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Embedded thumbnail for Assigning Impedance Profiles for Differential Pairs
How to Work with Differential Pairs
Assigning Impedance Profiles for Differential Pairs

When you assign an impedance profile to a differential pair you open up several options for control over your routes. We'll show you how to do just that, as well as how to fix errors that may pop up and how to create classes for differential pairs based on assigned impedance profiles.

Embedded thumbnail for How to Highlight or Select Net Connections in the PCB
How-To's
How to Highlight or Select Net Connections in the PCB

We’ll show you how to highlight net selections so you can easily track where connections are made. We’ll show you how to hide and show nets, and how to use the view configuration and PCB panels to view and highlight nets across your design, and how to assign net colors in both the PCB and the schematic.

HDI PCB design and HDI PCB manufacturing process
Blog
Design Basics for HDI and the HDI PCB Manufacturing Process

As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.

Embedded thumbnail for Remove Unused Via Pads
How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

All About PCB Test Points
Blog
Is It Printed or a Component? All About PCB Test Points

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

Embedded thumbnail for Tent Vias under BGA
How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
Blog
Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

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On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

Tight versus loose coupling
Blog
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

Embedded thumbnail for Automatic Fanout With BGA
How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

Embedded thumbnail for Specifying NSMD and SMD for BGA
How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

Engineering Design Review Guide
Blog
How to Solve Your Engineering Design Review Challenges

You’ve possibly gone through plenty of engineering design reviews, both on the front-end of a project and the back-end before manufacturing. Engineering design reviews are performed to accomplish multiple objectives, and with many engineering teams taking a systems-based approach to design and production, electronics design teams will need to review much more than just a PCB layout and BOM. Today’s challenges with sourcing, manufacturability, reliability, and mechanical constraints are all areas that must be confronted in real designs

Embedded thumbnail for Via Shielding and Stitching
Via Stitching
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

Schematic Review Checklist
Blog
Schematic Review Checklist

One of the most common points of failure of a device occurs even before you start to layout your circuit board. Mistakes in your schematic design can easily make their way all the way into prototypes or production without a second thought once layout starts. In this article, I’m not going to extol the virtues of a good schematic design. Instead, this article is a simple no frills checklist.

Embedded thumbnail for xSignals for DDR3 and DDR4
How To Work with High-Speed Projects
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

Embedded thumbnail for High-Speed Tuning
How To Work with High-Speed Projects
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

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Top 5 Questions Regarding Stack Up
Blog
SAP (Semi-Additive PCB Process) – Top 5 Questions Regarding Stack Up

As the PCB design community embraces the benefits of this new printed circuit board fabrication technique, there are of course many questions to be answered.  Today’s blog will address some of the most commonly asked questions related to circuit layer stack up as people are introduced to this new technology.

Design Reuse Blocks Update
Blog
Altium Designer 22.9 Update

We are happy to announce that the Altium Designer 22.9 update is now available. Altium Designer 22.9 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!

Dual Rail Voltage Supply
Blog
Dual Rail Voltage Supply

The highest performing operational amplifiers often need a split supply with positive and negative voltages connected to the op amps supply rails. In this project, we’re going to be building a positive/negative dual rail power supply for a differential oscilloscope probe I’m designing. I’m making the power supply a separate project, as a dual rail supply is quite useful to have, and I’m sure I’ll find multiple uses for it in the future.

Library Importer Interface
Blog
Library Importer Improvements (former Library Migrator)

Importing file-based libraries from your local computer or network drive to your Altium 365 workspace can be done using the Library Importer. Altium’s Library Migrator was renamed Library Importer—the feature’s name was changed to conform more closely to the tool’s purpose. Not only is its name new, but our team has also made several user experience improvements. We have updated the documentation to reflect this change.

Blog
How to Select Copper Foil for High-Frequency PCB Design

The PCB materials industry has spent significant amounts of time developing materials that provide lowest possible signal loss for products with RF applications. For high speed and high frequency designs, losses will limit signal propagation distance and distort signals, and it will create an impedance deviation that can be seen in TDR measurements. In this article, we'll look at the balance between copper foil losses and other types of losses in a PCB, as well as some strategies that are commonly used to overcome roughness.

Blog
Altium Designer 22.8 Update

We are happy to announce that the Altium Designer 22.8 update is now available. Altium Designer 22.8 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!

What is Hybrid Beamforming?
Blog
What is Hybrid Beamforming?

In this article, we’ll look at beamforming implementation in an advanced method combining analog and digital techniques, known as hybrid beamforming. This method blends both digital and analog techniques to create multiple beams and thus reach multiple users with varying intensities. In the case of an RF imaging system or a radar system, hybrid beamforming in a MIMO technique also allows tracking of multiple targets with adjustable resolution.

Is your via impedance calculator accurate?
Blog
Why Most Via Impedance Calculators Are Inaccurate

The problem with every via impedance calculator that I have seen is simple: they are incomplete or totally wrong. The “incomplete” part refers to a lack of context; these calculators can roughly reproduce a well-known estimate from a legend like Howard Johnson in his Digital Design textbooks. However, these calculators never provide insight into what they are actually calculating, or where the calculated via impedance is accurate. Keep reading to see why these calculators get it so wrong, as well as the context surrounding via impedance.

Blog
Buck Converter Simulation in Altium Designer

When designing high power circuits (usually very high voltage and/or current), you’ll need to create a regulator from scratch and place it in your PCB layout. It's also the case that you may want to model a real component using discretes in a simulation in order to qualify the system's expected operating regime. As part of buck converter design, you can easily run a buck converter simulation directly in Altium Designer’s schematic editor. Here’s how you can access these features in the newest version of Altium Designer. 

PCIe 6.0 Overview
Blog
Overview of the PCIe 6.0 Standard

Just as you get used to PCIe 5.0, they decide to release another standard! The newest iteration of PCIe is Gen6, or PCIe 6.0. PCIe 6.0 brings a doubling of channel bandwidth through introduction of PAM-4 as the signaling method in high-speed differential channels. This signaling method is a first for PCIe, and it’s an important enabler of the doubled data rate we see in the current standard. In this article, I’ll run over the important points in the standard and what PCB designers can expect when designing these channels.

SPI vs. I2C For Memory Access
Blog
SPI vs. I2C: How to Choose the Best Protocol for Your Memory Chips

One of the common implementations of SPI and I2C in a PCB layout is as a protocol for reading and writing to an external Flash memory. Flash chips are a very common component in embedded systems and can offer high capacities of non-volatile memory up to Gb values. When choosing a memory chip, you'll want to match the application requirements and functionality with the bus speed you need for read and write operations in your memory chip. There is also the matter of the type of Flash memory you'll need to access (NOR vs. NAND).

Blog
Is There an SPI Trace Impedance Requirement?

There is no SPI trace impedance requirement? The reality is that SPI lines only start to need impedance control when the length of the interconnect becomes very long. And because there is no specific impedance requirement in the bus, you have some freedom in channel design and termination. So what exactly qualifies as “very long” and when is some termination method needed? We’ll break it down in this article.

The Skin Effect and EM Fields
Blog
The Skin Effect, Current Density, and the Electromagnetic Field

During this year's AltiumLive CONNECT event, I recall receiving an interesting question about the skin effect and the distribution of current due to the presence of ground in coplanar transmission lines. In this article, we'll look at the electric field around a transmission line carrying a signal, and how this might be impacted by the skin effect.

Packaging for your PCBAs
Blog
What You Need for PCB Packaging and Shipping

When you get your PCBA back from an assembler, you’ll notice the packaging materials used to pack and ship the PCBA. Those materials are specific to electronics, and if you build products on behalf of clients, it’s important to know the packaging materials used for packing and shipping electronics. In this article I’ll show the main set of materials and equipment used to package electronics assemblies.

PCB Output files
Blog
How to Make PCB Gerber Files in Altium Designer Step-by-Step

Once you've got your PCB layout finished and you're ready to start preparing for manufacturing, one of the critical steps is to create PCB Gerber files. When you're ready to create your Gerber files, you need the right set of CAM processor tools that can take data from your PCB layout. In this article, we'll guide you through this process of how to make PCB Gerber files and show some example tasks you might need to perform to generate them.

Teardrops on Differential Pairs?
Blog
Should You Place Teardrops on Differential Pairs?

One of the major factors impacting reliability of a PCBA is the use of teardrops on traces in the PCB. Like many aspects of reliability, the considerations also span into the signal integrity domain, particularly as more high-reliability products require greater data handling capabilities and run at higher speeds. In this article, I’ll break down the issues present in teardrop usage on differential pairs and how these may affect impedance.

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Embedded thumbnail for How to Use the MCAD CoDesigner?
How-To's
How to Use the MCAD CoDesigner?

This video shows how the ECAD and MCAD engineers now can communicate directly while staying within their own design environment. The MCAD engineer is able to push design information directly from their design software straight into Altium Designer. Any changes can be reviewed, accepted, or denied by the receiving party. This process of pushing and reviewing design changes is bi-directional, meaning that both the MCAD or ECAD engineer can push and review changes to the other. 

Embedded thumbnail for Creating Additional Snap Points Using a 3D Model
How to use Snapping
Creating Additional Snap Points Using a 3D Model

Demonstration of using snap points with 3D models and how they can assist in the placement of said models.

Embedded thumbnail for Polygon Connect Styles
Working with Polygons
Polygon Connect Styles

Define how vias and pads connect to polygons with a design rule. Customize the thermal relief width, number, and rotation as well as the air gap width.

Embedded thumbnail for How to work with Component Classes?
How to Work with Classes
How to work with Component Classes?

Modern printed circuit boards can contain a large number of components, which makes them difficult to work with. In this video we will show what component classes can be on a PCB, how to create custom component classes and how they can be useful for us. 

Embedded thumbnail for Create and Snap to a Circular Grid (Polar Grid)
How to use Snapping
Create and Snap to a Circular Grid (Polar Grid)

Instructional on how to create polar grids, how to snap to them, and why you might want to use them.

Embedded thumbnail for How to Connect Polygons to Nets
Working with Polygons
How to Connect Polygons to Nets

This video covers how to easily connect a polygon to a net using just two clicks. With the Properties panel open and a polygon selected, click the "Assign net" button in the Properties panel.

Embedded thumbnail for Altium 365 Getting Started: Gerber Compare
Getting Started with A365
Altium 365 Getting Started: Gerber Compare

The task of comparing different versions of manufacturing files usually arises when the electrical engineer needs to check and confirm the manufacturer's edits or clarify details of changes before starting production. In Altium 365 you can perform an automatic comparison of Gerber files. 

Embedded thumbnail for Altium 365 Getting Started: Schematic Compare
Getting Started with A365
Altium 365 Getting Started: Schematic Compare

The schematic sheets in a project are subject to change over time, and sometimes it may be necessary to compare several different versions and detect differences between them. In Altium Designer you can easily perform an automatic comparison of any revisions of schematic documents. 

Embedded thumbnail for Altium 365 Getting Started: Migrate to Altium 365 from other VCS
Getting Started with A365
Altium 365 Getting Started: Migrate to Altium 365 from other VCS

The development of electronic devices always involves the release of many different types of files. And these files are not static - they change as the project progresses. Traditionally, one way to manage data is to use a version control system such as Git or SVN. Unlike other VCSs, Altium 365 is the system designed specifically for managing project data.

Embedded thumbnail for How to get a BOM for a Multi-board Design
How-To's
How to get a BOM for a Multi-board Design

When designing a multi-board project, an up-to-date and accurate BOM for the entire device is a necessity. Watch this video to learn how to properly create a BOM for your multi-board project.

Embedded thumbnail for Remove Unused Pad Shapes
Working with Polygons
Remove Unused Pad Shapes

Unused pad shapes create holes in your copper geometries. You can quickly examine all pads in the design to remove unused pad shapes and restore previously removed pads. 

Embedded thumbnail for Effective use of "Objects for snapping" when creating a Footprint
How to use Snapping
Effective use of "Objects for snapping" when creating a Footprint

Learn how to effectively use snaps that allow you to create a component footprint quickly and conveniently

Embedded thumbnail for How to Control Routing in Altium Designer
How-To's
How to Control Routing in Altium Designer

The routing functionality in Altium Designer is constantly evolving. Check out this video to learn the basics of routing in Altium Designer. 

Embedded thumbnail for Polygon Creation
Working with Polygons
Polygon Creation

Learn how to create polygon pours to ensure proper copper distribution on your board.

Embedded thumbnail for Creating Guide Lines and Snap Points
How to use Snapping
Creating Guide Lines and Snap Points

Explanation of guides and snap points and how to create and use them.

Embedded thumbnail for Polygon Types and Parameters
Working with Polygons
Polygon Types and Parameters

Each board requires different copper geometries. Polygon types make sure you can create the perfect copper geometry for every need.

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