News & Updates
Anytime you place a component in your PCB, it’s almost like you’re gambling. All components have tolerances, and some of these are very precise, but others components can have very wide tolerances on their nominal values. In the event the tolerances on these components become too large, how can you predict how these tolerances will affect your circuits?
If you look in datasheets for most components, you’ll often find a recommended land pattern, usually alongside some mechanical package information and assembly information. This is not always the case with BGA components, especially components with high ball count. There are a few reasons for this that we can speculate: those ball counts might just be too big to put into a single page, or the manufacturer just expects you to know how to create that land pattern.
Molded interconnect devices are essentially plastic molded substrates with traces running along any surface, including at right angles and running vertically. Altium users can use the new 3D Routing extension to design their own component carriers, which can be mounted vertically in a standard assembly process. If you’ve always wanted to vertically mount components or entire circuits, but without the expense of adding a flex section to your design, the new 3D Routing extension with HARTING’s component carrier designs provides a unique solution.
Altium has released version 2.9.0 of the MCAD CoDesigner. This version has the option to exclude small components when transferring from ECAD to MCAD. The arc behavior was improved, and the support for splines in board shape and cutouts was added. With this release, you can now select a specific SOLIDWORKS configuration of a part to use on the board and view the improvements made for Siemens NX.
Altium Designer's world-class PCB design features help users quickly get started with new rigid-flex designs and prepare them for manufacturing. Rigid-flex in Altium Designer starts with designing a manufacturable PCB layer stack complete with via transitions and any calculated impedance requirements. Keep reading to see how Altium Designer supports your flex and rigid-flex designs.
Like any other advanced PCB, success in HDI design comes from designing the right stackup. One common HDI stackup used to support routing into moderate pin count, high-density BGA components is the 2+N+2 PCB layer stack for HDI boards. We’ll explore this stackup more in this article, as well as how it is related to other advanced stackups used in HDI PCBs.
Altium 365 Web Viewer now includes a built-in PDF viewer that allows you to view PDF files in releases without an external PDF viewer application. Keep reading to learn about new key features that make your work easier
There are two basic reasons for designing a flex circuit into your product: to build a compact and efficiently assembled device, or to make the circuit dynamically integrated with the mechanical function of the product. You may, of course, lean on both of these reasons for justifying the use of flex circuits. On this note, let’s look at some rigid-flex PCB applications and design examples to see the issues that spring to mind when designing flex circuits
When you’re done creating a new board, it’s time to send your design data to the manufacturer. Before releasing your designs, you’ll want to make sure that everything is ready and works as intended. In this informative video, we’ll review some of the must-have checks before sending your output data for fabrication.
With Altium 365, you can grant permission to teams or users based on the specific needs of a project. We have expanded Altium 365’s file-sharing setting, giving you more granular control over who can download source files and reshare projects with others
Involving the whole team that will bring a product to completion early on in the development cycle is vital to efficient development. Design reviews with all the relevant parties are critical at each step of the design process, starting with high-level component selection, then through the schematic capture and PCB layout stages.
Ergonomics and convenience are important issues when designing a printed circuit board and the device as a whole. A lot of Altium Designer tools are aimed at solving them. These include Countersink and Counterbore holes, which allow the use of various types of screws in the mounting holes of the board.
The development of electronic devices always involves the release of many different types of files. And these files are not static - they change as the project progresses. When filling a project with data, a user creates new files, modifies outdated files that have become irrelevant. Managing project data is a separate task, especially for large developments where several participants with different specializations are involved in the process.
High-speed PCBs often require tuning groups of tracks, both single and differential. Altium Designer includes powerful tools that allow you to solve such tasks quickly and with high quality. Study this document and achieve the desired result even faster.
There is one confusion related to impedance matching that comes up again and again, and it appears to be a fundamental confusion between reflection and power delivery. This leads to an apparent contradiction that arises when we try to generalize power delivery to wave reflection, despite the fact that the two were not meant to be related.
Routing is one of the most time-consuming stages of PCB design. Altium Designer has a large set of tools that allow you to do it as accurately and quickly as possible. This document will help you to learn how to manage your routing effectively and use it to its fullest extent.
RF systems operate with specific impedance values across entire interconnects, including on PCBs. Not all RF components are packaged in integrated circuits with defined impedances, so impedance matching circuits and line sections are needed to ensure signal transmission between different sections of an interconnect. One of these impedance matching techniques is the quarter-wave impedance transformer, which can be implemented as a printed trace with specific impedance.
We are happy to announce that the Altium Designer 22.10 update is now available. Altium Designer 22.10 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!
A staff member at a PCB manufacturer once explained to me that they thought we were having an issue with a package warping. Unfortunately, component warping can occur both in a PCB and in components. In this article, we'll give an overview of warpage in a PCB, specifically in the circuit board and in the components.
If you're designing a wireless IoT device, and you know how to calculate the link budget, you can reasonably estimate whether your signal will reach its destination and be read by the receiver. To calculate the link budget, the designer needs to know something about all other sources of gain and loss in the system. Once link budget is determined, the designer can judge whether some modification is needed in their RF signal chain.
SMD components require precisely sized pads for soldering during assembly. The designer is responsible for ensuring pad sizes are correct, either by calculating them and comparing with footprint data, looking through datasheets, or by memorizing SMD pad size standards. If you have a component and you don't have access to the footprint, and you decide to biuld the footprint yourself, what resources are available to ensure you have the correct pad size?
Before we get too deep into this article, I’ll give you the simple answer. You probably can’t fix warping in your PCB after it’s already been fabricated. You can prevent an unwarped board from becoming warped during assembly, but only as long as materials were selected properly and the board is put into reflow correctly. We’ll run over some of these points in this article, and I’ll examine some points that might help you recover a warped board.
The eye diagram is a useful measurement or simulation as part of channel compliance. The measurement shows many different factors that can affect signal behavior simultaneously, ultimately allowing for qualification of errors and losses in a channel. In this article, I’ll run over some of the fundamental measurements that you could manually extract from an eye diagram and how they reveal some strategies for improving channel designs.
To readers who have been working in the PCB industry for most of your career, you have probably seen a very diverse group of professionals with varied skill sets and backgrounds. Designers might get started as engineers or as technicians, and some designers learn how to create beautiful PCB layouts in university. No matter how you got into PCB design, there are some important skills to know that will take you a long way towards advancing your career.
When starting out with PCB design, it’s common to treat the process as simply ‘connecting the dots’: as long as connections are made, it’s not particularly important how these connections are made. Having reviewed quite a number of PCBs of other PCB design engineers over the last few years, there are common, unfortunately erroneous, occurrences between a lot of them. This article aims to illustrate the top five beginner PCB design mistakes and what we can do to avoid making them. Let’s get started!
As the PCB design community embraces the benefits of this new printed circuit board fabrication technique, there are of course many questions to be answered. Today’s blog will address some of the most commonly asked questions related to circuit layer stack up as people are introduced to this new technology.