News & Updates
Blog
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Overview of the PCIe 6.0 Standard
Just as you get used to PCIe 5.0, they decide to release another standard! The newest iteration of PCIe is Gen6, or PCIe 6.0. PCIe 6.0 brings a doubling of channel bandwidth through introduction of PAM-4 as the signaling method in high-speed differential channels. This signaling method is a first for PCIe, and it’s an important enabler of the doubled data rate we see in the current standard. In this article, I’ll run over the important points in the standard and what PCB designers can expect when designing these channels.
Blog
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SPI vs. I2C: How to Choose the Best Protocol for Your Memory Chips
One of the common implementations of SPI and I2C in a PCB layout is as a protocol for reading and writing to an external Flash memory. Flash chips are a very common component in embedded systems and can offer high capacities of non-volatile memory up to Gb values. When choosing a memory chip, you'll want to match the application requirements and functionality with the bus speed you need for read and write operations in your memory chip. There is also the matter of the type of Flash memory you'll need to access (NOR vs. NAND).
On-Demand Webinar
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Tips & Tricks: Board Shape Creation
Being able to design a board in your ECAD environment doesn’t mean that it is manufacturable in real life. You have to make sure your CAD representation won’t have any problems in the real world by taking some precautions. For example, there are certain areas that need to be free of components and have specified clearances like your board edge. This webinar will help you get acquainted with the creation and modification of your board shape so that you can ensure manufacturability.
Blog
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Is There an SPI Trace Impedance Requirement?
There is no SPI trace impedance requirement? The reality is that SPI lines only start to need impedance control when the length of the interconnect becomes very long. And because there is no specific impedance requirement in the bus, you have some freedom in channel design and termination. So what exactly qualifies as “very long” and when is some termination method needed? We’ll break it down in this article.
Blog
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The Skin Effect, Current Density, and the Electromagnetic Field
During this year's AltiumLive CONNECT event, I recall receiving an interesting question about the skin effect and the distribution of current due to the presence of ground in coplanar transmission lines. In this article, we'll look at the electric field around a transmission line carrying a signal, and how this might be impacted by the skin effect.
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What You Need for PCB Packaging and Shipping
When you get your PCBA back from an assembler, you’ll notice the packaging materials used to pack and ship the PCBA. Those materials are specific to electronics, and if you build products on behalf of clients, it’s important to know the packaging materials used for packing and shipping electronics. In this article I’ll show the main set of materials and equipment used to package electronics assemblies.
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How to Make PCB Gerber Files in Altium Designer Step-by-Step
Once you've got your PCB layout finished and you're ready to start preparing for manufacturing, one of the critical steps is to create PCB Gerber files. When you're ready to create your Gerber files, you need the right set of CAM processor tools that can take data from your PCB layout. In this article, we'll guide you through this process of how to make PCB Gerber files and show some example tasks you might need to perform to generate them.
On-Demand Webinar
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Help Ensure The Best Designs With Component Management
There are many aspects to designing a PCB. One of the larger aspects has to do with managing your components. We all need components for our designs, but are those components in our library and designs up-to-date or even purchasable? These questions need to be answered before we can safely use them. Altium Designer® has several tools to help you manage the components in your libraries and designs.
Blog
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Should You Place Teardrops on Differential Pairs?
One of the major factors impacting reliability of a PCBA is the use of teardrops on traces in the PCB. Like many aspects of reliability, the considerations also span into the signal integrity domain, particularly as more high-reliability products require greater data handling capabilities and run at higher speeds. In this article, I’ll break down the issues present in teardrop usage on differential pairs and how these may affect impedance.
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The High-Reliability PCBA Design and Test Challenge
High-reliability electronics must go through multiple rounds of testing and qualification to ensure they can withstand their intended operating environment. Designing to performance standards, whether the baseline IPC standards or more stringent industry standards, is the first step in ensuring a reliable circuit board. In this e-book, readers will gain a thorough look into PCB testing and analysis, starting from basic tests performed on bare boards and completed assemblies.
NEW
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Preparing for Prototype: Final Component Validation
Final component validation is the last critical check before building a prototype, ensuring all parts are accurate, available, and viable. This article shows how Altium’s integrated tools—like SiliconExpert, Z2Data, Octopart, and BOM Portal—help teams avoid costly surprises and prepare with confidence.
NEW
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Getting Started with Harness Design in Altium Designer 25
Explore the essential steps and tools for Harness Design in Altium Designer 25, from initial setup to final documentation. The article highlights how the unified design environment streamlines the entire process, improving efficiency and project integration.
NEW
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The Future of PCB Design Starts Here
Altium Designer is constantly evolving, with powerful new features and updates on the way. Get an exclusive first look at what’s coming next—visit our Coming Soon page to stay up to date with the latest innovations.
NEW
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Simplify Harness-to-System Connections for Better PCB Design Outcomes
Struggling to keep harness and system designs in sync? In our brand-new article we explore how integrating PCB and harness design workflows can eliminate errors, improve collaboration, and accelerate your development process. Discover a smarter approach to connecting your harness to the system.
Blog
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The Crucial Balance: Cost, Quality, and Availability In Electronic Component Selection
Balancing cost, quality, and availability is key when selecting electronic components. This article explores how to make informed choices that meet design goals while managing supply chain and sourcing challenges.
Blog
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Wire Harness Failures: The Hidden Costs and Real-World Recalls That Could Have Been Prevented
Wire harness failures can lead to significant financial losses, production delays, and safety hazards. This article delves into real-world examples of such failures across industries and illustrates how modern CAD tools can help prevent these costly issues.
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Part Selection Fundamentals: Creating Resilient Component Requirements
Learn how to ensure electronic components meet the demands of harsh environments. This article explores key standards, testing protocols, and design considerations for building resilient systems that perform reliably under extreme conditions.
Blog
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Printed Electronics: The Future of Flexible and Cost-Effective Circuit Design
This article explores the rise of printed electronics as a lightweight, flexible, and cost-effective alternative to traditional PCB design. It highlights key benefits like reduced manufacturing costs, sustainability, and new design possibilities—especially in wearables, medical devices, and automotive applications.
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How to Choose the Best Requirements Management Tool for Electronics Development
Many electronics teams still rely on documents and spreadsheets for requirements management—leading to gaps, errors, and delays. Alexsander Tamari explores better tools to improve traceability, collaboration, and project outcomes.
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New Routing Possibilities with Ultra HDI
Explore how Ultra HDI technology is redefining PCB design. This article breaks down the benefits and manufacturing considerations of Ultra HDI, and how it enables next-level routing density and miniaturization in advanced electronics.
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3D-MID in Focus: Principles, Processes, and Practical Use
This article introduces 3D-MID (Mechatronic Integrated Devices), a technology that integrates circuitry into 3D plastic structures to reduce size, weight, and complexity. It explains the production process, use cases, and benefits of 3D-MID in sectors like automotive, medical, and consumer electronics.
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Eliminate EMI and Signal Integrity Issues in Multi-Board PCB Designs
Ensure signal integrity and minimize EMI in complex electronics. Our new article explains how to address electromagnetic interference and signal integrity challenges in multi-board PCB designs, offering practical strategies and layout considerations for reliable system performance.
Blog
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How to Overcome Power Distribution and Connector Misalignment Challenges in Multi-Board PCB Systems
Connector misalignment can compromise the reliability of power delivery in multi-board systems. This article explores the causes, effects, and prevention strategies for connector misalignment in power distribution, helping you design more robust multi-board PCB systems.
Blog
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Mastering Component Templates in Altium Designer 25
Our new article by Dario Fresu explains how Component Templates in Altium Designer 25 Pro improve design consistency, reduce errors, and streamline collaboration. It highlights practical benefits like standardized naming, faster component creation, and scalability across projects. Includes examples of using templates with Altium 365™ to simplify complex component setup.
Blog
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Wire Harness Design Guide for Development and Manufacturing
Designing a wire harness goes far beyond just connecting components—it’s about ensuring manufacturability, reliability, and compliance. This article walks you through the entire process, from initial design to production, helping you streamline development and avoid common pitfalls.
Blog
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Preparing for Medical Device Cybersecurity Assessments
Explore the key considerations and best practices for conducting cybersecurity assessments in medical device development. This article outlines how to identify potential threats, evaluate risks, and ensure compliance with evolving industry standards.
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