News & Updates

We love answering questions from our readers and YouTube viewers, and one of the recent questions we received relates to EMI from switching elements in a switching regulator is "Should a cutout be placed below the inductor in a switching regulator circuit?". Despite the variations in inductors and their magnetic behavior, there are some general principles that can be used to judge the effects of placing ground near inductors in switching regulator circuits. We’ll look at some of these principles in this article

We are happy to announce that the Altium Designer 22.6 update is now available. Altium Designer 22.6 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!

Find 9 mistakes in a PCB design and get added into the lucky draw to win a prize from Altium!

Now you can assess your library’s health at a glance with the Library Health dashboard, view and share your bill of materials (BOM) and view and download PDF documents, all in your web browser. We improved the existing diff and compare features, and released a new version of MCAD CoDesigner. Register for the webinar to learn more!

This Semi-Additive Process is an additional tool in the PCB fabricators' toolbox that enables them to provide feature sizes for trace width and spacing that are 25 microns, (1 mil) and below depending on the fabricators' imaging equipment. This provides much more flexibility to breakout out tight BGA areas and the ability to shrink overall circuit size and/ or reduce the number of circuit layers in the design. As the PCB design community embraces the benefits of this new printed circuit board fabrication technique, there are of course many questions to be answered.

It’s no secret that component shortages have become more frequent this year. In fact, countries around the world are losing billions in revenue due to supply issues. Having the right components on hand is more crucial than ever as availability, obsolescence, counterfeit products and environmental non-compliance risks continue to grow. Fortunately, many shortages can be avoided by introducing proactive supply chain practices.

It's no secret that software developers often use completed code fragments from other projects for quick and predictable results. The same can be done for PCB Design, there is no need to spend time rewiring schematics or laying out components on boards you’ve done before. Join us this webinar where we’ll go over how you can use your existing designs to create reusable design blocks, speeding up the design cycle for your future projects.

Do length-tuning structures create an impedance discontinuity? The answer is an unequivocal “yes”, but it might not matter in your design depending on several factors. Applying a length-tuning structure is equivalent to changing the distance between the traces while meandering. Therefore, you will have a change in the odd-mode impedance of a single trace. The question then becomes: does this deviation in trace impedance in a length tuning structure matter?

The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators. To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer counts, multiple levels of stacked micro vias and increased lamination cycles.

Take a look at the inside of some integrated circuit packages, and you’ll find a number of wires bonded to the semiconductor die and the pads at the edge of the component's package. As a signal traverses makes its way along an interconnect and into a destination circuit, signals need to travel across these bond wires and pads before they are interpreted as a logic state. As you look around the edge of an IC, these bond wires can have different lengths, and they incur different levels of delay and contribute to total jitter.

This article by Dario Fresu delves into effective techniques for designing PCBs to reduce electromagnetic interference (EMI). It covers key topics such as stackup selection, routing strategies, and grounding best practices, offering actionable insights for improved performance.

Altium and Renesas are featured in a new CBS-produced documentary exploring how digitalization and cloud platforms are revolutionizing electronics production for Economy 4.0, driving efficiency and accelerating innovation.

Discover how to streamline your wiring projects with advanced harness and PCB integration tools in Altium Designer. This article explores techniques to prevent wiring errors, enhance collaboration, and ensure accurate design documentation for complex projects.

Altium wishes you all the best this holiday season! May this time be filled with joy, laughter, and cherished moments with your family and friends. We also extend our warmest wishes for a Happy New Year 2025!

Explore our latest article to learn the fundamentals of wire harness design, its key components, and how it ensures organized, efficient, and reliable electrical systems across automotive, aerospace, and medical sectors.

Learn how to accurately determine ferrite bead circuit model parameters for effective noise suppression in high-speed PCB designs. This article explores key concepts, measurement techniques, and practical tips for modeling ferrite beads in your projects.

This article by Dario Fresu, part of the Mastering EMI Control in PCB Design series, explores strategies for selecting PCB stackups to optimize EMC performance. It offers actionable tips for balancing cost, manufacturability, and signal integrity in your designs.

Discover AI-driven vision capabilities with the Kria KV260 Vision AI Starter Kit, presented by Ari Mahpour. Ideal for prototyping vision solutions, this kit offers an accessible entry point into advanced AI applications.

Explore how Model-Based Systems Engineering (MBSE) integrates with digital twins to enhance design accuracy, collaboration, and lifecycle management in modern engineering projects. This approach bridges the gap between physical systems and digital models, enabling real-time simulation and optimization.

The Wire Bonding in Altium Designer article highlights how Altium Designer 25’s wire bonding feature streamlines complex designs for advanced assemblies like 3D stacked dies and RF modules. This tool enhances efficiency and precision, catering to modern electronic design needs.

Altium Designer 25 introduces groundbreaking features for seamless collaboration and precision in PCB design, from PCB CoDesign to advanced simulation and MCAD tools. Discover how AD25 is transforming electronic product development.

Explore the future of wire bonding, from new applications to cost-saving trends, in this article by Samer Aldhaher. Stay updated on key innovations in this essential connection technology.

Discover how Altium 365’s Jira integration can streamline collaboration and keep projects running smoothly with real-time design updates and task tracking. Perfect for teams seeking efficiency!

Discover how integrating BOM management and CAD systems can streamline your PCB design process in this insightful article. Learn how combining these tools enables smoother collaboration, reduces errors, and improves design efficiency, helping you optimize your workflows from concept to manufacturing.

Resistors are fundamental components in electronic circuits, essential for controlling current and voltage. This article explores their basic principles, types, and key applications, helping you understand their crucial role in electronics.

Efficient PCB design is crucial for avoiding costly delays in product development. This article offers practical tips and best practices for PCB designers to streamline their workflows, minimize errors, and ensure timely project completion.