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A Guide to Mode Conversion, Its Causes, and Solutions
On interconnects, such as board-to-board connections or cascaded transmission line arrangements, you have an important EMC compliance metric that is sometimes overlooked. This is mode conversion, which can be visualized in an S-parameter measurement for differential and common-mode signal transmission. In this article, we’ll look at a short overview of mode conversion in high-speed design with some examples from common differential standards.
Blog
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PCB Via Size and Pad Size Guidelines
There are some aspects of PCB design and layout that seem deceptively simple, and yet they have a complex answer that is related to many important aspects of manufacturing. One of these design aspects is the match between PCB via size and pad size. Obviously, these two points are related; all vias have a landing pad that supports the via and provides a place to route traces into a via pad. However, there are some important sizing guidelines to follow when the matching pad and via sizes, and this match is an important element of DFM and reliability.
On-Demand Webinar
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Preparing your files for Fabrication Release
When you’re done creating a new board, it’s time to send your design data to the manufacturer. Before releasing your designs, you’ll want to make sure that everything is ready and works as intended. In this informative video, we’ll review some of the must-have checks before sending your output data for fabrication.
Blog
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Differential Microstrip Impedance Calculator
Are you looking for a free tool that you can use to calculate the impedance of differential microstrips? We created a simple tool you can use to calculate differential microstrip impedance for a given geometry and dielectric constant. If you’ve been looking for an accurate differential microstrip impedance calculator, then the calculator below is certainly one of the best free tools you’ll find on the internet before you start using field solvers to determine differential pair impedance.
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Getting Through a PCB DFM Check
In this article, we’ll discuss the key design features to implement, and steps to take prior to fabrication that will help prevent some common DFM problems. I’ll also provide examples of where I commonly see these PCB DFM problems in signal integrity circuits.
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What is Spreading Inductance?
If you’re working with a high-speed digital component, there are some simple power integrity rules that should be followed. However, there is one quantity that is sometimes ignored when building a PDN impedance simulation: the spreading inductance of your plane pair. Here are some points designers should know about the spreading inductance of a plane pair.
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PCB Design Basics for New Designers
In this article, I’ll present some design basics that every new designer should follow to help ensure their design process is successful. Some of these points may challenge the conventional view of how circuit boards are constructed, but they are intended to help balance low noise signaling, manufacturability, and ease of solving a layout.
On-Demand Webinar
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Efficient PCB Routing Using Gloss and Retrace Tools
The primary goal of your traces is to carry signals throughout your board without losses. To do this properly, you must familiarize yourself with the requirements for signals on the printed circuit board and how to optimize the topology of the board in terms of signal integrity. We will analyze the most popular routing cases applicable for using the Gloss and Retrace tools in Altium Designer to optimize your signal integrity.
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Selecting Materials for High Voltage PCB Design and Layout
High voltage PCBs are subject to certain safety and reliability concerns that you won’t find in most other boards. If your fabrication house specializes in high voltage PCBs and keeps materials in stock, they can likely recommend a material set, as well as a standard stackup you might use for certain voltage ranges and frequencies. If you need to choose your own materials, follow the tips below to help you narrow down to the right material set.
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When to Use Tented Vias in Your PCB Layout
There are some guidelines I see many designers implement as a standard practice, often without thinking about it. Some of these practices are misunderstood or implemented without best practices. Others are implemented without thinking about the potential problems. One of these is the use of tented vias, which is sometimes implemented in a PCB layout by default. Is this always the right practice?
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Beyond Basic Part Selection: Using Supply Chain Data to Validate Choices
Learn how to enhance part selection by using real-time supply chain data. This article shows how integrating insights like availability and lifecycle status helps you make smarter, risk-aware design choices.
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Signal Mistakes Are Expensive
See how the Signal Analyzer by Keysight in Altium Designer lets you run signal integrity checks directly within your design environment. Read our article to learn how to effectively manage impedance, return paths, stackups, and more.
NEW
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Twice the Insight. One Seamless Simulation Bundle
Ensure power and signal integrity with the Keysight Bundle in Altium Designer. Catch issues early, reduce rework, and optimize your PCBs - all within one integrated environment featuring Signal & Power Analyzer.
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Preparing for Prototype: Final Component Validation
Final component validation is the last critical check before building a prototype, ensuring all parts are accurate, available, and viable. This article shows how Altium’s integrated tools—like SiliconExpert, Z2Data, Octopart, and BOM Portal—help teams avoid costly surprises and prepare with confidence.
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Getting Started with Harness Design in Altium Designer 25
Explore the essential steps and tools for Harness Design in Altium Designer 25, from initial setup to final documentation. The article highlights how the unified design environment streamlines the entire process, improving efficiency and project integration.
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The Future of PCB Design Starts Here
Altium Designer is constantly evolving, with powerful new features and updates on the way. Get an exclusive first look at what’s coming next—visit our Coming Soon page to stay up to date with the latest innovations.
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Simplify Harness-to-System Connections for Better PCB Design Outcomes
Struggling to keep harness and system designs in sync? In our brand-new article we explore how integrating PCB and harness design workflows can eliminate errors, improve collaboration, and accelerate your development process. Discover a smarter approach to connecting your harness to the system.
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The Crucial Balance: Cost, Quality, and Availability In Electronic Component Selection
Balancing cost, quality, and availability is key when selecting electronic components. This article explores how to make informed choices that meet design goals while managing supply chain and sourcing challenges.
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Wire Harness Failures: The Hidden Costs and Real-World Recalls That Could Have Been Prevented
Wire harness failures can lead to significant financial losses, production delays, and safety hazards. This article delves into real-world examples of such failures across industries and illustrates how modern CAD tools can help prevent these costly issues.
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Part Selection Fundamentals: Creating Resilient Component Requirements
Learn how to ensure electronic components meet the demands of harsh environments. This article explores key standards, testing protocols, and design considerations for building resilient systems that perform reliably under extreme conditions.
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Printed Electronics: The Future of Flexible and Cost-Effective Circuit Design
This article explores the rise of printed electronics as a lightweight, flexible, and cost-effective alternative to traditional PCB design. It highlights key benefits like reduced manufacturing costs, sustainability, and new design possibilities—especially in wearables, medical devices, and automotive applications.
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How to Choose the Best Requirements Management Tool for Electronics Development
Many electronics teams still rely on documents and spreadsheets for requirements management—leading to gaps, errors, and delays. Alexsander Tamari explores better tools to improve traceability, collaboration, and project outcomes.
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New Routing Possibilities with Ultra HDI
Explore how Ultra HDI technology is redefining PCB design. This article breaks down the benefits and manufacturing considerations of Ultra HDI, and how it enables next-level routing density and miniaturization in advanced electronics.
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3D-MID in Focus: Principles, Processes, and Practical Use
This article introduces 3D-MID (Mechatronic Integrated Devices), a technology that integrates circuitry into 3D plastic structures to reduce size, weight, and complexity. It explains the production process, use cases, and benefits of 3D-MID in sectors like automotive, medical, and consumer electronics.
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Eliminate EMI and Signal Integrity Issues in Multi-Board PCB Designs
Ensure signal integrity and minimize EMI in complex electronics. Our new article explains how to address electromagnetic interference and signal integrity challenges in multi-board PCB designs, offering practical strategies and layout considerations for reliable system performance.
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How to Overcome Power Distribution and Connector Misalignment Challenges in Multi-Board PCB Systems
Connector misalignment can compromise the reliability of power delivery in multi-board systems. This article explores the causes, effects, and prevention strategies for connector misalignment in power distribution, helping you design more robust multi-board PCB systems.
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