News & Updates
A number of us on this blog and in other publications often bring up the concept of target impedance when discussing power integrity in high-speed designs. Some designs will be simple enough that you can take a “set it and forget it” approach to design a functional prototype. For more advanced designs, or if you’re fine-tuning a new board that has existing power integrity problems, target impedance is a real consideration that should be considered in your design.
Dual power supplies are circuits that generate two different output voltages from a single input source. The simplest method of generating dual output voltages is to use a transformer with two taps on the output winding. Bespoke transformers can have any voltage ratio depending on the number of windings in each part of the output side of the transformer.
With digital boards that are nominally running at DC, splitting up a power plane or using multiple power planes is a necessity for routing large currents at standard core/logic levels to digital components. Once you start mixing analog and digital sections into your power layers with multiple nets, it can be difficult to implement clean power in a design if you’re not careful with your layout.
Working between the Electronic and Mechanical design domains brings unique challenges. ECAD and MCAD tools have different design objectives and have evolved down different paths, and so have the way they store and manage their design and project data. To successfully design these products, the designers must fluidly pass design changes back and forth between the ECAD and MCAD domains beyond outdated file exchanges.
High-speed digital PCBs are challenging enough to design, but what about mixed-signal boards? Many modern systems contain elements that operate with both digital and analog signaling, and these systems must be designed to ensure signal integrity in both domains. Altium Designer has the layout and signal integrity tools you need to ensure your mixed-signal PCB design does not experience interference and obeys important design standards.
Just as WiFi 6 and 6E are starting to hit the market and new chipsets become available, WiFi 7 is in the works under the 802.11be standard. While this technology still has not hit the market, I would expect more inquiries for experimental systems, evaluation modules, and surface-mountable modules to come up once the first chipsets become available. Now is the time to start thinking about these systems, especially if you’re developing evaluation products to support WiFi 7.
Rugged electronics need to take a punch mechanically, but there is more that goes into a rugged system than being able to survive a drop on the pavement. This is as much about enclosure design as it is about component selection and manufacturing choices. Mil-aero designers often use the term “harsh environment” to describe a number of scenarios where an electronic device’s reliability and lifetime will be put to the test. If you want to make your next product truly rugged, it helps to adopt some of their strategies in your PCB layout.
There are many quality checks used to ensure a design will be manufacturable at scale and with high quality, but a lot of this can happen in the background without the designer realizing. No matter what level of testing and inspection you need to perform, it’s important to determine the basic test requirements your design must satisfy and communicate these to your manufacturer. If it’s your first time transitioning from prototyping to high-volume production, read our list of PCB testing requirements so that you’ll know what to expect.
Getting started with design rules can sometimes be a difficult task, but it doesn’t have to be. Altium Designer has added a new design rules user interface along with a new way to define rules, while not compromising past methods. Now, rules and constraints have a design-centric view rather than a rules-centric view which allows for easier visualization and is less prone to error. Watch this video to learn how you can best utilize the improved Rules 2.0 design rule interface.
Embedded computers, vision devices, DAQ modules, and much more will all need some memory, whether it’s a Flash chip or a RAM module. Normally, something like a Flash memory chip or a small eMMC module would not be used for temporary storage as the device requires constant rewrites. Instead, if you happen to need a volatile memory solution, you would go for static (SRAM) or dynamic RAM (DRAM). If you need to decide which type of memory to use in your board, keep reading to see some of the basic design guidelines for SDRAM vs. DDR memory modules.
Using a PCB ground plane in a stackup is the first step towards ensuring power and signal integrity, as well as keeping EMI low. However, there are some bad myths about ground planes that seem to persist, and I’ve seen highly experienced designers make some simple mistakes when defining grounds in their PCB layouts. If you’re interested in preventing excess emissions and ensuring signal integrity in your layout, follow these simple guidelines for implementing a PCB ground plane in your next board.
We are continuing our journey through the open-source laptop project. This article explains an initialization of CAD design process from the early concept and brainstorming phase.
In this blog we will show you the strategies to minimize the risk of damage to circuit boards during the initial power-up process.
Essential tips for high-speed PCB designs, and when you need to start being concerned about how and where you route your traces.
If you've ever wanted to mount components vertically, but without the expense of a flex section this article is for you. You can use an MID in your PCB.
Explore the basics of conformal coating with us. Conformal coating is a protective layer applied to electronic circuits to guard against environmental factors such as moisture and dust.
We have started a very exciting journey into the creation of an open source laptop project. This project will be an ongoing one, with our community able interactively participate. By utilizing Altium 365 users will be able to view, comment on, and download design files. This will be a great learning experience for new and experienced PCB designers.
Electronics designers working in small design houses or in large enterprises often encounter a common set of challenges when interfacing with mechanical designers. Continue reading to learn how you can best interface with your mechanical designer to get your projects out the door fast!
HDI PCBs take a particular approach to routing interconnects through multiple layers to ensure reliability during fabrication, assembly, and operation. The critical structure that enables this is microvias, which are prone to failure if not designed properly. In this e-book, readers will receive an initial look at the reasons microvia reliability has come into the spotlight and why HDI PCB designers put reliability first when routing through microvias.
Aside from impedance and annular ring calculations, one of the other major formulas specified in the IPC 2221 standard relates temperature rise, trace width, and trace current. THere is also the IPC-2152 standard, both include this guidance on designing for thermal reliability, but which standard should we use?
Striplines provide some advantages over microstrips as they take advantage of natural shielding and coupling from nearby ground plane layers. Although they tend to experience higher losses due to total confinement in the dielectric, they can be thinner due to the high dielectric constant used in internal layers of a PCB. Use our free impedence calculator to help you determine the correct width needed to hit a target impedance.
An optoisolator is a cool electronic device that can be used to pass information between a diode without passing an electrical current. There are many great applications for these, but do you know which one is right for you?
The Properties panel provides access to the properties of documents and objects. The contents of the panel change depending on the active document or the selected object. This blog will quickly go over some of need to know options around the properties panel in the schematic document.
Even with all the good guidelines out there for high speed design, there are particular aspects of stackup construction and their relation to building boards that get overlooked. This blog is goes beyond just the typical SI/PI guidelines and looks at these problems from more of an engineering perspective.
Stitching vias are something you often see spread around the surface layer of a PCB, but what are they? and should you be using them? In this guide, we'll go over some of the standard uses of stitching vias and when they should be used in a PCB.
In comparison to the build-up of a PCB, the stackup is more concerned with the electrical type of each layer, that is are we working with signals, power, or ground. Continue reading to learn how you can optimize your layer stack.
Altium’s VP of marketing Lawrence Romine discusses the multi-board and harness design capabilities coming in Altium Designer 23.