News & Updates
Blog
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Improving Supply Chain Success with BOM Management
It’s no secret that component shortages have become more frequent this year. In fact, countries around the world are losing billions in revenue due to supply issues. Having the right components on hand is more crucial than ever as availability, obsolescence, counterfeit products and environmental non-compliance risks continue to grow. Fortunately, many shortages can be avoided by introducing proactive supply chain practices.
On-Demand Webinar
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Rapidly Creating New Designs And Reusing Existing Ones
It's no secret that software developers often use completed code fragments from other projects for quick and predictable results. The same can be done for PCB Design, there is no need to spend time rewiring schematics or laying out components on boards you’ve done before. Join us this webinar where we’ll go over how you can use your existing designs to create reusable design blocks, speeding up the design cycle for your future projects.
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What is the Impedance of Length-Tuning Structures?
Do length-tuning structures create an impedance discontinuity? The answer is an unequivocal “yes”, but it might not matter in your design depending on several factors. Applying a length-tuning structure is equivalent to changing the distance between the traces while meandering. Therefore, you will have a change in the odd-mode impedance of a single trace. The question then becomes: does this deviation in trace impedance in a length tuning structure matter?
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A-SAP™ – What do you need to know?
The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators. To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer counts, multiple levels of stacked micro vias and increased lamination cycles.
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Pin-Package Delay and Via Delay in High Speed Length Tuning
Take a look at the inside of some integrated circuit packages, and you’ll find a number of wires bonded to the semiconductor die and the pads at the edge of the component's package. As a signal traverses makes its way along an interconnect and into a destination circuit, signals need to travel across these bond wires and pads before they are interpreted as a logic state. As you look around the edge of an IC, these bond wires can have different lengths, and they incur different levels of delay and contribute to total jitter.
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6-Layer PCB Design Guidelines
Once you’ve run out of room on your 4-layer PCB, it’s time to graduate to a 6-layer board. The additional layer can give you room for more signals, an additional plane pair, or a mix of conductors. How you use these extra layers is less important than how you arrange them in the PCB stackup, as well as how you route on a 6-layer PCB. If you’ve never used a 6-layer board before, or you’ve had EMI troubles with this stackup that are difficult to solve, keep reading to see some 6-layer PCB design guidelines and best practices.
On-Demand Webinar
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Help Ensure The Best Designs With Component Management
There are many aspects to designing a PCB. One of the larger aspects has to do with managing your components. We all need components for our designs, but are those components in our library and designs up-to-date or even purchasable? These questions need to be answered before we can safely use them. If not, we could just be wasting our time designing with invalid components. Altium Designer® has several tools to help you manage the components in your libraries and designs.
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Altium Designer 22.5 Update
We are happy to announce that the Altium Designer 22.5 update is now available. Altium Designer 22.5 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!
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How Reliable is Your Hybrid PCB Stackup?
PCB stackups often incorporate slightly dissimilar materials that could pose a reliability problem. Hybrid PCBs are one case where the PCB stackup will include different materials, typically a standard FR4 laminate and a PTFE laminate for RF PCBs. Designers who want to take the lead on material selection when designing their hybrid stackups should consider these factors that affect reliability. As with any PCB stackup, make sure you get your fabricator involved in the manufacturing process early to ensure reliability problems do not arise during production.
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Monte Carlo Simulation vs. Sensitivity Analysis: What’s the Difference?
In a previous article about circuit simulation and reliability, I looked at how Monte Carlo analysis is commonly used to evaluate circuits that are subject to random variations in component values. Sensitivity analysis is a bit different and it tells you how the operating characteristics of your circuit change in a specific direction. Compared to a Monte Carlo simulation, sensitivity analysis gives you a convenient way to predict exactly how the operating characteristics will change if you were to deliberately increase or decrease the value of a component.
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Design Phase – Lid Assembly Electronics Part 1
We are advancing our Open Source Laptop project to the next stage: assembling lid electronics. In the first part of this phase, we are focusing on the electronics and PCB design of the webcam module.
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3 Common Challenges Stopping Your Production Line
The efficiency of production lines is crucial for any successful hardware product development. However, some challenges derail these processes. Do you face these problems, too? Let’s find out!
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Explore New Possibilities with True 3D-MID Design
3D-MID technology seamlessly integrates electrical circuits with three-dimensional mechanical parts. This unique fusion of functionality unlocks a myriad of possibilities across various application areas. Explore more about this innovative feature, available in Altium Designer 24, to delve into the fascinating world of the 3D design process.
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Strategies to Minimize PCB Damage
The PCB design process is always an exciting journey for a designer or the founder of a project. The first run of it can be breathtaking. In this article, we delve into strategies for minimizing PCB damage in the case of an exemplary circuit.
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Fragmented Feedback Loops: The Hidden Cost in PCB Design and Testing
Explore the hidden impact of fragmented feedback loops in PCB design and testing. Check how minor communication gaps lead to significant financial burdens and learn how to address them.
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Altium 365 GovCloud 101: Everything You Need to Know
Would you like to improve the protection of your data? Altium 365 GovCloud can help you achieve these goals. It’s a version of Altium 365, engineered to meet the stringent demands of US government regulations.
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Design Phase – Lid Assembly Mechanics Part 3
We are heightening the anticipation for our Open Source Laptop project. In this chapter, we delve into the ambient light sensor module. Learn more about how to implement it into this project.
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PCB CoDesign: Design Faster Together
Experience accelerated design collaboration with PCB CoDesign, exclusively available on Altium Designer starting from December 13th. This innovative feature adopts a collaborative approach by seamlessly integrating schematic and PCB design, enabling multiple engineers to work on the same project. Explore this cutting-edge feature on our newly launched page dedicated to its functionalities.
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6 Steps to Accelerate the Development of Complex Products
Learn the key lessons from the presentation at Iteration22; “Joe Justice, Wikispeed - Everyone Must Be a Chief Engineer at SpaceX.” Read on and discover how to speed up the development of complex products.
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Design Phase – Lid Assembly Mechanics Part 2
We are continuing our journey into lid assembly mechanics inside the Open Source Laptop Project. In this chapter, we are focusing on the sensor PCB above the display panel.
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How to Speed Up Your Manual Assembly Process with Assembly Assistant? The Story of XVP Photonics
Are you struggling with your manual assembly process? Would you like to speed it up and improve component placement accuracy? Read the story of XVP Photonics; with Assembly Assistant, they improved the component placement time by 25%. Discover how!
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45V-5A Adjustable Half-Bridge DC to DC Converter
DC-to-DC buck converters are extensively employed in electronic devices. In this article, we will introduce you to one of our new projects—a DC-to-DC converter designed to serve as a power supply as well.
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The Challenges of Modern Design: Why Requirements Management Is Essential
You need a robust requirements management process to ensure your design intent communication stays clear and organized. Read on to explore the crucial connection between well-managed requirements and today’s design.
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Efficiency And Noise Top 10 Switching Regulator Modules
Switching regulator modules have become indispensable in a wide array of electronic devices, providing a more efficient means of voltage conversion between different levels by storing and releasing energy. Explore further insights into these devices in today's dynamic world of electronics.
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Add USB Type-C Power Delivery to Your Designs!
We want to invite you to explore the fundamentals of USB Type-C Power Delivery which is now the most popular energy transmission in current times. We will show you how to easily incorporate a dedicated PD IC into your own designs.
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Design Phase – Lid Assembly Mechanics Part 1
It is time to delve deep into the mechanical design of our Open Source Laptop project. In this article we give you an update about the first part of fitting elements into the system. You will learn more about laptop lid, webcam integration, light sensor and microphones which will be used in this project.
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