News & Updates
When designing high power circuits (usually very high voltage and/or current), you’ll need to create a regulator from scratch and place it in your PCB layout. It's also the case that you may want to model a real component using discretes in a simulation in order to qualify the system's expected operating regime. As part of buck converter design, you can easily run a buck converter simulation directly in Altium Designer’s schematic editor. Here’s how you can access these features in the newest version of Altium Designer.
Just as you get used to PCIe 5.0, they decide to release another standard! The newest iteration of PCIe is Gen6, or PCIe 6.0. PCIe 6.0 brings a doubling of channel bandwidth through introduction of PAM-4 as the signaling method in high-speed differential channels. This signaling method is a first for PCIe, and it’s an important enabler of the doubled data rate we see in the current standard. In this article, I’ll run over the important points in the standard and what PCB designers can expect when designing these channels.
One of the common implementations of SPI and I2C in a PCB layout is as a protocol for reading and writing to an external Flash memory. Flash chips are a very common component in embedded systems and can offer high capacities of non-volatile memory up to Gb values. When choosing a memory chip, you'll want to match the application requirements and functionality with the bus speed you need for read and write operations in your memory chip. There is also the matter of the type of Flash memory you'll need to access (NOR vs. NAND).
Being able to design a board in your ECAD environment doesn’t mean that it is manufacturable in real life. You have to make sure your CAD representation won’t have any problems in the real world by taking some precautions. For example, there are certain areas that need to be free of components and have specified clearances like your board edge. This webinar will help you get acquainted with the creation and modification of your board shape so that you can ensure manufacturability.
There is no SPI trace impedance requirement? The reality is that SPI lines only start to need impedance control when the length of the interconnect becomes very long. And because there is no specific impedance requirement in the bus, you have some freedom in channel design and termination. So what exactly qualifies as “very long” and when is some termination method needed? We’ll break it down in this article.
During this year's AltiumLive CONNECT event, I recall receiving an interesting question about the skin effect and the distribution of current due to the presence of ground in coplanar transmission lines. In this article, we'll look at the electric field around a transmission line carrying a signal, and how this might be impacted by the skin effect.
When you get your PCBA back from an assembler, you’ll notice the packaging materials used to pack and ship the PCBA. Those materials are specific to electronics, and if you build products on behalf of clients, it’s important to know the packaging materials used for packing and shipping electronics. In this article I’ll show the main set of materials and equipment used to package electronics assemblies.
Once you've got your PCB layout finished and you're ready to start preparing for manufacturing, one of the critical steps is to create PCB Gerber files. When you're ready to create your Gerber files, you need the right set of CAM processor tools that can take data from your PCB layout. In this article, we'll guide you through this process of how to make PCB Gerber files and show some example tasks you might need to perform to generate them.
There are many aspects to designing a PCB. One of the larger aspects has to do with managing your components. We all need components for our designs, but are those components in our library and designs up-to-date or even purchasable? These questions need to be answered before we can safely use them. Altium Designer® has several tools to help you manage the components in your libraries and designs.
One of the major factors impacting reliability of a PCBA is the use of teardrops on traces in the PCB. Like many aspects of reliability, the considerations also span into the signal integrity domain, particularly as more high-reliability products require greater data handling capabilities and run at higher speeds. In this article, I’ll break down the issues present in teardrop usage on differential pairs and how these may affect impedance.
The next stage in the evolution of mobile telephony is here with the roll-out of 5G. The designer looking to incorporate functionality to handle 5G signals into their circuits will face some challenging issues. So, what’s so special about 5G?
The maximum PCB trace length you can place between two components depends on multiple factors, such as signaling protocol, component specification, losses in PCB laminate, and skew. With all this in mind, let’s look at where losses accumulate along the channel.
For low power devices, we generally see two types of power regulators: a low dropout regulator (LDO) or a switching regulator. You can mix and match these at different points along your power bus, but there’s still the matter of choosing whether to use an LDO vs. a switching regulator in your designs. If you’ve ever wondered how these decisions are made and when to use each type of regulator, just know that there is more to this decision than simply looking at the input/output voltage/current.
PCB fabrication is an extremely complex technological topic that deserves recognition as the most fundamental part of PCB engineering. Unless connectors, conductive adhesive, wire-bonding, or zebra-tape are used, in the modern electronics industry it’s always necessary to use some kind of flux during the soldering process to create an electric connection. In this article, we’ll discuss fluxes — what they are, what they are made of (yes, there is going to be a lot of chemistry, don’t be scared), how they should be used, and in what direction the industry is going.
As anyone who designs and builds electronic devices knows, the device will generate heat when it’s switched on. Wherever current flows through an impedance, energy losses will manifest themselves as heat. Integrated circuit packaging is getting smaller to meet the trend for more compact devices but at the cost of poorer thermal properties. This article describes the basic thermal management approaches to consider in your next designs.
We continue to explore the magic of energy conversion in a PWM transducer. Why is it magic? Theoretically, in a PWM transducer this happens without losses, isn't that magic? A PWM transducer, like a tailor with scissors, cuts the “fabric of energy” into pieces, and then, like a sewing machine, stitches the pieces of energy into a dress - DC Magnitude. What is a constant component and how can we get it? Let's explore!
There are different techniques in the world of technology to achieve various goals, both final and intermediate. Some techniques are so successful that they are commonly used with high efficiency. Electronics is no exception. The greatest example is the use of Pulse Width Modulation (PWM) signals (energy), which is applied in any modern electronic device. To apply PWM effectively, it is necessary to understand the engineering difficulties that engineers faced in the past, and the thoughts and ideas that subsequently were combined into effective, complete PWM power solutions.
If you speak with a bunch of design engineers, you might quickly form the opinion that the electrolytic capacitor has a particularly dubious reputation. A faulty electrolyte mix used in these types of capacitors led to premature device failures, and quite often, a “bit of a mess” was made to the PCBs on which they were soldered. However, despite the problem of the capacitor plague, this article is focusing on helping the designer understand how to get many more years of useful life from an electrolytic capacitor.
A schematic drawing will not only tell your PCB design software what needs to connect where, but it also communicates the purpose of a circuit to other people. It’s easy to create a schematic, but it can be harder to make a helpful schematic that can be quickly and easily read and comprehended by the reader. In this guide, based on years of industry experience, we will show you how to improve your schematic layout so that your designs are elegant and readable.
Suppose your job involves rapidly iterating designs or creating a wide variety of products for clients. In that case, there are some essential tools available that can save you a tremendous amount of time, bringing high engineering risk devices to completion successfully. Whether you’re working on internal projects or developing high mix devices for clients as a consulting or freelance firm, these indispensable tools will help you ship a higher quality product in less time.
Even though today’s cloud platforms are immaculately secure and they allow a range of files to be easily shared, there are times where you should limit the data you’re sharing to only the critical files required. For PCB designers, this means either sharing entire design projects or sharing individual files with your manufacturer, customers, contractors, or collaborators. If you want to eliminate liabilities and keep your team’s design data secure, consider these best practices for sharing PCB design data with Altium 365.
Best component companies will release reference designs for their new and legacy products to show designers an example application for a component. If the reference design is good enough and it very nicely illustrates how to quickly engineer around a few main components, I’m likely to use them in the design and the component maker has just earned my business. If you’re a newer designer and you’re wondering whether reference designs are right for your next project, follow these best practices so that you don’t make any mistakes with your reference design.
When we deal with “abstract” aspects of electromagnetic fields and how they function, it can be easy to get lost in the weeds regarding them. The first part of this article will address an important aspect of transmission line fundamentals, namely how electromagnetic fields and waves propagate on a transmission line. This article’s end goal is to create a core understanding of these concepts so that when it comes time to design a PDS, the proper design methodologies are followed and a properly working PDS is achieved appropriately, the first time and every time.
Via stubs are sometimes viewed as an annoyance, especially when you only need to make a transition between adjacent layers. For low speed, less-dense boards with low layer count, via stubs are an afterthought, or they may not receive consideration at all. For faster edge rates/higher frequencies, the conventional wisdom is to remove all via stubs. The question is: what exactly counts as “high frequency,” and how do you figure out the relevant length?
Unlike the clumsy human finger, a thermal camera can detect minute temperature differences across its view. This allows you to rapidly identify any components that are consuming current. Any parts or areas of your board that draw current will also generate heat that can easily be picked up by a thermal camera.
I want to share a little secret with you in this article: Assembling SMT prototypes boards is not only easy, but it requires very little equipment. Using just a stencil, I can easily hand prototype down to 0.3 mm pitch ICs, and 0201 (imperial) sized passive components. If you’re currently hand assembling boards with a soldering station, you need to stop this immediately and start using a stencil instead!