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Embedded thumbnail for Assigning Impedance Profiles for Differential Pairs
How to Work with Differential Pairs
Assigning Impedance Profiles for Differential Pairs

When you assign an impedance profile to a differential pair you open up several options for control over your routes. We'll show you how to do just that, as well as how to fix errors that may pop up and how to create classes for differential pairs based on assigned impedance profiles.

Embedded thumbnail for How to Highlight or Select Net Connections in the PCB
How-To's
How to Highlight or Select Net Connections in the PCB

We’ll show you how to highlight net selections so you can easily track where connections are made. We’ll show you how to hide and show nets, and how to use the view configuration and PCB panels to view and highlight nets across your design, and how to assign net colors in both the PCB and the schematic.

HDI PCB design and HDI PCB manufacturing process
Blog
Design Basics for HDI and the HDI PCB Manufacturing Process

As the world of technology has evolved, so has the need to pack more capabilities into smaller packages. PCBs designed using high-density interconnect techniques tend to be smaller as more components are packed in a smaller space. An HDI PCB uses blind, buried, and micro vias, vias in pads, and very thin traces to pack more components into a smaller area. We’ll show you the design basics for HDI and how Altium Designer® can help you create a powerful HDI PCB.

Embedded thumbnail for Remove Unused Via Pads
How to Design a BGA
Remove Unused Via Pads

The Remove Unused Pad Shapes tool in Altium Designer gives you control over the via pads in your design. We’ll show you how to use it to increase the usable area of power and ground polygons, increase the density of conductors between hole rows, and fixing incorrect connections.

All About PCB Test Points
Blog
Is It Printed or a Component? All About PCB Test Points

Test points in your electronic assembly will give you a location to access components and take important measurements to verify functionality. If you’ve never used a test point or you’re not sure if you need test points, keep reading to see what options you have for test point usage in your PCB layout.

Embedded thumbnail for Tent Vias under BGA
How to Design a BGA
Tent Vias under BGA

When via are located close to component pads some soldering issues can arise, but this can be fixed with Tented vias. We’ll show you how to manually tent vias and how to tent vias through the Design Rules.

How to Design to a Differential Impedance Specification
Blog
How to Design to a Differential Impedance Specification

The concept and implementation of differential impedance are both sometimes misunderstood. In addition, the design of a channel to reach a specific differential impedance is often done in a haphazard way. The very concept of differential impedance is something of a mathematical construct that doesn’t fully capture the behavior of each signal in a differential trace. Keep reading to see a bit more depth on how to design to a differential impedance spec and exactly what it means for your design.

Embedded thumbnail for Via-in-Pad for BGA
How to Design a BGA
Via-in-Pad for BGA

We’ll teach you how to use Via-in-pad to reduce inductance, improve signal integrity, and improve power distribution system performance in BGA designs.

Embedded thumbnail for Using HDI Stackups during BGA Design
How to Design a BGA
Using HDI Stackups during BGA Design

Micro Vias and Buried Vias play an important role in high density interconnection layer stackups (HDI Stackups). We’ll show you how to add via and create rules to allow you to take full advantage of the HDI Stackup.

Product Lifecycle Management in Electronics Manufacturing
Blog
Product Lifecycle Management in Electronics Manufacturing

An effective product lifecycle management (PLM) solution will integrate the tools and processes employed to design, develop and manufacture a new device. This solution goes beyond engineering activities to include the project management, process control, and financial management of the end-to-end business processes. PLM solutions create this collaborative environment where product development can flourish, bringing additional benefits in efficiencies and transparent communications, breaking silos, and speeding up the development process.

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On-Demand Webinar
Length Matching in High Speed Buses

With ever increasing speeds in high-speed data systems comes a couple of PCB layout challenges. High-speed busses like DDR, VME, PCIe just to mention a few can all reach data transfer speeds that require strict timing with very tight tolerances, thereby leaving very little slack in the PCB layout. Watch this on-demand webinar to learn why it's imperative to match track lengths in high-speed data systems and differential signals. You’ll see how to properly define PCB length matching and time delay constraints, and how to effectively route high-speed signals in Altium Designer®.

Tight versus loose coupling
Blog
Should You Use Tight vs. Loose Differential Pair Spacing and Coupling?

In this article, we want to get closer to a realistic description of tight coupling vs. loose coupling in terms of differential pair spacing, as well as how the differential pair spacing affects things like impedance, differential-mode noise, reception of common-mode noise, and termination. As we’ll see, the focus on tight coupling has its merits, but it’s often cited as necessary for the wrong reasons.

Embedded thumbnail for Automatic Fanout With BGA
How to Design a BGA
Automatic Fanout With BGA

When routing a BGA it can be necessary to use automatic fanout to make the routing process easier and faster. We’ll show you how to run the automatic fanout for routing a BGA and how the rules can affect the outcome of the route.

Embedded thumbnail for Specifying NSMD and SMD for BGA
How to Design a BGA
Specifying NSMD and SMD for BGA

BGA layouts use two types of pads: SMD, Solder Mask Pads, or NSMD, Non-Solder Mask Pads. Here we’ll walk you through the differences and how to specify and edit them for your layout.

Engineering Design Review Guide
Blog
How to Solve Your Engineering Design Review Challenges

You’ve possibly gone through plenty of engineering design reviews, both on the front-end of a project and the back-end before manufacturing. Engineering design reviews are performed to accomplish multiple objectives, and with many engineering teams taking a systems-based approach to design and production, electronics design teams will need to review much more than just a PCB layout and BOM. Today’s challenges with sourcing, manufacturability, reliability, and mechanical constraints are all areas that must be confronted in real designs

Embedded thumbnail for Via Shielding and Stitching
Via Stitching
Via Shielding and Stitching

Altium Designer gives you full control over your via shielding and stitching. We’ll show you how to use our shielding and stitching tools, how to alter their parameters, and how to remove any unwanted via shielding and stitching.

Schematic Review Checklist
Blog
Schematic Review Checklist

One of the most common points of failure of a device occurs even before you start to layout your circuit board. Mistakes in your schematic design can easily make their way all the way into prototypes or production without a second thought once layout starts. In this article, I’m not going to extol the virtues of a good schematic design. Instead, this article is a simple no frills checklist.

Embedded thumbnail for xSignals for DDR3 and DDR4
How To Work with High-Speed Projects
xSignals for DDR3 and DDR4

In a high-speed design, DDR3 and DDR4 memory chips can utilize xSignal classes to match track lengths from the controller to the memory chip easily and quickly using the xSignals wizard.

Embedded thumbnail for High-Speed Tuning
How To Work with High-Speed Projects
High-Speed Tuning

If you use high-speed interfaces like USB 3.0, PCIE, or DDR3/DDR4, you need to use match length tuning to ensure that they work properly. We’ll show you why and how, as well as demonstrating the different tools for length tuning.

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Blog
Simple Strategies to Reach 10% PCB Cost Reduction

Our new article outlines strategies to achieve a 10% reduction in PCB costs by optimizing design and material choices, such as adjusting stack-up materials and hole sizes, using lower-cost parts, and considering single-sided assembly. These techniques help reduce expenses without sacrificing quality.

Blog
Say Goodbye to EDA Software Vendor Lock

Check how Altium 365 helps eliminate EDA software vendor lock by enabling multi-CAD support in the cloud. This allows users to work with different CAD file formats within a single platform, enhancing collaboration and reducing the need for additional licenses. This approach offers greater flexibility and is set to transform the industry.

Blog
The Ultimate Introduction to High-Speed Signal Integrity for PCB Designers

High-speed signal integrity is essential in PCB design to ensure data accuracy and system reliability. Key issues like impedance mismatches, crosstalk, and signal reflections need to be addressed through strategies such as controlled impedance traces, differential pairs, and suitable material choices. Check out our first article of the series about this topic.

Blog
Multi-Board PCB Signal Integrity: A Complete Guide

Our new article on signal integrity in multi-board PCBs covers essential aspects like connector pinouts, cable designs, and interconnect strategies. These factors ensure reliable performance in high-speed applications across industries such as military, aerospace, and AI.

Blog
Pi.MX8 Project - Board Layout Part 4

We invite you to explore a new chapter in the PiMX8 Project, focusing on the final stages of PCB layout design for the Pi.MX8 compute module. This installment covers critical topics such as routing power planes and signal delay tuning, essential for ensuring proper functionality and performance.

Blog
How Thermoformed Flex PCB’s are Designed and Fabricated

Thermoformed flexible PCBs are specially designed and fabricated by heating and molding them into specific shapes, making them suitable for compact and complex applications like automotive dashboards and wearable devices. This process involves precise temperature control and careful handling to ensure durability and quality. Discover more from Tara Dunn's new article.

Blog
Boost Connection Integrity and Design Efficiency with Wire Bonding

Altium Designer's wire bonding feature enhances PCB design by supporting chip-up configurations for Chip on Board (CoB) designs. It offers easy validation of bond wiring in 3D views, ensuring accurate and efficient design processes. Check more about this feature on Altium's new feature page.

Blog
How High Frequency SMD Passives Work in a PCB Layout

High-frequency surface-mount device (SMD) passives like resistors and capacitors play a crucial role in PCB layouts, particularly in circuits operating above 1 GHz. Our article explores how these components function at high frequencies, their operational limits, and the importance of considering parasitic elements in design.

Blog
Essential DFM Tips for Aerospace Projects

Design for Manufacturing (DFM) is a crucial aspect of aerospace projects. This process ensures high-quality designs that meet the unique challenges of the aerospace industry, such as extreme conditions and stringent reliability standards. Learn more about essential DFM tips in our brand-new article.

Altium 365 New Website
Blog
Altium 365 now has its own website!

Discover everything you need to know about Altium 365 and experience our suite of applications for secure, seamless, and streamlined collaboration. Visit now to explore how to streamline your electronic product development.
 

Blog
Altium Designer: Leading the Charge in PCB Design Innovation

In the dynamic field of electronics design, Altium Designer stands out as a pioneer, continuously advancing the boundaries of PCB (Printed Circuit Board) design. Discover the latest innovations in 3D-MID design, high-speed design, and interactive routing in this new article by David Marrakchi.

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Embedded thumbnail for Component Placement Control for DFM
DFM and Fabrication Cost/Time Constraints
Component Placement Control for DFM

Component placement is a crucial part of making sure your design is manufacturable, so you need to be able to control placement. We’ll show you how, through rules and courtyard layers to maintain accessibility and manufacturability in your entire design through component placement control.

Embedded thumbnail for MCAD CoDesigner Quick Start: PTC Creo
Working with MCAD CoDesigner extension
MCAD CoDesigner Quick Start: PTC Creo

MCAD CoDesigner is built to address the challenges of electronic product design by enabling seamless collaboration between your electrical and mechanical engineers. This video will show you how to start collaborate between Altium Designer and PTC Creo

Embedded thumbnail for Variants in Multi-Channel Designs
How to work with Variants
Variants in Multi-Channel Designs

Multi-channel designs can utilize variations in the channels to reduce design time and sheet count. We’ll show you how to take advantage of this by configuring several types of components.

Embedded thumbnail for Stackup Considerations
DFM and Fabrication Cost/Time Constraints
Stackup Considerations

There is a lot to consider about the Layer Stackup when it comes to designing a manufacturable board. We’ll walk you through enabling symmetry, finding correct balance of your layers, materials, creating and loading templates, and adding a layer stack table for better communication between you and your manufacturer.

Embedded thumbnail for What Are Design Variants For?
How to work with Variants
What Are Design Variants For?

Variants in Altium Designer allow you to create several variations of the same design all from one source project. Variants can be managed in the project and through Altium Designer you can control variants in the PCB, Schematic, Draftsman, and Outjob files to make your designs easily editable without redundancy.

Embedded thumbnail for MCAD CoDesigner Quick Start: Solidworks
Working with MCAD CoDesigner extension
MCAD CoDesigner Quick Start: Solidworks

MCAD CoDesigner is built to address the challenges of electronic product design by enabling seamless collaboration between your electrical and mechanical engineers. This video will show you how to start collaborate between Altium Designer and SolidWorks. 

Embedded thumbnail for Panelization
DFM and Fabrication Cost/Time Constraints
Panelization

When you go to manufacture your design you can get a board manufactured by itself or with multiple in a panel. We’ll show you the how and the why to create panelization with the Embedded Board Array/Panelize tool, as well as how to create break away points for your individual boards.

Embedded thumbnail for Display Variants in Draftsman Document
How to work with Variants
Display Variants in Draftsman Document

You can use the draftsman document to display your board variants. We’ll show you how to create a draftsman document and add variants to it properly displayed and editable through the properties panel.

Embedded thumbnail for How to print PCB?
How-To's
How to print PCB?

Do you want to know how to use the updated document output feature? This video tells about the changes to the document output and shows how to quickly form a PDF or print a PCB in Altium Designer 21.

Embedded thumbnail for Avoid Solder Wicking
DFM and Fabrication Cost/Time Constraints
Avoid Solder Wicking

If solder gets sucked into via holes in can cause an unreliable connection in your otherwise manufacturable design. We’ll show you a few easy ways to avoid this solder wicking using rules.

Display of Alternate Component Parameters
What's New in 22.4
Display of Alternate Component Parameters

Many schematic solutions are created as multivariant. With the new release, the schematic of multivariant project have become even more detailed and informative.

Display of Alternate Component Parameters
What's New in 22.4
备用元件参数显示

很多原理图解决方案均以多变量形式创建。随着新版本的发布,将提供更加详细和翔实的多变量项目原理图。

Components from Altium 365
What's New in 22.4
Components from Altium 365

Working with multiboards has become easier and more convenient. Now you have more component sources at your disposal.

Components from Altium 365
What's New in 22.4
Altium 365 元件

进行多板处理将变得更加轻松、方便。现在可供您使用的元件源将更多。

New Design Reuse Functionality
What's New in 22.4
New Design Reuse Functionality

A reuse bloks help reduce development time and avoid errors. The new Design Reuse Panel and new functionality expands the possibilities for reuse blocks and snippets.

New Design Reuse Functionality
What's New in 22.4
新的设计复用功能

复用块将有助于缩短开发时间并避免错误。新Design Reuse Panel和新功能,扩大了复用块和片段的使用范围。

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