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HDI PCB design and HDI PCB manufacturing process
Blog
Design Basics for HDI and the HDI PCB Manufacturing Process

As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.

Embedded thumbnail for Remove Unused Via Pads
How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

All About PCB Test Points
Blog
Is It Printed or a Component? All About PCB Test Points

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

Embedded thumbnail for Tent Vias under BGA
How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
Blog
Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

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On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

Tight versus loose coupling
Blog
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

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How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

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How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

Engineering Design Review Guide
Blog
How to Solve Your Engineering Design Review Challenges

You’ve possibly gone through plenty of engineering design reviews, both on the front-end of a project and the back-end before manufacturing. Engineering design reviews are performed to accomplish multiple objectives, and with many engineering teams taking a systems-based approach to design and production, electronics design teams will need to review much more than just a PCB layout and BOM. Today’s challenges with sourcing, manufacturability, reliability, and mechanical constraints are all areas that must be confronted in real designs

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Via Stitching
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

Schematic Review Checklist
Blog
Schematic Review Checklist

One of the most common points of failure of a device occurs even before you start to layout your circuit board. Mistakes in your schematic design can easily make their way all the way into prototypes or production without a second thought once layout starts. In this article, I’m not going to extol the virtues of a good schematic design. Instead, this article is a simple no frills checklist.

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How To Work with High-Speed Projects
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

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How To Work with High-Speed Projects
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

Via current carrying capacity for PCBs
Blog
PCB Via Current-Carrying Capacity: How Hot is Too Hot?

One common question from designers is current-carrying capacity of conductors in a PCB. Trace and via current-carrying capacity are legitimate design points to focus on when designing a new board that will carry high current. The goal is to keep conductor temperatures below some appropriate limit, which then helps keep components on the board cool. Let’s dig into the current state of thermal demands on vias in PCBs and how they compare to internal and external PCB traces.

Simple Simulation in Altium Designer
On-Demand Webinar
SPICE Simulation Made Simple

SPICE simulation saves you critical time in the prototyping phase. Understanding your simulation interface makes it simple to analyze how your circuits work in different scenarios. Altium Designer provides an intuitive, dedicated interface to support your simulation verification, setup, and analysis directly in your schematic environment. You also benefit from growing support for popular model formats, as well as generic models, simplifying circuit definition and simulation.

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Blog
Simple Strategies to Reach 10% PCB Cost Reduction

Our new article outlines strategies to achieve a 10% reduction in PCB costs by optimizing design and material choices, such as adjusting stack-up materials and hole sizes, using lower-cost parts, and considering single-sided assembly. These techniques help reduce expenses without sacrificing quality.

Blog
Say Goodbye to EDA Software Vendor Lock

Check how Altium 365 helps eliminate EDA software vendor lock by enabling multi-CAD support in the cloud. This allows users to work with different CAD file formats within a single platform, enhancing collaboration and reducing the need for additional licenses. This approach offers greater flexibility and is set to transform the industry.

Blog
The Ultimate Introduction to High-Speed Signal Integrity for PCB Designers

High-speed signal integrity is essential in PCB design to ensure data accuracy and system reliability. Key issues like impedance mismatches, crosstalk, and signal reflections need to be addressed through strategies such as controlled impedance traces, differential pairs, and suitable material choices. Check out our first article of the series about this topic.

Blog
Multi-Board PCB Signal Integrity: A Complete Guide

Our new article on signal integrity in multi-board PCBs covers essential aspects like connector pinouts, cable designs, and interconnect strategies. These factors ensure reliable performance in high-speed applications across industries such as military, aerospace, and AI.

Blog
Pi.MX8 Project - Board Layout Part 4

We invite you to explore a new chapter in the PiMX8 Project, focusing on the final stages of PCB layout design for the Pi.MX8 compute module. This installment covers critical topics such as routing power planes and signal delay tuning, essential for ensuring proper functionality and performance.

Blog
How Thermoformed Flex PCB’s are Designed and Fabricated

Thermoformed flexible PCBs are specially designed and fabricated by heating and molding them into specific shapes, making them suitable for compact and complex applications like automotive dashboards and wearable devices. This process involves precise temperature control and careful handling to ensure durability and quality. Discover more from Tara Dunn's new article.

Blog
Boost Connection Integrity and Design Efficiency with Wire Bonding

Altium Designer's wire bonding feature enhances PCB design by supporting chip-up configurations for Chip on Board (CoB) designs. It offers easy validation of bond wiring in 3D views, ensuring accurate and efficient design processes. Check more about this feature on Altium's new feature page.

Blog
How High Frequency SMD Passives Work in a PCB Layout

High-frequency surface-mount device (SMD) passives like resistors and capacitors play a crucial role in PCB layouts, particularly in circuits operating above 1 GHz. Our article explores how these components function at high frequencies, their operational limits, and the importance of considering parasitic elements in design.

Blog
Essential DFM Tips for Aerospace Projects

Design for Manufacturing (DFM) is a crucial aspect of aerospace projects. This process ensures high-quality designs that meet the unique challenges of the aerospace industry, such as extreme conditions and stringent reliability standards. Learn more about essential DFM tips in our brand-new article.

Altium 365 New Website
Blog
Altium 365 now has its own website!

Discover everything you need to know about Altium 365 and experience our suite of applications for secure, seamless, and streamlined collaboration. Visit now to explore how to streamline your electronic product development.
 

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Embedded thumbnail for How to work with Pad Classes on PCB?
How-To's
How to work with Pad Classes on PCB?

Sometimes it is required to set different design rules for a different set of pads on the board. The easiest way is to use pad classes and in this video we'll show you how easy it is to create and apply them.

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How-To's
How to work with multivariate calculations?

Additional modes for obtaining temperature, parametric dependencies and probabilistic distribution by the Monte Carlo method are performed together with basic calculations and allow expanding the possibilities for analyzing design results.

Embedded thumbnail for How to calculate Transient Analysis?
How-To's
How to calculate Transient Analysis?

Transient Analysis simulates the reaction of a circuit over a period of time. It can be supplemented by Fourier Analysis and the use of Initial Conditions.

Embedded thumbnail for BOM Comments
How-To's
BOM Comments

Convenient interaction and coordination of the Active BOM with the help of comments is possible both from the web version of the project and from the Altium Designer between participants of the same and different roles.

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How-To's
Query Language: What is It For?

A PCB project contains many different objects. How to manage them? How to find the right ones quickly and efficiently? This video starts the series about query language. Learn the language commands and how to use them and expand your possibilities!

Embedded thumbnail for PCB design with BGA: Via-in-Pad
How-To's
PCB design with BGA: Via-in-Pad

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance.

Embedded thumbnail for Design RF PCB: Distributed-Element Circuits
How-To's
Design RF PCB: Distributed-Element Circuits

Distributed-element circuits are a topology of a particular shape and size. Filters, power dividers, directional couplers can be built from them. Being calculated in third-party CAD, the topology of such elements can be easily imported into Altium Designer, and we will show you how to do it!

Embedded thumbnail for How to work with components on a rigid-flex board in MCAD
How-To's
How to work with components on a rigid-flex board in MCAD

With MCAD Codesigner you can quickly add and move components from your MCAD tool and update the design automatically in Altium Designer. We’ll show you how to. Add a new component, move components, and change a component’s region in MCAD, and update it to your design in Altium Designer.

Embedded thumbnail for LSM: Impedance profile
How-To's
LSM: Impedance profile

Creating Impedance profiles for transmission lines and how to apply them to the board

Embedded thumbnail for Multichannel Schematic: Creating Channels
How-To's
Multichannel Schematic: Creating Channels

Altium Designer makes creating single and multichannel designs effective and quick. We’ll show you how to create and annotate output and input channels in your design.

Embedded thumbnail for How to efficiently use Blankets?
How-To's
How to efficiently use Blankets?

Blanket is a powerful tool for group assignment of properties in schematic documents. It makes it easier and faster to assign circuit classes, differential pairs, and design rules within schematic documents. This video provides instructions on how to use blanket to simplify work in your designs.

Embedded thumbnail for High Speed: XSignals for DDR3/DDR4
How-To's
High Speed: XSignals for DDR3/DDR4

In high speed design DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly. We’ll show you how using the xSignals wizard.

Embedded thumbnail for Design RF PCB: routing (any angle, arc)
How-To's
Design RF PCB: routing (any angle, arc)

It is worth taking a responsible approach to the shape and size of the RF signal conductors. In this video we will cover some practical aspects of working with routing such nets in Altium Designer.

Embedded thumbnail for Draftsman Document: Snapping
How-To's
Draftsman Document: Snapping

Snapping using the grids and snapping tools in Altium Designer’s Draftsman Editor gives you a lot of control over how you create and annotate primitives and components. We’ll show you how easy it is to use snapping in the Drafstman Editor.

Further Enhancements to Sheet Cross-referencing
What's New in 22.3
Schematic Capture Improvement

Adding cross-references to the project allows you to easily follow the connective flow of nets between the schematic sheets in a project. 

Further Enhancements to Sheet Cross-referencing
What's New in 22.3
原理图输入改进

您可以通过向项目添加交叉引用,轻松跟踪项目中原理图图纸之间的网络连接流。

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