News & Updates
As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.
Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.
The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.
Quite often, a standard assembly drawing is not enough to ensure the quality of a PCB assembly, especially when designing high-density boards. It would also be helpful to include additional detailing for simpler devices. The use of a Draftsman document brings an elegant, yet powerful solution to make these tasks easier.
An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.
With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.
In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.
You’ve possibly gone through plenty of engineering design reviews, both on the front-end of a project and the back-end before manufacturing. Engineering design reviews are performed to accomplish multiple objectives, and with many engineering teams taking a systems-based approach to design and production, electronics design teams will need to review much more than just a PCB layout and BOM. Today’s challenges with sourcing, manufacturability, reliability, and mechanical constraints are all areas that must be confronted in real designs
One of the most common points of failure of a device occurs even before you start to layout your circuit board. Mistakes in your schematic design can easily make their way all the way into prototypes or production without a second thought once layout starts. In this article, I’m not going to extol the virtues of a good schematic design. Instead, this article is a simple no frills checklist.
To pour or not to pour, to stitch or not to stitch… Over many years, some common “rules of thumb” have become very popular and, ultimately, taken a bit out of context. Rules of thumb are not always wrong, but taking PCB design recommendations out of context helps justify bad design practices, and it can even affect the producibility of your board. Like many aspects of a physical PCB layout, via stitching and copper pour can be like acid: quite useful if implemented properly, but also dangerous if used indiscriminately.
Power MOSFETs enable a huge range of electronic systems, specifically in situations where BJTs are not useful or efficient. MOSFETs can be used in high current systems in parallel arrangements, but what about their use in series? Both arrangements of MOSFETs have their pitfalls that designers should consider. Let’s look at MOSFETs in series as they are quite useful in certain systems, but be careful to design your circuits and your PCB for reliability.
I can’t think of a single product I’ve built that doesn’t require capacitors. We often talk a lot about effective series inductance (ESL) in capacitors and its effects on power integrity. What about effective series resistance (ESR)? Is there a technique you can use to determine the appropriate level of resistance, and can you use ESR to your advantage?
If your goal is to hit a target impedance, and you’re worried about how nearby pour might affect impedance, you can get closer than the limits set by the 3W rule. But what are the effects on losses? If the reason for this question isn’t obvious, or if you’re not up-to-date on the finer points of transmission line design, then keep reading to see how nearby ground pour can affect losses in impedance-controlled interconnects.
If you need to capture sound waves for your electrical device to process, you'll need a microphone. However, microphones these days have become very advanced, and there are so many options to choose from. They range from the relatively simple and popular condenser type microphones to state-of-the-art sound conversion solutions incorporating internal amplifiers and other electronic processing functionality. In this article, we'll take a look at some of the options available.
There are many times where you need an amplifier with high gain, low noise, high slew rate, and broad bandwidth simultaneously. However, not all of these design goals are possible with all off-the-shelf components. Here are some points to consider when working with a composite amplifier design and how to evaluate your design with the right set of circuit simulation tools.
Simple switching regulator circuits that operate in compact spaces, like on a small PCB, can usually be deployed in noisy environments without superimposing significant noise on the output power level. As long as you lay out the board properly, you’ll probably only need a simple filter circuit to remove EMI on the inputs and outputs. As the regulator becomes larger, both physically and electrically, noise problems can become much more apparent, namely radiated EMI and conducted EMI in the PCB layout.
A PCB design review is a practice to review the design of a board for possible errors and issues at various stages of product development. It can range from a formal checklist with official sign-offs to a more free-form inspection of schematic drawings and PCB layouts. For this article, we will not delve into what to check during a design review process but rather look at how a review process itself usually unfolds and how to optimize it to get the most out of your time.
As we established in Part 1, the PCB design review and collaboration practices have room for improvement in many organizations. To address this, we developed Altium 365. Let's examine how running a PCB project through Altium 365 compares to other methods.
If you look on the internet, you'll find some interesting grounding recommendations, and sometimes terminology gets thrown around and applied to a PCB without the proper context or understanding of real electrical behavior. DC recommendations get applied to AC, low current gets applied to high current, and vice versa... the list goes on. One of the more interesting grounding techniques you'll see as a recommendation, including on some popular engineering blogs within the industry, is the use of PCB star grounding.
Every PCB has silkscreen on the surface layer, and you’ll see a range of alphanumeric codes, numbers, markings, and logos on PCB silkscreen. What exactly does it all mean, and what specifically should you include in your silkscreen layer? All designs are different, but there are some common pieces of information that will appear in any silkscreen in order to aid assembly, testing, debug, and traceability
Designing high-speed channels on complex boards requires simulations, measurements on test boards, or both to ensure the design operates as you intend. Gibbs ringing is one of these effects that can occur when calculating a channel’s response using band-limited network parameters. Just as is the case in measurements, Gibbs ringing can occur in channel simulations due to the fact that network parameters are typically band-limited.
In electronics, there is the possibility that your PCB can get pretty hot due to power dissipation in certain components. There are many things to consider when dealing with heat in your board, and it starts with determining power dissipation in your design during schematic capture. If you happen to be operating within safe limits in a high power device, you might need an SMD heat sink on certain components. Ultimately, this could save your components, your product, and even the operator.
One thing is certain: power supply designs can get much more complex than simply routing DC power lines to your components. RF power supply designs require special care to ensure they will function without transferring excessive noise between portions of the system, something that is made more difficult due to the high power levels involved. In addition to careful layout, circuitry needs to be designed such that the system provides highly efficient power conversion and delivery to each subsection of the system.
Overvoltage, overcurrent, and heat are the three most likely events that can destroy our expensive silicon-based components or reduce our product’s life expectancy. The effects are often quite instant, but our product might survive several months of chronic overstress before giving up the ghost in some cases. Without adequate protection, our circuit can be vulnerable to damage, so what should we do? Or do we need to do anything?
Today’s PCB designers and layout engineers often need to put on their simulation hat to learn more about the products they build. When you need to perform simulations, you need models for components, and simulation models often need to be shared with other team members at the project level or component level. What’s the best way for Altium Designer users to share this data? Read this article to learn more about sharing your models with other design participants.