News & Updates
Blog
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Ebook: PDN Simulation and Analysis Guide
Most designers don’t realize they need to worry about power integrity until they have a power integrity problem. Other designers might build boards that can’t handle the demands of modern digital and high frequency components, and they may not realize the problems that lurk in their power delivery network (PDN). Although the basic concepts involved in designing for power integrity are well-known, myths about power integrity abound, and designers need tools to help them evaluate and qualify power integrity in a PDN.
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Ferrite Beads and Transfer Impedance in a PDN Simulation
The use of ferrites in a PDN is one design recommendation that is fraught with unclear guidance and over-generalized recommendations. If you see an application note or a reference design that recommends placing a ferrite in a PDN, should you follow this in your specific design, or should you ignore this and focus on adding capacitance?
On-Demand Webinar
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Preparing your files for Fabrication Release
When you’re done creating a new board, it’s time to send your design data to the manufacturer. Before releasing your designs, you’ll want to make sure that everything is ready and works as intended. In this informative webinar, we’ll review some of the must-have checks before sending your output data for fabrication.
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Overview of PCB Design Output Files
Before your board can be put into production and prepared for assembly, you have to generate a set of files that assist your manufacturer. These are your PCB design output files, also known as manufacturing files, fabrication data, assembly files, and a host of other names. Before you send your design file off to a manufacturer in an email, make sure to get a list of their required fabrication and assembly files first. If you’re a new designer, take some time to read over the basic PCB manufacturing file extensions below.
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Transformer Theory Made Simple
Transformers can provide very effective signal isolation and are used to manipulate AC voltage and current levels. They can achieve all this with a greater than 95% power efficiency, which is why we commonly see them used in bench power supplies, audio gear, computers, kitchen appliances, and wall-warts. However, transformer theory can be unintuitive and in this article we answer on questions about them
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Using Altium 365 Over Your Vanilla Version Control System
There are all sorts of version control systems (VCS) out there that people have been using with their PCB design software. As discussed in Why Use a Version Control System, we looked at different options ranging for local hard drive storage to sophisticated online revisioning systems. In this article we will be reviewing the differences between a standard VCS and Altium 365.
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Recover Conductor Losses By Clearing Your PCB Ground Layer
Controlled impedance routing at high frequencies is difficult enough, and it's important to make sure that you stay within your loss budget on long routes or in lossy media. When you have to route a long trace or a long differential pair to a connector or another component, what can you do if you're reaching the end of your loss budget? In this article, we’ll take a look at the skip reference routing method and explain how it can help recover some loss budget in a lossy interconnect.
On-Demand Webinar
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Mastering The Layer Stack Manager
What most people don’t seem to grasp is that every aspect of the PCB is critical. It all plays a significant part in the operation of the final product. The layer stack is no different. We need to keep in mind materials and the intricacies therein, including thickness, weave, dielectric constants, and more. A proper layer stack is needed for each and every design, so it's important to know how to navigate the layer stack manager and all of its features.
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Announcing SOC 2 Type 1 Certification for Altium 365
We are pleased to announce that Altium 365 is officially SOC 2 Type 1 certified. System and Organization Controls (SOC) 2 is a widely recognized attestation of security compliance defined by the AICPA and is considered the standard for ensuring data security and operational maturity. A SOC 2 certification provides valuable information for companies to assess the quality of the security provided by a service such as Altium 365.
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Improving Supply Chain Success with BOM Management
It’s no secret that component shortages have become more frequent this year. Companies will continue to grapple with supply chain challenges into 2022 and beyond. The impact of manufacturing delays can be substantial if a part is not available. Delays occur and sales plans get put on hold. It can also be very expensive and risky to replace parts from multiple sources. Fortunately, many shortages can be avoided by introducing proactive supply chain practices.
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Designing Micro-vias with Sintered Paste for Rigid-Flex Printed Circuit Boards
Designing microvias with sintered paste in rigid-flex PCBs offers enhanced electrical conductivity and mechanical strength, crucial for high-density applications. Our new article explores the benefits of sintered paste and provides essential design tips to optimize microvia performance and reliability.
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Simple Strategies to Reach 10% PCB Cost Reduction
Our new article outlines strategies to achieve a 10% reduction in PCB costs by optimizing design and material choices, such as adjusting stack-up materials and hole sizes, using lower-cost parts, and considering single-sided assembly. These techniques help reduce expenses without sacrificing quality.
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Say Goodbye to EDA Software Vendor Lock
Check how Altium 365 helps eliminate EDA software vendor lock by enabling multi-CAD support in the cloud. This allows users to work with different CAD file formats within a single platform, enhancing collaboration and reducing the need for additional licenses. This approach offers greater flexibility and is set to transform the industry.
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The Ultimate Introduction to High-Speed Signal Integrity for PCB Designers
High-speed signal integrity is essential in PCB design to ensure data accuracy and system reliability. Key issues like impedance mismatches, crosstalk, and signal reflections need to be addressed through strategies such as controlled impedance traces, differential pairs, and suitable material choices. Check out our first article of the series about this topic.
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Multi-Board PCB Signal Integrity: A Complete Guide
Our new article on signal integrity in multi-board PCBs covers essential aspects like connector pinouts, cable designs, and interconnect strategies. These factors ensure reliable performance in high-speed applications across industries such as military, aerospace, and AI.
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Multi-CAD Support Will Be a Game Changer for Electronics Design Teams
Discover how multi-CAD support is transforming electronics design with Altium 365 by enabling seamless integration of diverse CAD file formats. This innovation addresses vendor lock-in issues, boosting collaboration, version control, and project management across different CAD tools.
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Pi.MX8 Project - Board Layout Part 4
We invite you to explore a new chapter in the PiMX8 Project, focusing on the final stages of PCB layout design for the Pi.MX8 compute module. This installment covers critical topics such as routing power planes and signal delay tuning, essential for ensuring proper functionality and performance.
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How Thermoformed Flex PCB’s are Designed and Fabricated
Thermoformed flexible PCBs are specially designed and fabricated by heating and molding them into specific shapes, making them suitable for compact and complex applications like automotive dashboards and wearable devices. This process involves precise temperature control and careful handling to ensure durability and quality. Discover more from Tara Dunn's new article.
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Boost Connection Integrity and Design Efficiency with Wire Bonding
Altium Designer's wire bonding feature enhances PCB design by supporting chip-up configurations for Chip on Board (CoB) designs. It offers easy validation of bond wiring in 3D views, ensuring accurate and efficient design processes. Check more about this feature on Altium's new feature page.
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How High Frequency SMD Passives Work in a PCB Layout
High-frequency surface-mount device (SMD) passives like resistors and capacitors play a crucial role in PCB layouts, particularly in circuits operating above 1 GHz. Our article explores how these components function at high frequencies, their operational limits, and the importance of considering parasitic elements in design.
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Essential DFM Tips for Aerospace Projects
Design for Manufacturing (DFM) is a crucial aspect of aerospace projects. This process ensures high-quality designs that meet the unique challenges of the aerospace industry, such as extreme conditions and stringent reliability standards. Learn more about essential DFM tips in our brand-new article.
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Mechanics Meet Electronics Seamlessly in Multi-Board PCB Design
Curious about the intersection of mechanical and electrical design? Both are crucial in the PCB design process, especially for multi-board systems. Read our latest article to learn how ECAD and MCAD can address significant challenges during PCB preparation.
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Altium 365 now has its own website!
Discover everything you need to know about Altium 365 and experience our suite of applications for secure, seamless, and streamlined collaboration. Visit now to explore how to streamline your electronic product development.
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Efficient DC-DC Converter Design: Automated Measurements with Altium Designer 24 MixedSim
Automated measurements are no longer tough. With our Mixed Simulation mode, everything is easier. Learn more about this feature based on DC-DC buck converter design in this brand new article.
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Altium Designer: Leading the Charge in PCB Design Innovation
In the dynamic field of electronics design, Altium Designer stands out as a pioneer, continuously advancing the boundaries of PCB (Printed Circuit Board) design. Discover the latest innovations in 3D-MID design, high-speed design, and interactive routing in this new article by David Marrakchi.
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What Is Solder Mask Expansion and Which Value Should You Use?
Check out our new article explaining how to ensure sufficient pad area for soldering, manage misregistration tolerance, and maintain proper solder dams between components. It also highlights the role of collaboration with fabrication houses and the use of CAD tools in defining land patterns for advanced electronics designs.
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