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PCB fabrication notes
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Decoding PCB Fabrication Notes

Sending a board out for fabrication is an exciting and nerve-wracking moment. Why not just give your fabricator your design files and let them figure it out? There are a few reasons for this, but it means the responsibility comes back to you as the designer to produce manufacturing files and documentation for your PCB. It’s actually quite simple if you have the right design tools. We’ll look at how you can do this inside your PCB layout and how this will help you quickly generate data for your manufacturer.

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How to Work with Differential Pairs
Assigning Impedance Profiles for Differential Pairs

When you assign an impedance profile to a differential pair you open up several options for control over your routes. We'll show you how to do just that, as well as how to fix errors that may pop up and how to create classes for differential pairs based on assigned impedance profiles.

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How-To's
How to Highlight or Select Net Connections in the PCB

We’ll show you how to highlight net selections so you can easily track where connections are made. We’ll show you how to hide and show nets, and how to use the view configuration and PCB panels to view and highlight nets across your design, and how to assign net colors in both the PCB and the schematic.

HDI PCB design and HDI PCB manufacturing process
Blog
Design Basics for HDI and the HDI PCB Manufacturing Process

As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.

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How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

All About PCB Test Points
Blog
Is It Printed or a Component? All About PCB Test Points

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

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How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

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How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
Blog
Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

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On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

Tight versus loose coupling
Blog
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

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How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

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How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

Engineering Design Review Guide
Blog
How to Solve Your Engineering Design Review Challenges

You’ve possibly gone through plenty of engineering design reviews, both on the front-end of a project and the back-end before manufacturing. Engineering design reviews are performed to accomplish multiple objectives, and with many engineering teams taking a systems-based approach to design and production, electronics design teams will need to review much more than just a PCB layout and BOM. Today’s challenges with sourcing, manufacturability, reliability, and mechanical constraints are all areas that must be confronted in real designs

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Via Stitching
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

Schematic Review Checklist
Blog
Schematic Review Checklist

One of the most common points of failure of a device occurs even before you start to layout your circuit board. Mistakes in your schematic design can easily make their way all the way into prototypes or production without a second thought once layout starts. In this article, I’m not going to extol the virtues of a good schematic design. Instead, this article is a simple no frills checklist.

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How To Work with High-Speed Projects
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

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Blog
An Overview Of PCB Outer Layer Processing

Previously, I described the PCB fabrication operations relative to inner layer processing, lamination, drilling, and plating. The last step in the process is outer layer processing which is described below. Once the desired plated copper thickness of a PCB has been achieved, it’s necessary to etch away the copper between the features in order to define the outer layer pattern.

Blog
How Do Pads and Vias Impact Total Capacitor Parasitic Inductance?

There are many factors at play in determining the impact of inductance on high-frequency power distribution systems. Two topic areas, inductance of the decoupling capacitor and inductance of the power planes, were addressed in earlier articles. This article will focus on the inductance of the capacitor footprint and via inductance from the capacitor footprint back to the PCB power planes.

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Blog
Analyzing Crosstalk on FIFO and DDR4 Parallel Bus Interfaces

High-speed buses, whether single-ended or differential, can experience any number of signal integrity problems. A primary problem created by propagating signals is crosstalk, where a signal superimposes itself on a nearby trace. The industry-standard PCB design tools in Altium Designer® already include a post-layout simulator for examining crosstalk. Still, you can speed up crosstalk analysis in parallel buses when you use a powerful field solver.

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Blog
Amplifier Stability at High Frequencies and Stray Capacitance

Any time-dependent physical system with feedback and gain has conditions under which the system will reach stable behavior. Amplifier stability extends these concepts to amplifiers, where the system output can grow to an undesired saturated state due to unintended feedback. If you use the right design and simulation tools, you can easily account for potential instability in your circuit models before you create your layout.

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Blog
Working with Design Variants

The concept of design variants entails taking a single PCB design, and then on the assembly side, modifying specific components used in the design. Either by not installing, not installing, or choosing alternate components as replacements on a specific assembly to ultimately create different end products. In that way, you could support multiple product lines. This article describes the approach to working with variants. 

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Blog
Setting Up Concord Pro Revisions and Lifecycle

Before anything else, some advice. The revisions and lifecycle are an area that takes some planning. It used to be that Concord Pro was primarily for components, but now it has gone far beyond that. With the ability to store and manage many other items, including your various templates, projects, even PDF documents, not everything will have the same revision scheme. Concord Pro is so powerful that it can handle any revision scheme you’d want to set up.

Blog
How to Successfully Design a BGA

Whether the board will be placed in a high pressure vessel or underwater, your design will need to withstand pressure to avoid failure. On the enclosure side, your vessel should be rated up to a certain pressure and may require frequent cycling to prevent implosion. On the electronics side, component selection and layout (especially at high voltage) become critical to preventing failure and ensuring reliability.

Blog
Altium Designer 20.2 Update 1 is now available

The first update of Altium Designer 20.2 and Altium NEXUS Client 3.2 is now available. You can update through the Altium Designer update system ("Extensions and Updates") or download fresh builds from the Downloads section of the Altium website. Click on "Read More" to see a list of all changes in this update.

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Blog
How Copper Foil Roughness Affects Your Signals and Impedance

The history of engineering, both electrical and mechanical, is littered with approximations that have fallen by the wayside. These approximations worked well for a time and helped advance technology significantly over the decades. However, any model has limits on its applicability, and the typical RLCG transmission line model and frequency-independent impedance equations are no different. Copper foil roughness modeling and related transmission line impedance simulations are just one of many areas in which standard models cannot correctly treat signal behavior.

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Blog
What is Burn-in Testing for Electronics?

Once you’re planning for production of any new board, you’ll likely be planning a battery of tests for your new product. These tests often focus on functionality and, for high speed/high frequency boards, signal/power integrity. However, you may intend for your product to operate for an extreme period of time, and you’ll need some data to reliably place a lower limit on your product’s lifetime. In addition to in-circuit tests, functional tests, and possibly mechanical tests, the components and boards themselves can benefit from burn-in testing.

Blog
PCB Design for Testability to Ensure High Yield and Quality

If you remember your days in school, then you probably remember the feeling of happiness and celebration when you pass a big exam. You’ll feel the same sense of adulation when your board spin passes a barrage of pre and post assembly tests, but a complex design might not reach that stage unless you implement the right design for testability methods. There are some simple steps that can help your manufacturer identify and quickly implement important bare-board and in-circuit testing (ICT), especially on critical circuit blocks.

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Blog
Top Tips from Experienced Flex Designers

This article describes the best hints and tips for designers of rigid-flex circuits. These tips include choosing the most appropriate material, suggestions for coordinating the PCB with the manufacturer, and a set of rules to be followed while PCB design. 

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Blog
How Do Capacitor Mounting Structures And Footprints Impact Total Inductance?

There are a number of factors at play when it comes to the impact of inductance on high-frequency power distribution systems. This article will focus on the inductance of the capacitor footprint along with the inductance of vias from the capacitor footprint to the PCB power planes. Included are the various types and sizes of footprints for ceramic capacitors as well as a footprint for a tantalum capacitor; how changing the footprint impacts inductance and test results obtained for different capacitors.

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Blog
How to Perform Differential Pair Tuning in Altium Designer 20

In order to properly suppress common-mode noise, differential pairs must be routed in parallel, with perfect symmetry, and with matched lengths. In real PCBs, meeting these three objectives isn’t always possible. Instead of eyeing out your different pair lengths, the interactive routing tools in Altium Designer make differential pair length matching easy. You can encode permissible length mismatches as design rules as part of controlled impedance routing, or you can manually perform differential pair tuning using a variety of meandering styles. Here’s how this works in Altium Designer.

Blog
Driving Haptic Vibration and Feedback in Wearables

Augmented reality, virtual surgery, limb replacements, medical devices, and other new technologies need to incorporate haptic vibration motors and feedback to give the wearer a full sense of how they are interacting with their environment. Unless these cutting-edge applications include haptic vibration and feedback, users are forced to rely on their other four senses to understand the real or virtual environment.

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Blog
Back Drilling Example in Altium Designer: One of the Easiest Ways to Improve Signal Integrity

Over the last 20 years, electronic devices have become increasingly sophisticated. Less than two decades ago, just having a mobile phone to make calls was rare; today, our phones power our lives. To meet the growing demand for smartphone technology, technology has become faster, more functional, and intuitive. Improvements to the component base have streamlined processes while reducing manufacturing costs.

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Embedded thumbnail for BOM Comments
How-To's
BOM Comments

Convenient interaction and coordination of the Active BOM with the help of comments is possible both from the web version of the project and from the Altium Designer between participants of the same and different roles.

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How-To's
Query Language: What is It For?

A PCB project contains many different objects. How to manage them? How to find the right ones quickly and efficiently? This video starts the series about query language. Learn the language commands and how to use them and expand your possibilities!

Embedded thumbnail for PCB design with BGA: Via-in-Pad
How-To's
PCB design with BGA: Via-in-Pad

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance.

Embedded thumbnail for Design RF PCB: Distributed-Element Circuits
How-To's
Design RF PCB: Distributed-Element Circuits

Distributed-element circuits are a topology of a particular shape and size. Filters, power dividers, directional couplers can be built from them. Being calculated in third-party CAD, the topology of such elements can be easily imported into Altium Designer, and we will show you how to do it!

Embedded thumbnail for How to work with components on a rigid-flex board in MCAD
How-To's
How to work with components on a rigid-flex board in MCAD

With MCAD Codesigner you can quickly add and move components from your MCAD tool and update the design automatically in Altium Designer. We’ll show you how to. Add a new component, move components, and change a component’s region in MCAD, and update it to your design in Altium Designer.

Embedded thumbnail for LSM: Impedance profile
How-To's
LSM: Impedance profile

Creating Impedance profiles for transmission lines and how to apply them to the board

Embedded thumbnail for Multichannel Schematic: Creating Channels
How-To's
Multichannel Schematic: Creating Channels

Altium Designer makes creating single and multichannel designs effective and quick. We’ll show you how to create and annotate output and input channels in your design.

Embedded thumbnail for How to efficiently use Blankets?
How-To's
How to efficiently use Blankets?

Blanket is a powerful tool for group assignment of properties in schematic documents. It makes it easier and faster to assign circuit classes, differential pairs, and design rules within schematic documents. This video provides instructions on how to use blanket to simplify work in your designs.

Embedded thumbnail for High Speed: XSignals for DDR3/DDR4
How-To's
High Speed: XSignals for DDR3/DDR4

In high speed design DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly. We’ll show you how using the xSignals wizard.

Embedded thumbnail for Design RF PCB: routing (any angle, arc)
How-To's
Design RF PCB: routing (any angle, arc)

It is worth taking a responsible approach to the shape and size of the RF signal conductors. In this video we will cover some practical aspects of working with routing such nets in Altium Designer.

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How-To's
Draftsman Document: Snapping

Snapping using the grids and snapping tools in Altium Designer’s Draftsman Editor gives you a lot of control over how you create and annotate primitives and components. We’ll show you how easy it is to use snapping in the Drafstman Editor.

Further Enhancements to Sheet Cross-referencing
What's New in 22.3
Schematic Capture Improvement

Adding cross-references to the project allows you to easily follow the connective flow of nets between the schematic sheets in a project. 

Further Enhancements to Sheet Cross-referencing
What's New in 22.3
原理图输入改进

您可以通过向项目添加交叉引用,轻松跟踪项目中原理图图纸之间的网络连接流。

Embedded thumbnail for High Speed: XSignals
How-To's
High Speed: XSignals

You can create, configure, and utilize xSignals in Altium Designer to make your design process more efficient and effective. We’ll show you how to do it manually, using the more comprehensive Create xSignals command, and using the xSignal wizard.

Embedded thumbnail for DFM and fab cost/time constraints: What is annular ring and how to configure it
How-To's
DFM and fab cost/time constraints: What is annular ring and how to configure it

The minimum dimension from the wall of the aperture to the edge of the pad is called an annular ring, and we can configure it with Altium Designer. We’ll show you how to get started and manage the annular ring in your design rules.

Embedded thumbnail for Altium 365 Getting Started: Gerber Compare
How-To's
Altium 365 Getting Started: Gerber Compare

The task of comparing different versions of manufacturing files usually arises when the electrical engineer needs to check and confirm the manufacturer's edits or clarify details of changes before starting production. In Altium 365 you can perform an automatic comparison of Gerber files.

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