News & Updates
Do length-tuning structures create an impedance discontinuity? The answer is an unequivocal “yes”, but it might not matter in your design depending on several factors. Applying a length-tuning structure is equivalent to changing the distance between the traces while meandering. Therefore, you will have a change in the odd-mode impedance of a single trace. The question then becomes: does this deviation in trace impedance in a length tuning structure matter?
The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators. To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer counts, multiple levels of stacked micro vias and increased lamination cycles.
Take a look at the inside of some integrated circuit packages, and you’ll find a number of wires bonded to the semiconductor die and the pads at the edge of the component's package. As a signal traverses makes its way along an interconnect and into a destination circuit, signals need to travel across these bond wires and pads before they are interpreted as a logic state. As you look around the edge of an IC, these bond wires can have different lengths, and they incur different levels of delay and contribute to total jitter.
Once you’ve run out of room on your 4-layer PCB, it’s time to graduate to a 6-layer board. The additional layer can give you room for more signals, an additional plane pair, or a mix of conductors. How you use these extra layers is less important than how you arrange them in the PCB stackup, as well as how you route on a 6-layer PCB. If you’ve never used a 6-layer board before, or you’ve had EMI troubles with this stackup that are difficult to solve, keep reading to see some 6-layer PCB design guidelines and best practices.
There are many aspects to designing a PCB. One of the larger aspects has to do with managing your components. We all need components for our designs, but are those components in our library and designs up-to-date or even purchasable? These questions need to be answered before we can safely use them. If not, we could just be wasting our time designing with invalid components. Altium Designer® has several tools to help you manage the components in your libraries and designs.
We are happy to announce that the Altium Designer 22.5 update is now available. Altium Designer 22.5 continues to focus on improving the user experience, as well as performance and stability of the software, based on feedback from our users. Check out the key new features in the What's New section on the left side of this window!
PCB stackups often incorporate slightly dissimilar materials that could pose a reliability problem. Hybrid PCBs are one case where the PCB stackup will include different materials, typically a standard FR4 laminate and a PTFE laminate for RF PCBs. Designers who want to take the lead on material selection when designing their hybrid stackups should consider these factors that affect reliability. As with any PCB stackup, make sure you get your fabricator involved in the manufacturing process early to ensure reliability problems do not arise during production.
In a previous article about circuit simulation and reliability, I looked at how Monte Carlo analysis is commonly used to evaluate circuits that are subject to random variations in component values. Sensitivity analysis is a bit different and it tells you how the operating characteristics of your circuit change in a specific direction. Compared to a Monte Carlo simulation, sensitivity analysis gives you a convenient way to predict exactly how the operating characteristics will change if you were to deliberately increase or decrease the value of a component.
Field Programmable Gate Arrays, or FPGAs, have become ubiquitous amongst high-speed, real-time digital systems. The speed at which FPGAs operate continues to increase at a dizzying pace but their adoption into Continuous Integration pipelines seems not to trail as closely. In this article we will review the concept of CI pipelines, their application to FPGAs, and look at examples on how to set this up.
Conflicts can occur when multiple people work on the same project simultaneously. The user might not realize that they are not looking at the latest version of the documentation, leading to problems later. To address this issue, Altium features an intuitive graphical user interface that allows you to examine conflicts quickly and carefully
There are still a number of designers - perhaps most of them - who have never toured a PCB fabrication facility. They are also unaware of the various steps that occur during the fabrication process. The purpose of this article is to describe those steps and what transpires in each of them. Part 1 of this article focuses on inner layer processing and the steps that are done prior the lamination process.
Working with local libraries seems like a simple solution, but we often don’t take into account the added time spent maintaining libraries and sharing them between team members. This webinar showcases the advantages of component storage in Аltium 365 to resolve the issues of local libraries and component management.
Every piece of electronic equipment starts with a great idea. Transforming great ideas into real, physical products takes a team of talented individuals and multiple companies coming together to make everything from the internal components to the external hardware. Paul Payen de la Garanderie, Founder and Owner of AW Audio, an engineering services company based in France, understands these challenges very well. With an extensive background in the Audio/Visual industry, Paul has had to work with multiple companies over the years, from small start-ups to celebrated AV firms.
At this time, at least a quarter of the world’s population is under quarantine, with workers unable to go to offices or factories, leading to fundamental disabling of the world economy. The electronics industry is suffering greatly as well, dealing with a supply shock from factories shutting down in Southeast Asia, to demand-side shocks from Western markets literally shutting down. Now it is the electrical engineers taking the lead with additive PCB manufacturing.
Altium 365 provides a secure cloud platform to store all of your design files in a single place so you can share them with anyone and access them from anywhere. This webinar discusses the advantages of placing, storing, and working with projects in Altium 365.
I just finalized my first PCB design using Altium Designer 20. At the same time, I tested some new AD20 features, and in this article, I’ll share my thoughts about new layout design features which made the biggest impression for me: sliding, and any-angle routing.
Anyone who has taken apart an old cell phone or designs IoT devices knows multiple communication capabilities are present in these designs, each requiring different antennas. The RF designer should already take precautions for interconnect isolation, but antenna isolation is just as important when modeling and designing wireless systems.
High voltage/high current designs carry safety requirements which need to be met by designers. Similarly, high speed designs need to have suppressed crosstalk in order to ensure signal integrity. The key design aspects that relate to both areas are your PCB trace clearance and pad clearance values. These design choices are critical for balancing safety, noise suppression, and manufacturability.
In this article, we’ll discuss the key design features to implement, and steps to take prior to fabrication that will help prevent some DFM process pain.
With the new layer stack manager in Altium Designer®, you can now include copper foil roughness factors directly in your impedance calculator. This is quite easy to do in the layer stack manager, but it begs the question: what exactly is the copper roughness factor? Which value should be used for your interconnects?
After you capture your schematic as an initial layout and create an initial component arrangement, it’s time to define your routing constraints. Doing this early will allow your DRC engine to spot rules violations before you finish your layout. Likewise, you’ll be able to modify the default rule set to meet your layout requirements. Here are the important routing constraints you’ll need to check before you start routing your board.
Learn how to place components from the MCAD side and synchronize them with Altium Designer ECAD models, designators, and sourcing data to simplify your design process.
Some manufacturers have very convenient PCB manufacturing cost estimation calculators you can use, but the real costs depend on a number of factors. If you’re an entrepreneur and you’re producing your own boards, or you are managing manufacturing, testing, and delivery for a new project, it’s your job to help clients understand the primary cost drivers for new boards. Here’s how you can get an estimate of your fabrication costs, both for local and overseas manufacturers.
Selecting a connector is as much an art as it is a science. The artistic side is all about aesthetics and satisfying clearances, while the scientific side is all about signal integrity. For PCB mountable connectors, you’ll need to choose between surface-mounted or through-hole connectors, and you’ll need to consider how each type affects signal integrity in your application. Here’s what you need to think about beyond the standard connector specifications.
Trace and via current-carrying capacity are legitimate design points to focus on when designing a new board that will carry high current. The goal is to keep conductor temperatures below some appropriate limit, which then helps keep components on the board cool.