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Embedded thumbnail for Assigning Impedance Profiles for Differential Pairs
How to Work with Differential Pairs
Assigning Impedance Profiles for Differential Pairs

When you assign an impedance profile to a differential pair you open up several options for control over your routes. We'll show you how to do just that, as well as how to fix errors that may pop up and how to create classes for differential pairs based on assigned impedance profiles.

Embedded thumbnail for How to Highlight or Select Net Connections in the PCB
How-To's
How to Highlight or Select Net Connections in the PCB

We’ll show you how to highlight net selections so you can easily track where connections are made. We’ll show you how to hide and show nets, and how to use the view configuration and PCB panels to view and highlight nets across your design, and how to assign net colors in both the PCB and the schematic.

HDI PCB design and HDI PCB manufacturing process
Blog
Design Basics for HDI and the HDI PCB Manufacturing Process

As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.

Embedded thumbnail for Remove Unused Via Pads
How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

All About PCB Test Points
Blog
Is It Printed or a Component? All About PCB Test Points

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

Embedded thumbnail for Tent Vias under BGA
How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
Blog
Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

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On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

Tight versus loose coupling
Blog
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

Embedded thumbnail for Automatic Fanout With BGA
How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

Embedded thumbnail for Specifying NSMD and SMD for BGA
How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

Engineering Design Review Guide
Blog
How to Solve Your Engineering Design Review Challenges

You’ve possibly gone through plenty of engineering design reviews, both on the front-end of a project and the back-end before manufacturing. Engineering design reviews are performed to accomplish multiple objectives, and with many engineering teams taking a systems-based approach to design and production, electronics design teams will need to review much more than just a PCB layout and BOM. Today’s challenges with sourcing, manufacturability, reliability, and mechanical constraints are all areas that must be confronted in real designs

Embedded thumbnail for Via Shielding and Stitching
Via Stitching
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

Schematic Review Checklist
Blog
Schematic Review Checklist

One of the most common points of failure of a device occurs even before you start to layout your circuit board. Mistakes in your schematic design can easily make their way all the way into prototypes or production without a second thought once layout starts. In this article, I’m not going to extol the virtues of a good schematic design. Instead, this article is a simple no frills checklist.

Embedded thumbnail for xSignals for DDR3 and DDR4
How To Work with High-Speed Projects
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

Embedded thumbnail for High-Speed Tuning
How To Work with High-Speed Projects
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

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Blog
Concept Phase – Cooling and Airflow Part 1

Next step in our open-source laptop project is to explain how to design cooling and airflow. In this article, we can show you the first part of this process, such as airflow concept, fan measurement and clearance.

Harness Design
Blog
Create Connections with Harness Design

Many modern electronics have multiple boards, and connecting those different boards and systems together are harnesses. Learn more about how Altium Designer can help you create harnesses for your own multi-board designs here.

Blog
Nucleo Shields Multi-Board Design

Learn how easy it is to create multi-board projects. This practical project article covers the reasons for breaking larger boards into sub-assemblies and explores the various connection options available between sub-assembly boards.

Blog
Analog Solar Tracker Project

In this article you can learn about light sensors while building an analog solar panel tracking system. This open-source project covers multi-channel design, window comparators, driving motors, and photosensors.

Blog
Concept Phase – Initial CAD Design

We are continuing our journey through the open-source laptop project. This article explains an initialization of CAD design process from the early concept and brainstorming phase.

Blog
High-Speed PCB Design Tips

Essential tips for high-speed PCB designs, and when you need to start being concerned about how and where you route your traces.

Introduction to Open Source Laptop Project
Blog
Introduction to Open Source Laptop Project

We have started a very exciting journey into the creation of an open source laptop project. This project will be an ongoing one, with our community able interactively participate. By utilizing Altium 365 users will be able to view, comment on, and download design files. This will be a great learning experience for new and experienced PCB designers.

Blog
Ebook: Routing High-Density Interconnects with Reliable Microvias

HDI PCBs take a particular approach to routing interconnects through multiple layers to ensure reliability during fabrication, assembly, and operation. The critical structure that enables this is microvias, which are prone to failure if not designed properly. In this e-book, readers will receive an initial look at the reasons microvia reliability has come into the spotlight and why HDI PCB designers put reliability first when routing through microvias.

Blog
IPC-2221 Calculator for PCB Trace Current and Heating

Aside from impedance and annular ring calculations, one of the other major formulas specified in the IPC 2221 standard relates temperature rise, trace width, and trace current. THere is also the IPC-2152 standard, both include this guidance on designing for thermal reliability, but which standard should we use?

Blog
Stripline Impedance Calculator

Striplines provide some advantages over microstrips as they take advantage of natural shielding and coupling from nearby ground plane layers. Although they tend to experience higher losses due to total confinement in the dielectric, they can be thinner due to the high dielectric constant used in internal layers of a PCB. Use our free impedence calculator to help you determine the correct width needed to hit a target impedance.

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Embedded thumbnail for Simplify Analysis with Power Analyzer by Keysight
How-To's
Simplify Analysis with Power Analyzer by Keysight

The Power Analyzer by Keysight in Altium Designer simplifies power design by enabling detailed analysis of power nets and PDNs. This demo highlights how to identify and resolve issues like voltage drops to ensure reliable power delivery, all within the Altium environment.

Embedded thumbnail for Perfect your high-speed routing with Dynamic Phase Matching!
New in Altium Designer 25
Perfect your high-speed routing with Dynamic Phase Matching!

Struggling with phase matching in your high-speed projects? Learn how Altium Designer 25’s Dynamic Phase Matching feature ensures precise signal integrity and simplifies high-speed design.

Embedded thumbnail for Hardware Design Masterclass Wrocław 2024 - Autumn Edition
HDM Wrocław
Hardware Design Masterclass Wrocław 2024 - Autumn Edition

Altium participated in the Hardware Design Masterclass Wrocław 2024, organized by Rafał Stępień. Representing Altium, Samer Aldhaher delivered a presentation on Wire Bonding in Altium Designer. This slideshow highlights key moments from the event.

Embedded thumbnail for Pi Filter Formulas and Simulation Deep Dive
How-To's
Pi Filter Formulas and Simulation Deep Dive

Learn the essentials of Pi filters, including how to size, design, and simulate them in Altium Designer. Host Zach Peterson explains the design equations for Pi filters, discusses online tools for accurate component selection, and demonstrates real-time simulations in Altium Designer to visualize the effects of impedance mismatches.

Embedded thumbnail for True Donut Pad Shapes
New in Altium Designer 25
True Donut Pad Shapes

Check out our brand-new short video showcasing an exciting improvement in the PCB design process. Altium Designer 25 now supports true donut pad shapes, enhancing both your routing and performance.

Embedded thumbnail for Modernizing Engineering Workflows: Altium Designer 25 and the Future of Concurrent Design - Recording Preview
New in Altium Designer 25
Modernizing Engineering Workflows: Altium Designer 25 and the Future of Concurrent Design - Recording Preview

Discover the new features in Altium Designer 25! This webinar recording highlights the Signal Analyzer by Keysight, advanced Wire Bonding capabilities, multi-board design enhancements, and more, showcasing how these tools can transform your PCB design process.

Embedded thumbnail for Dynamic Phase Matching and Tuning for Differential Pairs
New in Altium Designer 25
Dynamic Phase Matching and Tuning for Differential Pairs

Explore how dynamic phase matching for differential pairs works with the improved match length rule in Altium Designer. Learn key techniques in this quick tutorial!

Embedded thumbnail for Obey Rules and Auto-Shrinking Features
New in Altium Designer 25
Obey Rules and Auto-Shrinking Features

Discover how Altium Designer 25's Obey Rules and Auto-Shrinking features streamline routing, ensuring speed and precision while maintaining adherence to all design constraints.

Embedded thumbnail for Quickstart Guide: Single Layer PCB Design with Altium Designer 25
New in Altium Designer 25
Quickstart Guide: Single Layer PCB Design with Altium Designer 25

Transform your designs with the new Single Layer PCB Design feature in Altium Designer 25! Whether you're working on Rigid-Flex projects or creating simple, space-saving boards, this tool makes the process faster, smarter, and more efficient. Watch our guide now and unlock your next big innovation.

Embedded thumbnail for How to Design Bending Regions in Flex PCBs
How-To's
How to Design Bending Regions in Flex PCBs

Watch our latest video on bending regions in flex PCBs! This step-by-step guide will show you how to configure stack-ups, distinguish between flex and rigid regions, and troubleshoot common issues in 3D views.

Embedded thumbnail for LDO Regulator Essentials: From Basics to Advanced. Part V: Ripple Rejection
LDO Regulator Essentials
LDO Regulator Essentials: From Basics to Advanced. Part V: Ripple Rejection

The final part of the LDO Regulator Essentials series focuses on voltage ripple rejection in Low Dropout Regulators (LDOs). Our host Rafał Stępień explains how LDOs clean up DC supply waves, ensuring stable performance in power systems. This episode provides practical insights for optimizing sensitive designs.

Embedded thumbnail for Explore Routing Improvements in Altium Designer 25
New in Altium Designer 25
Explore Routing Improvements in Altium Designer 25

Discover Routing Improvements in Altium Designer 25. Learn about Dynamic Phase Matching, True Donut Pad Shape, and more in our latest video showcasing the powerful enhancements in our newest release.

Embedded thumbnail for Wire Bonding Shorts: Die Footprints
New in Altium Designer 25
Wire Bonding Shorts: Die Footprints

Check our new short video where Samer Aldhaher demonstrates the Wire Bonding feature in Altium Designer 25, including die-to-die and die-to-copper connections, multiple wire bonds, and pad rotation techniques.

Embedded thumbnail for Altium Designer 25: Collaboration at its Finest
New in Altium Designer 25
Altium Designer 25: Collaboration at its Finest

Altium Designer 25 focuses on enhancing collaboration for engineering teams with new tools like the SI Analyzer by Keysight, updated PCB CoDesign, MCAD and Ansys CoDesigners, and improved Simulation modules. This release also introduces Wire Bonding, Single Layer PCB, and performance upgrades for optimized PCB design workflows. Check our overview video about all the improvements in this release.

Embedded thumbnail for The Fastest Ways to Run a PCB BOM Review
How-To's
The Fastest Ways to Run a PCB BOM Review

Conducting a BOM review is crucial to prevent costly delays, obsolete components, and unforeseen sourcing challenges in your PCB project. Discover powerful tools like DigiKey, Octopart, and Altium 365’s BOM portal to simplify your review process and ensure you're selecting the best parts at optimal prices.

Embedded thumbnail for Quantum Systems uses Altium Designer and Altium 365 to build the future of Drones
Altium Stories
Quantum Systems uses Altium Designer and Altium 365 to build the future of Drones

Quantum Systems creates advanced drones for critical aerial intelligence across industries. With Altium Designer and Altium 365, they streamline electronics engineering and enhance team collaboration. Watch how Altium software helps them innovate faster and build reliable drones for mission-critical moments.

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