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Capacitive load termination
Blog
How to Impedance Match and Terminate Capacitive Loads

The idea of a purely capacitive load is something of a fallacy. Yes, capacitors exist, but all capacitors are non-ideal, and it is this deviation from a theoretical capacitance that determines how to impedance match a load that exhibits capacitive behavior. Let’s take a look at this important aspect of interconnect design and see what it really means to terminate a capacitive load.

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How to work with Selection
Tools for Easily Selecting Objects in the PCB

Explore more than basic mouse movements by taking a look at the tools that Altium Designer has to offer for making selecting and moving objects in the PCB an easy task. This will increase your productivity and allow you to spend more time designing

Using Altium 365 Over Your Vanilla Version Control System
Blog
Using Altium 365 Over Your Vanilla Version Control System

There are all sorts of version control systems out there that people have been using with their PCB design software. As discussed in Why Use a Version Control System, we looked at different options ranging for local hard drive storage to sophisticated online revisioning systems. In this article we will be reviewing the differences between a standard VCS and Altium 365.

Why Use a Version Control System in PCB Design
Blog
Why Use a Version Control System in PCB Design

Version Control Systems (VCS) have been around for many decades within the software world but can be surprisingly new to some folks in the electronics design industry. This article will cover what a VCS is, what it does, and why you should be using one for your PCB design projects.

IPC 6012 Class 3 Annular Ring
Blog
Meeting Standards: IPC 6012 Class 3 Annular Ring

Designers often conflate leftover annular ring and pad sizes - they need to place a sufficiently large pad size on the surface layer to ensure that the annular ring that is leftover during fabrication will be large enough. As long as the annular ring is sufficiently large, the drill hit will not be considered defective and the board will have passed inspection. In this article, I'll discuss the limits on IPC-6012 Class 3 annular rings as these are a standard fabrication requirement for high-reliability rigid PCBs.

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Working with Polygons
How to Work with The Polygon Manager

It is important to have a high-level view of all polygons on the PCB design. The Polygon Manager lets you rename polygons, set their pour order, perform re-pouring or disable pouring on selected polygons, add/scope the polygon connection style and clearance design rules, and add polygon classes for selected polygons.

PCB fabrication notes
Blog
Decoding PCB Fabrication Notes

Sending a board out for fabrication is an exciting and nerve-wracking moment. Why not just give your fabricator your design files and let them figure it out? There are a few reasons for this, but it means the responsibility comes back to you as the designer to produce manufacturing files and documentation for your PCB. It’s actually quite simple if you have the right design tools. We’ll look at how you can do this inside your PCB layout and how this will help you quickly generate data for your manufacturer.

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How to Work with Differential Pairs
Assigning Impedance Profiles for Differential Pairs

When you assign an impedance profile to a differential pair you open up several options for control over your routes. We'll show you how to do just that, as well as how to fix errors that may pop up and how to create classes for differential pairs based on assigned impedance profiles.

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How-To's
How to Highlight or Select Net Connections in the PCB

We’ll show you how to highlight net selections so you can easily track where connections are made. We’ll show you how to hide and show nets, and how to use the view configuration and PCB panels to view and highlight nets across your design, and how to assign net colors in both the PCB and the schematic.

HDI PCB design and HDI PCB manufacturing process
Blog
Design Basics for HDI and the HDI PCB Manufacturing Process

As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.

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How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

All About PCB Test Points
Blog
Is It Printed or a Component? All About PCB Test Points

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

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How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

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How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

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How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
Blog
Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

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On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

Tight versus loose coupling
Blog
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

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NEW
Blog
Printed Electronics: The Future of Flexible and Cost-Effective Circuit Design

This article explores the rise of printed electronics as a lightweight, flexible, and cost-effective alternative to traditional PCB design. It highlights key benefits like reduced manufacturing costs, sustainability, and new design possibilities—especially in wearables, medical devices, and automotive applications. 

Blog
New Routing Possibilities with Ultra HDI

Explore how Ultra HDI technology is redefining PCB design. This article breaks down the benefits and manufacturing considerations of Ultra HDI, and how it enables next-level routing density and miniaturization in advanced electronics.

Blog
3D-MID in Focus: Principles, Processes, and Practical Use

This article introduces 3D-MID (Mechatronic Integrated Devices), a technology that integrates circuitry into 3D plastic structures to reduce size, weight, and complexity. It explains the production process, use cases, and benefits of 3D-MID in sectors like automotive, medical, and consumer electronics.

Blog
Eliminate EMI and Signal Integrity Issues in Multi-Board PCB Designs

Ensure signal integrity and minimize EMI in complex electronics. Our new article explains how to address electromagnetic interference and signal integrity challenges in multi-board PCB designs, offering practical strategies and layout considerations for reliable system performance.

Blog
Mastering Component Templates in Altium Designer 25

Our new article by Dario Fresu explains how Component Templates in Altium Designer 25 Pro improve design consistency, reduce errors, and streamline collaboration. It highlights practical benefits like standardized naming, faster component creation, and scalability across projects. Includes examples of using templates with Altium 365™ to simplify complex component setup.

Blog
Wire Harness Design Guide for Development and Manufacturing

Designing a wire harness goes far beyond just connecting components—it’s about ensuring manufacturability, reliability, and compliance. This article walks you through the entire process, from initial design to production, helping you streamline development and avoid common pitfalls.

Blog
Preparing for Medical Device Cybersecurity Assessments

Explore the key considerations and best practices for conducting cybersecurity assessments in medical device development. This article outlines how to identify potential threats, evaluate risks, and ensure compliance with evolving industry standards.

Blog
Harness Complexity, Design with Simplicity

Harness Design in Altium Designer simplifies managing PCB interconnections, ensuring reliable performance and streamlined manufacturing. With logical connectivity tools, harness layout drawing, and manufacturing-ready documentation, it keeps your designs efficient and organized—all within a unified design environment. Perfect for automotive, aerospace, and industrial applications.

Blog
Getting Started with NVMe and the Raspberry Pi 5

Our new article guides you through enhancing your Raspberry Pi 5's performance by setting up NVMe SSD storage using an expansion HAT. It covers the benefits over traditional MicroSD cards, including improved speed and reliability, and provides step-by-step instructions for installation and configuration.

Blog
From Concept to Production: A Modern Approach to Wire Harness Engineering

Discover how modern wire harness engineering is evolving to meet the growing complexity of electrified systems. This whitepaper explores best practices, intelligent automation, and ECAD-MCAD collaboration to improve efficiency and reduce errors. Download now to stay ahead in an increasingly connected world.

Blog
Transforming RF Design with Ultra HDI

Ultra-HDI technology is transforming RF design by enabling finer line widths, improved signal integrity, and more compact, high-performance boards. Our brand-new article explores its advantages over traditional methods and the benefits of integrating flexible circuits.

Blog
Boost Your PCB Testing Efficiency with Testpoint Manager

Testpoints are essential for efficient PCBA testing and debugging. Our latest whitepaper dives into testpoint optimization, fault detection, and automated testing strategies, along with a full tutorial on using Testpoint Manager in Altium Designer. Discover how to streamline your testpoint assignments and improve measurement accuracy!

Tag
Embedded thumbnail for Time Based Matched Lengths
New in Altium Designer 20 Feb 26, 2020
Time Based Matched Lengths

High-speed digital circuits depend on signals and data arriving on time. If traces are improperly tuned, flight times vary and data errors can be abundant. Altium Designer 20 introduces the calculation of the propagation time on traces and provides synchronized flight time for high-speed digital signals.

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New in Altium Designer 20 Feb 25, 2020
Schematic Rendering

A smooth and fast schematic experience awaits thanks to DirectX in Altium Designer. This new implementation smoothes out zooming and panning, and also dramatically speeds up copy and paste functionality.

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New in Altium Designer 20 Feb 24, 2020
Properties Panel for Schematics

In Altium Designer version 20.0, the Interactive Properties panel for schematics includes several functional improvements as well as productivity enhancements. The entire layout has been refined to optimize efficiency, icons and graphical previews have been improved, and there is now a smart parameters filter both for schematic lists and components. Dialogs for schematic properties, so beloved by our seasoned users, have returned stronger and better than ever.

Embedded thumbnail for Return Path Design Rule
New in Altium Designer 20 Feb 24, 2020
Return Path Design Rule

High-speed signals create electromagnetic fields that can cause cross-talk or data errors unless proper return paths are provided. Proper return paths allow noise currents to return to ground through a very low impedance, eliminating any problems. The new Return Path design rule monitors return paths and checks for a continuous signal return path on the designated reference layer above or below the signals targeted by the rule.

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New in Altium Designer 20 Feb 24, 2020
Sliding

Editing traces to improve signal integrity can be time consuming, especially when you have to edit individual arcs and serpentine tunings. Altium Designer 20 incorporates a new gloss engine and advanced push and shove capabilities to help speed up this process. which improves your productivity.

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New in Altium Designer 20 Feb 24, 2020
Creepage Distance Rule

This new design rule flags a violation when the creepage distance across non-conductive surface and edge regions of the board, between the targeted signals, is equal to or less than the specified creepage distance.

Embedded thumbnail for How to Place Lines on the Keepout Layer
How-To's Feb 24, 2020
How to Place Lines on the Keepout Layer

This video demonstrates how to place lines on the keepout layer.

Embedded thumbnail for How to Check for Missing Project Files
How-To's Feb 24, 2020
How to Check for Missing Project Files

This video shows how to check for files that are missing from a project. Many times users link to files, such as libraries or outputs, outside of their project folder. This becomes a problem when it's time to zip up and send out project files, as linked files cannot be accessed by others.

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Working with Polygons Feb 24, 2020
How to Calculate the Area of a Polygon

This video demonstrates how to calculate the area of a polygon or region.

Embedded thumbnail for Overview of Altium Designer 20
New in Altium Designer 20 Feb 21, 2020
Overview of Altium Designer 20

With the release of Altium Designer 20 comes with it many new and exciting features. See why Altium Designer is the best choice for PCB designers.

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