News & Updates
Batteries offer a great power source for electrical devices that need to be mobile or located somewhere where connection to a mains electricity supply or other power source is impossible. The biggest problem with battery power is the expectation of users that the device will operate for significant periods with the need for recharging or replacing the batteries. This demand is placing the onus on the designer to improve efficiency and reduce power demand to meet this need.
A number of us on this blog and in other publications often bring up the concept of target impedance when discussing power integrity in high-speed designs. Some designs will be simple enough that you can take a “set it and forget it” approach to design a functional prototype. For more advanced designs, or if you’re fine-tuning a new board that has existing power integrity problems, target impedance is a real consideration that should be considered in your design.
Dual power supplies are circuits that generate two different output voltages from a single input source. The simplest method of generating dual output voltages is to use a transformer with two taps on the output winding. Bespoke transformers can have any voltage ratio depending on the number of windings in each part of the output side of the transformer.
With digital boards that are nominally running at DC, splitting up a power plane or using multiple power planes is a necessity for routing large currents at standard core/logic levels to digital components. Once you start mixing analog and digital sections into your power layers with multiple nets, it can be difficult to implement clean power in a design if you’re not careful with your layout.
Working between the Electronic and Mechanical design domains brings unique challenges. ECAD and MCAD tools have different design objectives and have evolved down different paths, and so have the way they store and manage their design and project data. To successfully design these products, the designers must fluidly pass design changes back and forth between the ECAD and MCAD domains beyond outdated file exchanges.
High-speed digital PCBs are challenging enough to design, but what about mixed-signal boards? Many modern systems contain elements that operate with both digital and analog signaling, and these systems must be designed to ensure signal integrity in both domains. Altium Designer has the layout and signal integrity tools you need to ensure your mixed-signal PCB design does not experience interference and obeys important design standards.
Just as WiFi 6 and 6E are starting to hit the market and new chipsets become available, WiFi 7 is in the works under the 802.11be standard. While this technology still has not hit the market, I would expect more inquiries for experimental systems, evaluation modules, and surface-mountable modules to come up once the first chipsets become available. Now is the time to start thinking about these systems, especially if you’re developing evaluation products to support WiFi 7.
Rugged electronics need to take a punch mechanically, but there is more that goes into a rugged system than being able to survive a drop on the pavement. This is as much about enclosure design as it is about component selection and manufacturing choices. Mil-aero designers often use the term “harsh environment” to describe a number of scenarios where an electronic device’s reliability and lifetime will be put to the test. If you want to make your next product truly rugged, it helps to adopt some of their strategies in your PCB layout.
There are many quality checks used to ensure a design will be manufacturable at scale and with high quality, but a lot of this can happen in the background without the designer realizing. No matter what level of testing and inspection you need to perform, it’s important to determine the basic test requirements your design must satisfy and communicate these to your manufacturer. If it’s your first time transitioning from prototyping to high-volume production, read our list of PCB testing requirements so that you’ll know what to expect.
Getting started with design rules can sometimes be a difficult task, but it doesn’t have to be. Altium Designer has added a new design rules user interface along with a new way to define rules, while not compromising past methods. Now, rules and constraints have a design-centric view rather than a rules-centric view which allows for easier visualization and is less prone to error. Watch this video to learn how you can best utilize the improved Rules 2.0 design rule interface.
Embedded computers, vision devices, DAQ modules, and much more will all need some memory, whether it’s a Flash chip or a RAM module. Normally, something like a Flash memory chip or a small eMMC module would not be used for temporary storage as the device requires constant rewrites. Instead, if you happen to need a volatile memory solution, you would go for static (SRAM) or dynamic RAM (DRAM). If you need to decide which type of memory to use in your board, keep reading to see some of the basic design guidelines for SDRAM vs. DDR memory modules.
Using a PCB ground plane in a stackup is the first step towards ensuring power and signal integrity, as well as keeping EMI low. However, there are some bad myths about ground planes that seem to persist, and I’ve seen highly experienced designers make some simple mistakes when defining grounds in their PCB layouts. If you’re interested in preventing excess emissions and ensuring signal integrity in your layout, follow these simple guidelines for implementing a PCB ground plane in your next board.
To pour or not to pour, to stitch or not to stitch… Over many years, some common “rules of thumb” have become very popular and, ultimately, taken a bit out of context. Rules of thumb are not always wrong, but taking PCB design recommendations out of context helps justify bad design practices, and it can even affect the producibility of your board. Like many aspects of a physical PCB layout, via stitching and copper pour can be like acid: quite useful if implemented properly, but also dangerous if used indiscriminately.
Power MOSFETs enable a huge range of electronic systems, specifically in situations where BJTs are not useful or efficient. MOSFETs can be used in high current systems in parallel arrangements, but what about their use in series? Both arrangements of MOSFETs have their pitfalls that designers should consider. Let’s look at MOSFETs in series as they are quite useful in certain systems, but be careful to design your circuits and your PCB for reliability.
I can’t think of a single product I’ve built that doesn’t require capacitors. We often talk a lot about effective series inductance (ESL) in capacitors and its effects on power integrity. What about effective series resistance (ESR)? Is there a technique you can use to determine the appropriate level of resistance, and can you use ESR to your advantage?
If your goal is to hit a target impedance, and you’re worried about how nearby pour might affect impedance, you can get closer than the limits set by the 3W rule. But what are the effects on losses? If the reason for this question isn’t obvious, or if you’re not up-to-date on the finer points of transmission line design, then keep reading to see how nearby ground pour can affect losses in impedance-controlled interconnects.
If you need to capture sound waves for your electrical device to process, you'll need a microphone. However, microphones these days have become very advanced, and there are so many options to choose from. They range from the relatively simple and popular condenser type microphones to state-of-the-art sound conversion solutions incorporating internal amplifiers and other electronic processing functionality. In this article, we'll take a look at some of the options available.
There are many times where you need an amplifier with high gain, low noise, high slew rate, and broad bandwidth simultaneously. However, not all of these design goals are possible with all off-the-shelf components. Here are some points to consider when working with a composite amplifier design and how to evaluate your design with the right set of circuit simulation tools.
Simple switching regulator circuits that operate in compact spaces, like on a small PCB, can usually be deployed in noisy environments without superimposing significant noise on the output power level. As long as you lay out the board properly, you’ll probably only need a simple filter circuit to remove EMI on the inputs and outputs. As the regulator becomes larger, both physically and electrically, noise problems can become much more apparent, namely radiated EMI and conducted EMI in the PCB layout.
A PCB design review is a practice to review the design of a board for possible errors and issues at various stages of product development. It can range from a formal checklist with official sign-offs to a more free-form inspection of schematic drawings and PCB layouts. For this article, we will not delve into what to check during a design review process but rather look at how a review process itself usually unfolds and how to optimize it to get the most out of your time.
As we established in Part 1, the PCB design review and collaboration practices have room for improvement in many organizations. To address this, we developed Altium 365. Let's examine how running a PCB project through Altium 365 compares to other methods.
If you look on the internet, you'll find some interesting grounding recommendations, and sometimes terminology gets thrown around and applied to a PCB without the proper context or understanding of real electrical behavior. DC recommendations get applied to AC, low current gets applied to high current, and vice versa... the list goes on. One of the more interesting grounding techniques you'll see as a recommendation, including on some popular engineering blogs within the industry, is the use of PCB star grounding.
Every PCB has silkscreen on the surface layer, and you’ll see a range of alphanumeric codes, numbers, markings, and logos on PCB silkscreen. What exactly does it all mean, and what specifically should you include in your silkscreen layer? All designs are different, but there are some common pieces of information that will appear in any silkscreen in order to aid assembly, testing, debug, and traceability
Designing high-speed channels on complex boards requires simulations, measurements on test boards, or both to ensure the design operates as you intend. Gibbs ringing is one of these effects that can occur when calculating a channel’s response using band-limited network parameters. Just as is the case in measurements, Gibbs ringing can occur in channel simulations due to the fact that network parameters are typically band-limited.
In electronics, there is the possibility that your PCB can get pretty hot due to power dissipation in certain components. There are many things to consider when dealing with heat in your board, and it starts with determining power dissipation in your design during schematic capture. If you happen to be operating within safe limits in a high power device, you might need an SMD heat sink on certain components. Ultimately, this could save your components, your product, and even the operator.
One thing is certain: power supply designs can get much more complex than simply routing DC power lines to your components. RF power supply designs require special care to ensure they will function without transferring excessive noise between portions of the system, something that is made more difficult due to the high power levels involved. In addition to careful layout, circuitry needs to be designed such that the system provides highly efficient power conversion and delivery to each subsection of the system.
Overvoltage, overcurrent, and heat are the three most likely events that can destroy our expensive silicon-based components or reduce our product’s life expectancy. The effects are often quite instant, but our product might survive several months of chronic overstress before giving up the ghost in some cases. Without adequate protection, our circuit can be vulnerable to damage, so what should we do? Or do we need to do anything?
Today’s PCB designers and layout engineers often need to put on their simulation hat to learn more about the products they build. When you need to perform simulations, you need models for components, and simulation models often need to be shared with other team members at the project level or component level. What’s the best way for Altium Designer users to share this data? Read this article to learn more about sharing your models with other design participants.