareness are key to sustaining efficiency.
Fewer tool handoffs, fewer errors, and smoother collaboration that’s the power of integrated PCB design. Learn how unifying your design environment can cut development time and help you deliver complex electronics faster.
As UHDI structures shrink, achieving accurate layer-to-layer registration becomes less forgiving than ever. Learn why fabrication tolerances matter so much in ultra-fine geometries and how to design with registration limits in mind from the start.
Engineering project management tools play a critical role in managing timelines, resources, and cross-disciplinary coordination. This article breaks down the most impactful systems for improving execution and team performance.
Discover seven actionable ways to spot and fix rules and constraint issues before they derail your PCB project. Using Altium Designer Agile, these tips help you build more manufacturable and reliable boards with fewer iterations.
If your output package is Gerber-based, adding an IPC-D-356 netlist can dramatically improve how your design is reviewed and validated for production. Here’s when it matters, what it contains, and how to generate it quickly in Altium.
When engineering and procurement work from different BOM versions, delays and cost surprises follow. Learn how agile BOM management brings teams onto one connected BOM so they can respond fast, manage risk, and lock pricing early.
A flex circuit can look perfect on paper and still fail in the real world due to EMI, hot spots, or mechanical strain. This article breaks down how shielding, thermal planning, and stiffeners help deliver designs that stay reliable over time.
Power distribution issues can silently undermine your PCB’s reliability. This article uncovers the top three failure modes and shows how Power Analyzer by Keysight helps you catch them early in the design phase and how Altium Agile Teams turns those checks into structured team action.
When engineering and procurement remain disconnected, supply-chain problems will sneak up on you. This guide argues convincingly: embed sourcing constraints into your requirements from day one, and avoid costly rework down the line.
Power integrity is the backbone of reliable PCB design. This whitepaper explains how to analyze and optimize voltage drop, current density, and grounding directly within Altium Designer Agile using the Power Analyzer by Keysight.
Strong hardware starts with strong libraries. Discover how disciplined ECAD-library management dramatically improves design consistency and accelerates every stage of your PCB workflow.