News & Updates
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SAP (Semi-Additive PCB Process) – Top 5 Questions Regarding Stack Up
This Semi-Additive Process is an additional tool in the PCB fabricators' toolbox that enables them to provide feature sizes for trace width and spacing that are 25 microns, (1 mil) and below depending on the fabricators' imaging equipment. This provides much more flexibility to breakout out tight BGA areas and the ability to shrink overall circuit size and/ or reduce the number of circuit layers in the design. As the PCB design community embraces the benefits of this new printed circuit board fabrication technique, there are of course many questions to be answered.
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Improving Supply Chain Success with BOM Management
It’s no secret that component shortages have become more frequent this year. In fact, countries around the world are losing billions in revenue due to supply issues. Having the right components on hand is more crucial than ever as availability, obsolescence, counterfeit products and environmental non-compliance risks continue to grow. Fortunately, many shortages can be avoided by introducing proactive supply chain practices.
On-Demand Webinar
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Rapidly Creating New Designs And Reusing Existing Ones
It's no secret that software developers often use completed code fragments from other projects for quick and predictable results. The same can be done for PCB Design, there is no need to spend time rewiring schematics or laying out components on boards you’ve done before. Join us this webinar where we’ll go over how you can use your existing designs to create reusable design blocks, speeding up the design cycle for your future projects.
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What is the Impedance of Length-Tuning Structures?
Do length-tuning structures create an impedance discontinuity? The answer is an unequivocal “yes”, but it might not matter in your design depending on several factors. Applying a length-tuning structure is equivalent to changing the distance between the traces while meandering. Therefore, you will have a change in the odd-mode impedance of a single trace. The question then becomes: does this deviation in trace impedance in a length tuning structure matter?
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A-SAP™ – What do you need to know?
The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators. To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer counts, multiple levels of stacked micro vias and increased lamination cycles.
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Pin-Package Delay and Via Delay in High Speed Length Tuning
Take a look at the inside of some integrated circuit packages, and you’ll find a number of wires bonded to the semiconductor die and the pads at the edge of the component's package. As a signal traverses makes its way along an interconnect and into a destination circuit, signals need to travel across these bond wires and pads before they are interpreted as a logic state. As you look around the edge of an IC, these bond wires can have different lengths, and they incur different levels of delay and contribute to total jitter.
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6-Layer PCB Design Guidelines
Once you’ve run out of room on your 4-layer PCB, it’s time to graduate to a 6-layer board. The additional layer can give you room for more signals, an additional plane pair, or a mix of conductors. How you use these extra layers is less important than how you arrange them in the PCB stackup, as well as how you route on a 6-layer PCB. If you’ve never used a 6-layer board before, or you’ve had EMI troubles with this stackup that are difficult to solve, keep reading to see some 6-layer PCB design guidelines and best practices.
On-Demand Webinar
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Help Ensure The Best Designs With Component Management
There are many aspects to designing a PCB. One of the larger aspects has to do with managing your components. We all need components for our designs, but are those components in our library and designs up-to-date or even purchasable? These questions need to be answered before we can safely use them. If not, we could just be wasting our time designing with invalid components. Altium Designer® has several tools to help you manage the components in your libraries and designs.
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Altium Designer 22.5 Update
We are happy to announce that the Altium Designer 22.5 update is now available. Altium Designer 22.5 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!
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How Reliable is Your Hybrid PCB Stackup?
PCB stackups often incorporate slightly dissimilar materials that could pose a reliability problem. Hybrid PCBs are one case where the PCB stackup will include different materials, typically a standard FR4 laminate and a PTFE laminate for RF PCBs. Designers who want to take the lead on material selection when designing their hybrid stackups should consider these factors that affect reliability. As with any PCB stackup, make sure you get your fabricator involved in the manufacturing process early to ensure reliability problems do not arise during production.
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Monte Carlo Simulation vs. Sensitivity Analysis: What’s the Difference?
In a previous article about circuit simulation and reliability, I looked at how Monte Carlo analysis is commonly used to evaluate circuits that are subject to random variations in component values. Sensitivity analysis is a bit different and it tells you how the operating characteristics of your circuit change in a specific direction. Compared to a Monte Carlo simulation, sensitivity analysis gives you a convenient way to predict exactly how the operating characteristics will change if you were to deliberately increase or decrease the value of a component.
NEW
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Twice the Insight. One Seamless Simulation Bundle
Ensure power and signal integrity with the Keysight Bundle in Altium Designer. Catch issues early, reduce rework, and optimize your PCBs - all within one integrated environment featuring Signal & Power Analyzer.
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Preparing for Prototype: Final Component Validation
Final component validation is the last critical check before building a prototype, ensuring all parts are accurate, available, and viable. This article shows how Altium’s integrated tools—like SiliconExpert, Z2Data, Octopart, and BOM Portal—help teams avoid costly surprises and prepare with confidence.
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Getting Started with Harness Design in Altium Designer 25
Explore the essential steps and tools for Harness Design in Altium Designer 25, from initial setup to final documentation. The article highlights how the unified design environment streamlines the entire process, improving efficiency and project integration.
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The Future of PCB Design Starts Here
Altium Designer is constantly evolving, with powerful new features and updates on the way. Get an exclusive first look at what’s coming next—visit our Coming Soon page to stay up to date with the latest innovations.
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Simplify Harness-to-System Connections for Better PCB Design Outcomes
Struggling to keep harness and system designs in sync? In our brand-new article we explore how integrating PCB and harness design workflows can eliminate errors, improve collaboration, and accelerate your development process. Discover a smarter approach to connecting your harness to the system.
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The Crucial Balance: Cost, Quality, and Availability In Electronic Component Selection
Balancing cost, quality, and availability is key when selecting electronic components. This article explores how to make informed choices that meet design goals while managing supply chain and sourcing challenges.
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Wire Harness Failures: The Hidden Costs and Real-World Recalls That Could Have Been Prevented
Wire harness failures can lead to significant financial losses, production delays, and safety hazards. This article delves into real-world examples of such failures across industries and illustrates how modern CAD tools can help prevent these costly issues.
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Part Selection Fundamentals: Creating Resilient Component Requirements
Learn how to ensure electronic components meet the demands of harsh environments. This article explores key standards, testing protocols, and design considerations for building resilient systems that perform reliably under extreme conditions.
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Printed Electronics: The Future of Flexible and Cost-Effective Circuit Design
This article explores the rise of printed electronics as a lightweight, flexible, and cost-effective alternative to traditional PCB design. It highlights key benefits like reduced manufacturing costs, sustainability, and new design possibilities—especially in wearables, medical devices, and automotive applications.
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How to Choose the Best Requirements Management Tool for Electronics Development
Many electronics teams still rely on documents and spreadsheets for requirements management—leading to gaps, errors, and delays. Alexsander Tamari explores better tools to improve traceability, collaboration, and project outcomes.
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New Routing Possibilities with Ultra HDI
Explore how Ultra HDI technology is redefining PCB design. This article breaks down the benefits and manufacturing considerations of Ultra HDI, and how it enables next-level routing density and miniaturization in advanced electronics.
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3D-MID in Focus: Principles, Processes, and Practical Use
This article introduces 3D-MID (Mechatronic Integrated Devices), a technology that integrates circuitry into 3D plastic structures to reduce size, weight, and complexity. It explains the production process, use cases, and benefits of 3D-MID in sectors like automotive, medical, and consumer electronics.
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Eliminate EMI and Signal Integrity Issues in Multi-Board PCB Designs
Ensure signal integrity and minimize EMI in complex electronics. Our new article explains how to address electromagnetic interference and signal integrity challenges in multi-board PCB designs, offering practical strategies and layout considerations for reliable system performance.
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How to Overcome Power Distribution and Connector Misalignment Challenges in Multi-Board PCB Systems
Connector misalignment can compromise the reliability of power delivery in multi-board systems. This article explores the causes, effects, and prevention strategies for connector misalignment in power distribution, helping you design more robust multi-board PCB systems.
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Mastering Component Templates in Altium Designer 25
Our new article by Dario Fresu explains how Component Templates in Altium Designer 25 Pro improve design consistency, reduce errors, and streamline collaboration. It highlights practical benefits like standardized naming, faster component creation, and scalability across projects. Includes examples of using templates with Altium 365™ to simplify complex component setup.
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Wire Harness Design Guide for Development and Manufacturing
Designing a wire harness goes far beyond just connecting components—it’s about ensuring manufacturability, reliability, and compliance. This article walks you through the entire process, from initial design to production, helping you streamline development and avoid common pitfalls.
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